{"id":"https://openalex.org/W2053406284","doi":"https://doi.org/10.1109/3dic.2013.6702391","title":"Analysis of glass interposer PDN and proposal of PDN resonance suppression methods","display_name":"Analysis of glass interposer PDN and proposal of PDN resonance suppression methods","publication_year":2013,"publication_date":"2013-10-01","ids":{"openalex":"https://openalex.org/W2053406284","doi":"https://doi.org/10.1109/3dic.2013.6702391","mag":"2053406284"},"language":"en","primary_location":{"id":"doi:10.1109/3dic.2013.6702391","is_oa":false,"landing_page_url":"https://doi.org/10.1109/3dic.2013.6702391","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2013 IEEE International 3D Systems Integration Conference (3DIC)","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5074429007","display_name":"Jonghyun Cho","orcid":"https://orcid.org/0000-0003-3277-1072"},"institutions":[{"id":"https://openalex.org/I157485424","display_name":"Korea Advanced Institute of Science and Technology","ror":"https://ror.org/05apxxy63","country_code":"KR","type":"education","lineage":["https://openalex.org/I157485424"]}],"countries":["KR"],"is_corresponding":true,"raw_author_name":"Jonghyun Cho","raw_affiliation_strings":["Department of Electrical Engineering, KAIST, Daejeon, South Korea","Department of Electrical Engineering; KAIST; Daejeon South Korea"],"affiliations":[{"raw_affiliation_string":"Department of Electrical Engineering, KAIST, Daejeon, South Korea","institution_ids":["https://openalex.org/I157485424"]},{"raw_affiliation_string":"Department of Electrical Engineering; KAIST; Daejeon South Korea","institution_ids":["https://openalex.org/I157485424"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5100696056","display_name":"Youngwoo Kim","orcid":"https://orcid.org/0000-0003-0096-2296"},"institutions":[{"id":"https://openalex.org/I157485424","display_name":"Korea Advanced Institute of Science and Technology","ror":"https://ror.org/05apxxy63","country_code":"KR","type":"education","lineage":["https://openalex.org/I157485424"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Youngwoo Kim","raw_affiliation_strings":["Department of Electrical Engineering, KAIST, Daejeon, South Korea","Department of Electrical Engineering; KAIST; Daejeon South Korea"],"affiliations":[{"raw_affiliation_string":"Department of Electrical Engineering, KAIST, Daejeon, South Korea","institution_ids":["https://openalex.org/I157485424"]},{"raw_affiliation_string":"Department of Electrical Engineering; KAIST; Daejeon South Korea","institution_ids":["https://openalex.org/I157485424"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5046623632","display_name":"Joungho Kim","orcid":"https://orcid.org/0000-0003-1376-0781"},"institutions":[{"id":"https://openalex.org/I157485424","display_name":"Korea Advanced Institute of Science and Technology","ror":"https://ror.org/05apxxy63","country_code":"KR","type":"education","lineage":["https://openalex.org/I157485424"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Joungho Kim","raw_affiliation_strings":["Department of Electrical Engineering, KAIST, Daejeon, South Korea","Department of Electrical Engineering; KAIST; Daejeon South Korea"],"affiliations":[{"raw_affiliation_string":"Department of Electrical Engineering, KAIST, Daejeon, South Korea","institution_ids":["https://openalex.org/I157485424"]},{"raw_affiliation_string":"Department of Electrical Engineering; KAIST; Daejeon South Korea","institution_ids":["https://openalex.org/I157485424"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5103543612","display_name":"Venky Sundaram","orcid":null},"institutions":[{"id":"https://openalex.org/I130701444","display_name":"Georgia Institute of Technology","ror":"https://ror.org/01zkghx44","country_code":"US","type":"education","lineage":["https://openalex.org/I130701444"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Venky Sundaram","raw_affiliation_strings":["3D Systems Packaging Research Center, Georgia Institute of Technology, Atlanta, GA, USA","3D Systems Packaging Research Center, Georgia Institute of Technology, Atlanta, GA 30332, USA"],"affiliations":[{"raw_affiliation_string":"3D Systems Packaging Research Center, Georgia Institute of Technology, Atlanta, GA, USA","institution_ids":["https://openalex.org/I130701444"]},{"raw_affiliation_string":"3D Systems Packaging Research Center, Georgia Institute of Technology, Atlanta, GA 30332, USA","institution_ids":["https://openalex.org/I130701444"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5045655197","display_name":"Rao Tummala","orcid":"https://orcid.org/0000-0003-2284-7600"},"institutions":[{"id":"https://openalex.org/I130701444","display_name":"Georgia Institute of Technology","ror":"https://ror.org/01zkghx44","country_code":"US","type":"education","lineage":["https://openalex.org/I130701444"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Rao Tummala","raw_affiliation_strings":["3D Systems Packaging Research Center, Georgia Institute of Technology, Atlanta, GA, USA","3D Systems Packaging Research Center, Georgia Institute of Technology, Atlanta, GA 30332, USA"],"affiliations":[{"raw_affiliation_string":"3D Systems Packaging Research Center, Georgia Institute of Technology, Atlanta, GA, USA","institution_ids":["https://openalex.org/I130701444"]},{"raw_affiliation_string":"3D Systems Packaging Research Center, Georgia Institute of Technology, Atlanta, GA 30332, USA","institution_ids":["https://openalex.org/I130701444"]}]}],"institutions":[],"countries_distinct_count":2,"institutions_distinct_count":5,"corresponding_author_ids":["https://openalex.org/A5074429007"],"corresponding_institution_ids":["https://openalex.org/I157485424"],"apc_list":null,"apc_paid":null,"fwci":1.4187,"has_fulltext":false,"cited_by_count":8,"citation_normalized_percentile":{"value":0.83688333,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":97},"biblio":{"volume":null,"issue":null,"first_page":"1","last_page":"5"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11444","display_name":"Electromagnetic Compatibility and Noise Suppression","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11444","display_name":"Electromagnetic Compatibility and Noise Suppression","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.9994000196456909,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12495","display_name":"Electrostatic Discharge in Electronics","score":0.9991000294685364,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/interposer","display_name":"Interposer","score":0.9769896268844604},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.6538058519363403},{"id":"https://openalex.org/keywords/decoupling","display_name":"Decoupling (probability)","score":0.5987675189971924},{"id":"https://openalex.org/keywords/decoupling-capacitor","display_name":"Decoupling capacitor","score":0.5611032247543335},{"id":"https://openalex.org/keywords/silicon","display_name":"Silicon","score":0.5417149662971497},{"id":"https://openalex.org/keywords/substrate","display_name":"Substrate (aquarium)","score":0.4519372880458832},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.4357340931892395},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.42680424451828003},{"id":"https://openalex.org/keywords/capacitor","display_name":"Capacitor","score":0.3278164267539978},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.3066166639328003},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.14826098084449768},{"id":"https://openalex.org/keywords/nanotechnology","display_name":"Nanotechnology","score":0.10954052209854126},{"id":"https://openalex.org/keywords/etching","display_name":"Etching (microfabrication)","score":0.08091837167739868},{"id":"https://openalex.org/keywords/voltage","display_name":"Voltage","score":0.05602860450744629}],"concepts":[{"id":"https://openalex.org/C158802814","wikidata":"https://www.wikidata.org/wiki/Q6056418","display_name":"Interposer","level":4,"score":0.9769896268844604},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.6538058519363403},{"id":"https://openalex.org/C205606062","wikidata":"https://www.wikidata.org/wiki/Q5249645","display_name":"Decoupling (probability)","level":2,"score":0.5987675189971924},{"id":"https://openalex.org/C35196352","wikidata":"https://www.wikidata.org/wiki/Q1532649","display_name":"Decoupling capacitor","level":4,"score":0.5611032247543335},{"id":"https://openalex.org/C544956773","wikidata":"https://www.wikidata.org/wiki/Q670","display_name":"Silicon","level":2,"score":0.5417149662971497},{"id":"https://openalex.org/C2777289219","wikidata":"https://www.wikidata.org/wiki/Q7632154","display_name":"Substrate (aquarium)","level":2,"score":0.4519372880458832},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.4357340931892395},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.42680424451828003},{"id":"https://openalex.org/C52192207","wikidata":"https://www.wikidata.org/wiki/Q5322","display_name":"Capacitor","level":3,"score":0.3278164267539978},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.3066166639328003},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.14826098084449768},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.10954052209854126},{"id":"https://openalex.org/C100460472","wikidata":"https://www.wikidata.org/wiki/Q2368605","display_name":"Etching (microfabrication)","level":3,"score":0.08091837167739868},{"id":"https://openalex.org/C165801399","wikidata":"https://www.wikidata.org/wiki/Q25428","display_name":"Voltage","level":2,"score":0.05602860450744629},{"id":"https://openalex.org/C111368507","wikidata":"https://www.wikidata.org/wiki/Q43518","display_name":"Oceanography","level":1,"score":0.0},{"id":"https://openalex.org/C133731056","wikidata":"https://www.wikidata.org/wiki/Q4917288","display_name":"Control engineering","level":1,"score":0.0},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.0},{"id":"https://openalex.org/C127313418","wikidata":"https://www.wikidata.org/wiki/Q1069","display_name":"Geology","level":0,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/3dic.2013.6702391","is_oa":false,"landing_page_url":"https://doi.org/10.1109/3dic.2013.6702391","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2013 IEEE International 3D Systems Integration Conference (3DIC)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":4,"referenced_works":["https://openalex.org/W1963484171","https://openalex.org/W2029038355","https://openalex.org/W2113111544","https://openalex.org/W2142645443"],"related_works":["https://openalex.org/W2591634623","https://openalex.org/W2115156230","https://openalex.org/W2972236120","https://openalex.org/W2171641446","https://openalex.org/W2730834029","https://openalex.org/W1600789903","https://openalex.org/W1849148950","https://openalex.org/W2117971341","https://openalex.org/W1512026108","https://openalex.org/W1489299449"],"abstract_inverted_index":{"Electrical":[0],"characteristics":[1],"of":[2,14,18,93],"glass":[3,19,25,48,85,94],"interposer":[4,26,49,86],"PDN":[5,42,87],"is":[6,67],"analyzed":[7],"and":[8,73],"compared":[9,21],"with":[10],"silicon":[11,23,32,45],"interposer.":[12,33,46],"Because":[13],"the":[15,61,84],"low":[16],"loss":[17,30,59],"substrate":[20],"to":[22,70],"substrate,":[24],"has":[27,52],"much":[28],"smaller":[29],"than":[31],"It":[34,79],"helps":[35],"low-loss":[36],"signaling,":[37],"but":[38],"it":[39,56],"generates":[40],"sharp":[41],"resonance":[43,62,97],"unlike":[44],"If":[47],"signal":[50,71],"line":[51,72],"through-glass":[53],"via":[54],"(TGV),":[55],"experiences":[57],"high":[58],"at":[60,76],"frequency.":[63,78],"Also":[64],"P/G":[65],"noise":[66],"easily":[68],"coupled":[69],"vice":[74],"versa":[75],"that":[77],"would":[80],"be":[81],"problems":[82,92],"for":[83],"design.":[88],"To":[89],"overcome":[90],"these":[91],"interposer,":[95],"several":[96],"suppression":[98],"methods":[99],"are":[100],"proposed":[101],"such":[102],"as":[103],"decoupling":[104],"capacitor":[105],"scheme,":[106],"ground":[107],"via.":[108]},"counts_by_year":[{"year":2020,"cited_by_count":1},{"year":2019,"cited_by_count":1},{"year":2015,"cited_by_count":3},{"year":2014,"cited_by_count":3}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}