{"id":"https://openalex.org/W2061624187","doi":"https://doi.org/10.1109/3dic.2013.6702383","title":"Development of via-last 3D integration technologies using a new temporary adhesive system","display_name":"Development of via-last 3D integration technologies using a new temporary adhesive system","publication_year":2013,"publication_date":"2013-10-01","ids":{"openalex":"https://openalex.org/W2061624187","doi":"https://doi.org/10.1109/3dic.2013.6702383","mag":"2061624187"},"language":"en","primary_location":{"id":"doi:10.1109/3dic.2013.6702383","is_oa":false,"landing_page_url":"https://doi.org/10.1109/3dic.2013.6702383","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2013 IEEE International 3D Systems Integration Conference (3DIC)","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5041535044","display_name":"Takafumi Fukushima","orcid":"https://orcid.org/0000-0003-2303-8178"},"institutions":[{"id":"https://openalex.org/I201537933","display_name":"Tohoku University","ror":"https://ror.org/01dq60k83","country_code":"JP","type":"education","lineage":["https://openalex.org/I201537933"]}],"countries":["JP"],"is_corresponding":true,"raw_author_name":"T. Fukushima","raw_affiliation_strings":["Global Integration Initiative (GINTI), Tohoku Univ., Japan","New Ind. Creation Hatchery Center, Tohoku Univ., Sendai, Japan"],"affiliations":[{"raw_affiliation_string":"Global Integration Initiative (GINTI), Tohoku Univ., Japan","institution_ids":["https://openalex.org/I201537933"]},{"raw_affiliation_string":"New Ind. Creation Hatchery Center, Tohoku Univ., Sendai, Japan","institution_ids":["https://openalex.org/I201537933"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5113659962","display_name":"J. C. Bea","orcid":null},"institutions":[{"id":"https://openalex.org/I201537933","display_name":"Tohoku University","ror":"https://ror.org/01dq60k83","country_code":"JP","type":"education","lineage":["https://openalex.org/I201537933"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"J. Bea","raw_affiliation_strings":["Global Integration Initiative (GINTI), Tohoku Univ., Japan","New Ind. Creation Hatchery Center, Tohoku Univ., Sendai, Japan"],"affiliations":[{"raw_affiliation_string":"Global Integration Initiative (GINTI), Tohoku Univ., Japan","institution_ids":["https://openalex.org/I201537933"]},{"raw_affiliation_string":"New Ind. Creation Hatchery Center, Tohoku Univ., Sendai, Japan","institution_ids":["https://openalex.org/I201537933"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5101440058","display_name":"M. Murugesan","orcid":"https://orcid.org/0000-0002-3510-7110"},"institutions":[{"id":"https://openalex.org/I201537933","display_name":"Tohoku University","ror":"https://ror.org/01dq60k83","country_code":"JP","type":"education","lineage":["https://openalex.org/I201537933"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"M. Murugesan","raw_affiliation_strings":["Global Integration Initiative (GINTI), Tohoku Univ., Japan","New Ind. Creation Hatchery Center, Tohoku Univ., Sendai, Japan"],"affiliations":[{"raw_affiliation_string":"Global Integration Initiative (GINTI), Tohoku Univ., Japan","institution_ids":["https://openalex.org/I201537933"]},{"raw_affiliation_string":"New Ind. Creation Hatchery Center, Tohoku Univ., Sendai, Japan","institution_ids":["https://openalex.org/I201537933"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5010572244","display_name":"K.-W. Lee","orcid":null},"institutions":[{"id":"https://openalex.org/I201537933","display_name":"Tohoku University","ror":"https://ror.org/01dq60k83","country_code":"JP","type":"education","lineage":["https://openalex.org/I201537933"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"K.-W. Lee","raw_affiliation_strings":["Global Integration Initiative (GINTI), Tohoku Univ., Japan","New Ind. Creation Hatchery Center, Tohoku Univ., Sendai, Japan"],"affiliations":[{"raw_affiliation_string":"Global Integration Initiative (GINTI), Tohoku Univ., Japan","institution_ids":["https://openalex.org/I201537933"]},{"raw_affiliation_string":"New Ind. Creation Hatchery Center, Tohoku Univ., Sendai, Japan","institution_ids":["https://openalex.org/I201537933"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5059487693","display_name":"Mitsumasa Koyanagi","orcid":"https://orcid.org/0000-0003-4726-4217"},"institutions":[{"id":"https://openalex.org/I201537933","display_name":"Tohoku University","ror":"https://ror.org/01dq60k83","country_code":"JP","type":"education","lineage":["https://openalex.org/I201537933"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"M. Koyanagi","raw_affiliation_strings":["Global Integration Initiative (GINTI), Tohoku Univ., Japan","New Ind. Creation Hatchery Center, Tohoku Univ., Sendai, Japan"],"affiliations":[{"raw_affiliation_string":"Global Integration Initiative (GINTI), Tohoku Univ., Japan","institution_ids":["https://openalex.org/I201537933"]},{"raw_affiliation_string":"New Ind. Creation Hatchery Center, Tohoku Univ., Sendai, Japan","institution_ids":["https://openalex.org/I201537933"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":5,"corresponding_author_ids":["https://openalex.org/A5041535044"],"corresponding_institution_ids":["https://openalex.org/I201537933"],"apc_list":null,"apc_paid":null,"fwci":0.4729,"has_fulltext":false,"cited_by_count":8,"citation_normalized_percentile":{"value":0.69628227,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":95},"biblio":{"volume":"22","issue":null,"first_page":"1","last_page":"4"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.9986000061035156,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11853","display_name":"Semiconductor materials and interfaces","score":0.9984999895095825,"subfield":{"id":"https://openalex.org/subfields/3107","display_name":"Atomic and Molecular Physics, and Optics"},"field":{"id":"https://openalex.org/fields/31","display_name":"Physics and Astronomy"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/interposer","display_name":"Interposer","score":0.7621444463729858},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.7264829874038696},{"id":"https://openalex.org/keywords/wafer","display_name":"Wafer","score":0.6834516525268555},{"id":"https://openalex.org/keywords/adhesive","display_name":"Adhesive","score":0.6798362731933594},{"id":"https://openalex.org/keywords/electroplating","display_name":"Electroplating","score":0.6126518845558167},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.47108399868011475},{"id":"https://openalex.org/keywords/system-integration","display_name":"System integration","score":0.41942429542541504},{"id":"https://openalex.org/keywords/void","display_name":"Void (composites)","score":0.41414153575897217},{"id":"https://openalex.org/keywords/nanotechnology","display_name":"Nanotechnology","score":0.3348602056503296},{"id":"https://openalex.org/keywords/composite-material","display_name":"Composite material","score":0.26000452041625977},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.25108760595321655},{"id":"https://openalex.org/keywords/etching","display_name":"Etching (microfabrication)","score":0.15640854835510254},{"id":"https://openalex.org/keywords/database","display_name":"Database","score":0.07318279147148132}],"concepts":[{"id":"https://openalex.org/C158802814","wikidata":"https://www.wikidata.org/wiki/Q6056418","display_name":"Interposer","level":4,"score":0.7621444463729858},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.7264829874038696},{"id":"https://openalex.org/C160671074","wikidata":"https://www.wikidata.org/wiki/Q267131","display_name":"Wafer","level":2,"score":0.6834516525268555},{"id":"https://openalex.org/C68928338","wikidata":"https://www.wikidata.org/wiki/Q131790","display_name":"Adhesive","level":3,"score":0.6798362731933594},{"id":"https://openalex.org/C51807945","wikidata":"https://www.wikidata.org/wiki/Q3503392","display_name":"Electroplating","level":3,"score":0.6126518845558167},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.47108399868011475},{"id":"https://openalex.org/C19527686","wikidata":"https://www.wikidata.org/wiki/Q1665453","display_name":"System integration","level":2,"score":0.41942429542541504},{"id":"https://openalex.org/C2779772531","wikidata":"https://www.wikidata.org/wiki/Q19689164","display_name":"Void (composites)","level":2,"score":0.41414153575897217},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.3348602056503296},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.26000452041625977},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.25108760595321655},{"id":"https://openalex.org/C100460472","wikidata":"https://www.wikidata.org/wiki/Q2368605","display_name":"Etching (microfabrication)","level":3,"score":0.15640854835510254},{"id":"https://openalex.org/C77088390","wikidata":"https://www.wikidata.org/wiki/Q8513","display_name":"Database","level":1,"score":0.07318279147148132},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/3dic.2013.6702383","is_oa":false,"landing_page_url":"https://doi.org/10.1109/3dic.2013.6702383","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2013 IEEE International 3D Systems Integration Conference (3DIC)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"id":"https://metadata.un.org/sdg/9","display_name":"Industry, innovation and infrastructure","score":0.550000011920929}],"awards":[],"funders":[{"id":"https://openalex.org/F4320317941","display_name":"DENSO","ror":"https://ror.org/04hkpfa76"}],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":47,"referenced_works":["https://openalex.org/W1513426357","https://openalex.org/W1967290510","https://openalex.org/W1970831471","https://openalex.org/W1971966678","https://openalex.org/W1979601109","https://openalex.org/W1992894071","https://openalex.org/W1996508635","https://openalex.org/W1997935435","https://openalex.org/W1999095731","https://openalex.org/W2003752173","https://openalex.org/W2009195513","https://openalex.org/W2017387783","https://openalex.org/W2019035957","https://openalex.org/W2029038600","https://openalex.org/W2029530099","https://openalex.org/W2031579205","https://openalex.org/W2033720272","https://openalex.org/W2034152399","https://openalex.org/W2036404459","https://openalex.org/W2038027598","https://openalex.org/W2039439300","https://openalex.org/W2045821110","https://openalex.org/W2049411827","https://openalex.org/W2050628845","https://openalex.org/W2052045572","https://openalex.org/W2056399224","https://openalex.org/W2063406919","https://openalex.org/W2064676658","https://openalex.org/W2067894198","https://openalex.org/W2071760069","https://openalex.org/W2080451420","https://openalex.org/W2090414396","https://openalex.org/W2092077578","https://openalex.org/W2106608281","https://openalex.org/W2125551870","https://openalex.org/W2127622913","https://openalex.org/W2142901152","https://openalex.org/W2151613126","https://openalex.org/W2159032199","https://openalex.org/W2171347643","https://openalex.org/W2537189011","https://openalex.org/W2538857334","https://openalex.org/W2541409995","https://openalex.org/W3144169286","https://openalex.org/W6630649143","https://openalex.org/W6659957655","https://openalex.org/W6672753064"],"related_works":["https://openalex.org/W2037416628","https://openalex.org/W2073725000","https://openalex.org/W2789752821","https://openalex.org/W2205502757","https://openalex.org/W1972268475","https://openalex.org/W2235483886","https://openalex.org/W1480508001","https://openalex.org/W2097812662","https://openalex.org/W4200290232","https://openalex.org/W4361014413"],"abstract_inverted_index":{"We":[0],"develop":[1],"new":[2,56],"via-last":[3],"backside-via":[4],"3D":[5,28,46],"integration":[6,58],"technologies":[7],"using":[8],"a":[9,55],"unique":[10],"temporary":[11],"adhesive":[12],"system":[13,57],"in":[14,34],"which":[15],"visible-light":[16],"laser":[17],"is":[18],"employed":[19],"for":[20],"wafer":[21,62],"debonding":[22],"from":[23],"glass":[24],"carriers.":[25],"The":[26],"advanced":[27],"and":[29,43,68,75],"TSV":[30,78],"researches":[31],"are":[32,73],"driven":[33],"order":[35],"to":[36],"fabricate":[37],"Si":[38],"interposers":[39],"with":[40],"high-density":[41],"TSVs":[42],"highly":[44],"integrated":[45],"hetero":[47],"chips":[48],"at":[49],"Global":[50],"INTegration":[51],"Initiative":[52],"(GINTI)":[53],"as":[54],"research":[59],"center.":[60],"High-TTV":[61],"thinning,":[63],"notch-free":[64],"backside":[65],"via":[66],"formation,":[67],"void-less":[69],"bottom-up":[70],"Cu":[71],"electroplating":[72],"performed,":[74],"the":[76],"resulting":[77],"daisy":[79],"chains":[80],"show":[81],"good":[82],"I-V":[83],"characteristics.":[84]},"counts_by_year":[{"year":2022,"cited_by_count":1},{"year":2021,"cited_by_count":2},{"year":2020,"cited_by_count":1},{"year":2018,"cited_by_count":1},{"year":2017,"cited_by_count":1},{"year":2016,"cited_by_count":1},{"year":2015,"cited_by_count":1}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}