{"id":"https://openalex.org/W2137654743","doi":"https://doi.org/10.1109/3dic.2013.6702386","title":"Pulsed laser annealing: A scalable and practical technology for monolithic 3D IC","display_name":"Pulsed laser annealing: A scalable and practical technology for monolithic 3D IC","publication_year":2013,"publication_date":"2013-10-01","ids":{"openalex":"https://openalex.org/W2137654743","doi":"https://doi.org/10.1109/3dic.2013.6702386","mag":"2137654743"},"language":"en","primary_location":{"id":"doi:10.1109/3dic.2013.6702386","is_oa":false,"landing_page_url":"https://doi.org/10.1109/3dic.2013.6702386","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2013 IEEE International 3D Systems Integration Conference (3DIC)","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5048595299","display_name":"Bipin Rajendran","orcid":"https://orcid.org/0000-0002-2960-6909"},"institutions":[{"id":"https://openalex.org/I162827531","display_name":"Indian Institute of Technology Bombay","ror":"https://ror.org/02qyf5152","country_code":"IN","type":"education","lineage":["https://openalex.org/I162827531"]}],"countries":["IN"],"is_corresponding":true,"raw_author_name":"Bipin Rajendran","raw_affiliation_strings":["Dept. of Electrical Engg, IIT, Bombay, India","Dept. of Electr. Eng., IIT Bombay, Mumbai, India"],"affiliations":[{"raw_affiliation_string":"Dept. of Electrical Engg, IIT, Bombay, India","institution_ids":["https://openalex.org/I162827531"]},{"raw_affiliation_string":"Dept. of Electr. Eng., IIT Bombay, Mumbai, India","institution_ids":["https://openalex.org/I162827531"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5103904871","display_name":"Albert K. Henning","orcid":null},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Albert K. Henning","raw_affiliation_strings":["MonolithIC 3D Inc, San Jose, CA","MonolithIC 3D Inc., San Jose, CA, USA"],"affiliations":[{"raw_affiliation_string":"MonolithIC 3D Inc, San Jose, CA","institution_ids":[]},{"raw_affiliation_string":"MonolithIC 3D Inc., San Jose, CA, USA","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5073441764","display_name":"B. Cronquist","orcid":null},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Brian Cronquist","raw_affiliation_strings":["MonolithIC 3D Inc, San Jose, CA","MonolithIC 3D Inc., San Jose, CA, USA"],"affiliations":[{"raw_affiliation_string":"MonolithIC 3D Inc, San Jose, CA","institution_ids":[]},{"raw_affiliation_string":"MonolithIC 3D Inc., San Jose, CA, USA","institution_ids":[]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5050510761","display_name":"Zvi Or-Bach","orcid":null},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Zvi Or-Bach","raw_affiliation_strings":["MonolithIC 3D Inc, San Jose, CA","MonolithIC 3D Inc., San Jose, CA, USA"],"affiliations":[{"raw_affiliation_string":"MonolithIC 3D Inc, San Jose, CA","institution_ids":[]},{"raw_affiliation_string":"MonolithIC 3D Inc., San Jose, CA, USA","institution_ids":[]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":4,"corresponding_author_ids":["https://openalex.org/A5048595299"],"corresponding_institution_ids":["https://openalex.org/I162827531"],"apc_list":null,"apc_paid":null,"fwci":0.2364,"has_fulltext":false,"cited_by_count":12,"citation_normalized_percentile":{"value":0.63171982,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":98},"biblio":{"volume":"14","issue":null,"first_page":"1","last_page":"5"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10472","display_name":"Semiconductor materials and devices","score":0.9995999932289124,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10623","display_name":"Thin-Film Transistor Technologies","score":0.9994000196456909,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/scalability","display_name":"Scalability","score":0.6836202144622803},{"id":"https://openalex.org/keywords/interconnection","display_name":"Interconnection","score":0.6606356501579285},{"id":"https://openalex.org/keywords/lithography","display_name":"Lithography","score":0.5918448567390442},{"id":"https://openalex.org/keywords/three-dimensional-integrated-circuit","display_name":"Three-dimensional integrated circuit","score":0.5691750645637512},{"id":"https://openalex.org/keywords/chip","display_name":"Chip","score":0.5444480180740356},{"id":"https://openalex.org/keywords/transistor","display_name":"Transistor","score":0.5383148789405823},{"id":"https://openalex.org/keywords/annealing","display_name":"Annealing (glass)","score":0.5232952237129211},{"id":"https://openalex.org/keywords/laser","display_name":"Laser","score":0.5077227354049683},{"id":"https://openalex.org/keywords/scaling","display_name":"Scaling","score":0.5035502314567566},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.48493245244026184},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.4655765891075134},{"id":"https://openalex.org/keywords/integrated-circuit-design","display_name":"Integrated circuit design","score":0.4593719244003296},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.4428235590457916},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.43398240208625793},{"id":"https://openalex.org/keywords/integrated-circuit","display_name":"Integrated circuit","score":0.37462669610977173},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.26252394914627075},{"id":"https://openalex.org/keywords/embedded-system","display_name":"Embedded system","score":0.2318093180656433},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.21973997354507446},{"id":"https://openalex.org/keywords/telecommunications","display_name":"Telecommunications","score":0.10546085238456726},{"id":"https://openalex.org/keywords/optics","display_name":"Optics","score":0.09569194912910461},{"id":"https://openalex.org/keywords/physics","display_name":"Physics","score":0.07697153091430664}],"concepts":[{"id":"https://openalex.org/C48044578","wikidata":"https://www.wikidata.org/wiki/Q727490","display_name":"Scalability","level":2,"score":0.6836202144622803},{"id":"https://openalex.org/C123745756","wikidata":"https://www.wikidata.org/wiki/Q1665949","display_name":"Interconnection","level":2,"score":0.6606356501579285},{"id":"https://openalex.org/C204223013","wikidata":"https://www.wikidata.org/wiki/Q133036","display_name":"Lithography","level":2,"score":0.5918448567390442},{"id":"https://openalex.org/C59088047","wikidata":"https://www.wikidata.org/wiki/Q229370","display_name":"Three-dimensional integrated circuit","level":3,"score":0.5691750645637512},{"id":"https://openalex.org/C165005293","wikidata":"https://www.wikidata.org/wiki/Q1074500","display_name":"Chip","level":2,"score":0.5444480180740356},{"id":"https://openalex.org/C172385210","wikidata":"https://www.wikidata.org/wiki/Q5339","display_name":"Transistor","level":3,"score":0.5383148789405823},{"id":"https://openalex.org/C2777855556","wikidata":"https://www.wikidata.org/wiki/Q4339544","display_name":"Annealing (glass)","level":2,"score":0.5232952237129211},{"id":"https://openalex.org/C520434653","wikidata":"https://www.wikidata.org/wiki/Q38867","display_name":"Laser","level":2,"score":0.5077227354049683},{"id":"https://openalex.org/C99844830","wikidata":"https://www.wikidata.org/wiki/Q102441924","display_name":"Scaling","level":2,"score":0.5035502314567566},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.48493245244026184},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.4655765891075134},{"id":"https://openalex.org/C74524168","wikidata":"https://www.wikidata.org/wiki/Q1074539","display_name":"Integrated circuit design","level":2,"score":0.4593719244003296},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.4428235590457916},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.43398240208625793},{"id":"https://openalex.org/C530198007","wikidata":"https://www.wikidata.org/wiki/Q80831","display_name":"Integrated circuit","level":2,"score":0.37462669610977173},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.26252394914627075},{"id":"https://openalex.org/C149635348","wikidata":"https://www.wikidata.org/wiki/Q193040","display_name":"Embedded system","level":1,"score":0.2318093180656433},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.21973997354507446},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.10546085238456726},{"id":"https://openalex.org/C120665830","wikidata":"https://www.wikidata.org/wiki/Q14620","display_name":"Optics","level":1,"score":0.09569194912910461},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.07697153091430664},{"id":"https://openalex.org/C165801399","wikidata":"https://www.wikidata.org/wiki/Q25428","display_name":"Voltage","level":2,"score":0.0},{"id":"https://openalex.org/C33923547","wikidata":"https://www.wikidata.org/wiki/Q395","display_name":"Mathematics","level":0,"score":0.0},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.0},{"id":"https://openalex.org/C2524010","wikidata":"https://www.wikidata.org/wiki/Q8087","display_name":"Geometry","level":1,"score":0.0},{"id":"https://openalex.org/C77088390","wikidata":"https://www.wikidata.org/wiki/Q8513","display_name":"Database","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/3dic.2013.6702386","is_oa":false,"landing_page_url":"https://doi.org/10.1109/3dic.2013.6702386","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2013 IEEE International 3D Systems Integration Conference (3DIC)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"score":0.6200000047683716,"display_name":"Industry, innovation and infrastructure","id":"https://metadata.un.org/sdg/9"}],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":19,"referenced_works":["https://openalex.org/W207967324","https://openalex.org/W589168482","https://openalex.org/W1997683660","https://openalex.org/W2014330532","https://openalex.org/W2015755932","https://openalex.org/W2036134495","https://openalex.org/W2067525760","https://openalex.org/W2071003187","https://openalex.org/W2088481695","https://openalex.org/W2114353543","https://openalex.org/W2129296059","https://openalex.org/W2149277680","https://openalex.org/W2168404904","https://openalex.org/W2307724024","https://openalex.org/W2490605091","https://openalex.org/W4285719527","https://openalex.org/W6677012146","https://openalex.org/W6698167669","https://openalex.org/W6722451639"],"related_works":["https://openalex.org/W2383464288","https://openalex.org/W2025923707","https://openalex.org/W2141504104","https://openalex.org/W3129055756","https://openalex.org/W2184778749","https://openalex.org/W2089377260","https://openalex.org/W2066337006","https://openalex.org/W1988529718","https://openalex.org/W1976923760","https://openalex.org/W1816385972"],"abstract_inverted_index":{"Classical":[0],"dimensional":[1],"scaling":[2],"faces":[3],"challenges":[4],"from":[5],"growing":[6],"on-chip":[7],"interconnect":[8],"time":[9],"delays,":[10],"and":[11,15,41],"escalating":[12],"lithography":[13],"costs":[14],"layout":[16],"limitations.":[17],"In":[18],"this":[19],"paper,":[20],"we":[21],"present":[22],"practical":[23],"integration":[24],"schemes":[25],"for":[26],"developing":[27],"cost-efficient":[28],"3D":[29],"ICs":[30],"in":[31],"a":[32],"monolithic":[33],"fashion,":[34],"which":[35],"employ":[36],"fully":[37],"depleted":[38],"transistor":[39],"channels":[40],"laser":[42],"annealing":[43],"to":[44],"achieve":[45],"sharper":[46],"junction":[47],"definition.":[48]},"counts_by_year":[{"year":2024,"cited_by_count":1},{"year":2023,"cited_by_count":1},{"year":2021,"cited_by_count":1},{"year":2019,"cited_by_count":1},{"year":2018,"cited_by_count":2},{"year":2017,"cited_by_count":5},{"year":2015,"cited_by_count":1}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}