{"id":"https://openalex.org/W2067143020","doi":"https://doi.org/10.1109/3dic.2013.6702382","title":"The development and evaluation of RF TSV for 3D IPD applications","display_name":"The development and evaluation of RF TSV for 3D IPD applications","publication_year":2013,"publication_date":"2013-10-01","ids":{"openalex":"https://openalex.org/W2067143020","doi":"https://doi.org/10.1109/3dic.2013.6702382","mag":"2067143020"},"language":"en","primary_location":{"id":"doi:10.1109/3dic.2013.6702382","is_oa":false,"landing_page_url":"https://doi.org/10.1109/3dic.2013.6702382","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2013 IEEE International 3D Systems Integration Conference (3DIC)","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5111467559","display_name":"Thorbj\u00f6rn Ebefors","orcid":null},"institutions":[{"id":"https://openalex.org/I4210152981","display_name":"Silex Microsystems (Sweden)","ror":"https://ror.org/0483w8753","country_code":"SE","type":"company","lineage":["https://openalex.org/I4210152981"]}],"countries":["SE"],"is_corresponding":true,"raw_author_name":"Thorbjorn Ebefors","raw_affiliation_strings":["SILEX Microsystems AB, J\u00e4rf\u00e4lla, SWEDEN","SILEX Microsyst. AB, Ja\u0308rfa\u0308lla, Sweden"],"affiliations":[{"raw_affiliation_string":"SILEX Microsystems AB, J\u00e4rf\u00e4lla, SWEDEN","institution_ids":["https://openalex.org/I4210152981"]},{"raw_affiliation_string":"SILEX Microsyst. AB, Ja\u0308rfa\u0308lla, Sweden","institution_ids":["https://openalex.org/I4210152981"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5047728219","display_name":"Jessica Fredlund","orcid":null},"institutions":[{"id":"https://openalex.org/I4210152981","display_name":"Silex Microsystems (Sweden)","ror":"https://ror.org/0483w8753","country_code":"SE","type":"company","lineage":["https://openalex.org/I4210152981"]}],"countries":["SE"],"is_corresponding":false,"raw_author_name":"Jessica Fredlund","raw_affiliation_strings":["SILEX Microsystems AB, J\u00e4rf\u00e4lla, SWEDEN","SILEX Microsyst. AB, Ja\u0308rfa\u0308lla, Sweden"],"affiliations":[{"raw_affiliation_string":"SILEX Microsystems AB, J\u00e4rf\u00e4lla, SWEDEN","institution_ids":["https://openalex.org/I4210152981"]},{"raw_affiliation_string":"SILEX Microsyst. AB, Ja\u0308rfa\u0308lla, Sweden","institution_ids":["https://openalex.org/I4210152981"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5078626836","display_name":"Daniel Perttu","orcid":null},"institutions":[{"id":"https://openalex.org/I4210152981","display_name":"Silex Microsystems (Sweden)","ror":"https://ror.org/0483w8753","country_code":"SE","type":"company","lineage":["https://openalex.org/I4210152981"]}],"countries":["SE"],"is_corresponding":false,"raw_author_name":"Daniel Perttu","raw_affiliation_strings":["SILEX Microsystems AB, J\u00e4rf\u00e4lla, SWEDEN","SILEX Microsyst. AB, Ja\u0308rfa\u0308lla, Sweden"],"affiliations":[{"raw_affiliation_string":"SILEX Microsystems AB, J\u00e4rf\u00e4lla, SWEDEN","institution_ids":["https://openalex.org/I4210152981"]},{"raw_affiliation_string":"SILEX Microsyst. AB, Ja\u0308rfa\u0308lla, Sweden","institution_ids":["https://openalex.org/I4210152981"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5113665748","display_name":"Raymond van Dijk","orcid":null},"institutions":[{"id":"https://openalex.org/I148297040","display_name":"Netherlands Organisation for Applied Scientific Research","ror":"https://ror.org/01bnjb948","country_code":"NL","type":"funder","lineage":["https://openalex.org/I148297040"]}],"countries":["NL"],"is_corresponding":false,"raw_author_name":"Raymond van Dijk","raw_affiliation_strings":["TNO Technical Sciences, The Hague, The Netherlands","TNO Tech. Sci., The Hague, Netherlands"],"affiliations":[{"raw_affiliation_string":"TNO Technical Sciences, The Hague, The Netherlands","institution_ids":["https://openalex.org/I148297040"]},{"raw_affiliation_string":"TNO Tech. Sci., The Hague, Netherlands","institution_ids":["https://openalex.org/I148297040"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5023251120","display_name":"Lorenzo Cifola","orcid":null},"institutions":[{"id":"https://openalex.org/I148297040","display_name":"Netherlands Organisation for Applied Scientific Research","ror":"https://ror.org/01bnjb948","country_code":"NL","type":"funder","lineage":["https://openalex.org/I148297040"]}],"countries":["NL"],"is_corresponding":false,"raw_author_name":"Lorenzo Cifola","raw_affiliation_strings":["TNO Technical Sciences, The Hague, The Netherlands","TNO Tech. Sci., The Hague, Netherlands"],"affiliations":[{"raw_affiliation_string":"TNO Technical Sciences, The Hague, The Netherlands","institution_ids":["https://openalex.org/I148297040"]},{"raw_affiliation_string":"TNO Tech. Sci., The Hague, Netherlands","institution_ids":["https://openalex.org/I148297040"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5007275580","display_name":"Mikko Kaunisto","orcid":null},"institutions":[{"id":"https://openalex.org/I87653560","display_name":"VTT Technical Research Centre of Finland","ror":"https://ror.org/04b181w54","country_code":"FI","type":"nonprofit","lineage":["https://openalex.org/I4210089493","https://openalex.org/I87653560"]}],"countries":["FI"],"is_corresponding":false,"raw_author_name":"Mikko Kaunisto","raw_affiliation_strings":["VTT Technical Research Centre of Finland, Espoo, FINLAND","VTT Tech. Res. Centre of Finland, Espoo, Finland"],"affiliations":[{"raw_affiliation_string":"VTT Technical Research Centre of Finland, Espoo, FINLAND","institution_ids":["https://openalex.org/I87653560"]},{"raw_affiliation_string":"VTT Tech. Res. Centre of Finland, Espoo, Finland","institution_ids":["https://openalex.org/I87653560"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5066101237","display_name":"Pekka Rantakari","orcid":null},"institutions":[{"id":"https://openalex.org/I87653560","display_name":"VTT Technical Research Centre of Finland","ror":"https://ror.org/04b181w54","country_code":"FI","type":"nonprofit","lineage":["https://openalex.org/I4210089493","https://openalex.org/I87653560"]}],"countries":["FI"],"is_corresponding":false,"raw_author_name":"Pekka Rantakari","raw_affiliation_strings":["VTT Technical Research Centre of Finland, Espoo, FINLAND","VTT Tech. Res. Centre of Finland, Espoo, Finland"],"affiliations":[{"raw_affiliation_string":"VTT Technical Research Centre of Finland, Espoo, FINLAND","institution_ids":["https://openalex.org/I87653560"]},{"raw_affiliation_string":"VTT Tech. Res. Centre of Finland, Espoo, Finland","institution_ids":["https://openalex.org/I87653560"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5070193273","display_name":"T. V\u00e4h\u00e4-Heikkil\u00e4","orcid":null},"institutions":[{"id":"https://openalex.org/I87653560","display_name":"VTT Technical Research Centre of Finland","ror":"https://ror.org/04b181w54","country_code":"FI","type":"nonprofit","lineage":["https://openalex.org/I4210089493","https://openalex.org/I87653560"]}],"countries":["FI"],"is_corresponding":false,"raw_author_name":"Tauno Vaha-Heikkila","raw_affiliation_strings":["VTT Technical Research Centre of Finland, Espoo, FINLAND","VTT Tech. Res. Centre of Finland, Espoo, Finland"],"affiliations":[{"raw_affiliation_string":"VTT Technical Research Centre of Finland, Espoo, FINLAND","institution_ids":["https://openalex.org/I87653560"]},{"raw_affiliation_string":"VTT Tech. Res. Centre of Finland, Espoo, Finland","institution_ids":["https://openalex.org/I87653560"]}]}],"institutions":[],"countries_distinct_count":3,"institutions_distinct_count":8,"corresponding_author_ids":["https://openalex.org/A5111467559"],"corresponding_institution_ids":["https://openalex.org/I4210152981"],"apc_list":null,"apc_paid":null,"fwci":3.3633,"has_fulltext":false,"cited_by_count":55,"citation_normalized_percentile":{"value":0.9280445,"is_in_top_1_percent":false,"is_in_top_10_percent":true},"cited_by_percentile_year":{"min":90,"max":99},"biblio":{"volume":null,"issue":null,"first_page":"1","last_page":"8"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.9990000128746033,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11429","display_name":"Semiconductor Lasers and Optical Devices","score":0.9973000288009644,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/interposer","display_name":"Interposer","score":0.8052247762680054},{"id":"https://openalex.org/keywords/deep-reactive-ion-etching","display_name":"Deep reactive-ion etching","score":0.7905533313751221},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.7562934160232544},{"id":"https://openalex.org/keywords/fabrication","display_name":"Fabrication","score":0.6534644961357117},{"id":"https://openalex.org/keywords/through-silicon-via","display_name":"Through-silicon via","score":0.6197405457496643},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.5892321467399597},{"id":"https://openalex.org/keywords/wafer","display_name":"Wafer","score":0.5517218708992004},{"id":"https://openalex.org/keywords/coplanar-waveguide","display_name":"Coplanar waveguide","score":0.539039134979248},{"id":"https://openalex.org/keywords/insertion-loss","display_name":"Insertion loss","score":0.5188535451889038},{"id":"https://openalex.org/keywords/microelectromechanical-systems","display_name":"Microelectromechanical systems","score":0.47760412096977234},{"id":"https://openalex.org/keywords/etching","display_name":"Etching (microfabrication)","score":0.46435025334358215},{"id":"https://openalex.org/keywords/wafer-level-packaging","display_name":"Wafer-level packaging","score":0.4386644959449768},{"id":"https://openalex.org/keywords/capacitance","display_name":"Capacitance","score":0.43415459990501404},{"id":"https://openalex.org/keywords/inductor","display_name":"Inductor","score":0.4176337420940399},{"id":"https://openalex.org/keywords/reactive-ion-etching","display_name":"Reactive-ion etching","score":0.3702463209629059},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.24425244331359863},{"id":"https://openalex.org/keywords/nanotechnology","display_name":"Nanotechnology","score":0.18693837523460388},{"id":"https://openalex.org/keywords/microwave","display_name":"Microwave","score":0.12002593278884888},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.1168442964553833},{"id":"https://openalex.org/keywords/layer","display_name":"Layer (electronics)","score":0.10786101222038269},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.0928061306476593},{"id":"https://openalex.org/keywords/electrode","display_name":"Electrode","score":0.08648189902305603},{"id":"https://openalex.org/keywords/telecommunications","display_name":"Telecommunications","score":0.0721951425075531}],"concepts":[{"id":"https://openalex.org/C158802814","wikidata":"https://www.wikidata.org/wiki/Q6056418","display_name":"Interposer","level":4,"score":0.8052247762680054},{"id":"https://openalex.org/C124634506","wikidata":"https://www.wikidata.org/wiki/Q486936","display_name":"Deep reactive-ion etching","level":5,"score":0.7905533313751221},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.7562934160232544},{"id":"https://openalex.org/C136525101","wikidata":"https://www.wikidata.org/wiki/Q5428139","display_name":"Fabrication","level":3,"score":0.6534644961357117},{"id":"https://openalex.org/C45632049","wikidata":"https://www.wikidata.org/wiki/Q1578120","display_name":"Through-silicon via","level":3,"score":0.6197405457496643},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.5892321467399597},{"id":"https://openalex.org/C160671074","wikidata":"https://www.wikidata.org/wiki/Q267131","display_name":"Wafer","level":2,"score":0.5517218708992004},{"id":"https://openalex.org/C3736036","wikidata":"https://www.wikidata.org/wiki/Q15525941","display_name":"Coplanar waveguide","level":3,"score":0.539039134979248},{"id":"https://openalex.org/C90327742","wikidata":"https://www.wikidata.org/wiki/Q947396","display_name":"Insertion loss","level":2,"score":0.5188535451889038},{"id":"https://openalex.org/C37977207","wikidata":"https://www.wikidata.org/wiki/Q175561","display_name":"Microelectromechanical systems","level":2,"score":0.47760412096977234},{"id":"https://openalex.org/C100460472","wikidata":"https://www.wikidata.org/wiki/Q2368605","display_name":"Etching (microfabrication)","level":3,"score":0.46435025334358215},{"id":"https://openalex.org/C2780288131","wikidata":"https://www.wikidata.org/wiki/Q4017648","display_name":"Wafer-level packaging","level":3,"score":0.4386644959449768},{"id":"https://openalex.org/C30066665","wikidata":"https://www.wikidata.org/wiki/Q164399","display_name":"Capacitance","level":3,"score":0.43415459990501404},{"id":"https://openalex.org/C144534570","wikidata":"https://www.wikidata.org/wiki/Q5325","display_name":"Inductor","level":3,"score":0.4176337420940399},{"id":"https://openalex.org/C130472188","wikidata":"https://www.wikidata.org/wiki/Q1640159","display_name":"Reactive-ion etching","level":4,"score":0.3702463209629059},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.24425244331359863},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.18693837523460388},{"id":"https://openalex.org/C44838205","wikidata":"https://www.wikidata.org/wiki/Q127995","display_name":"Microwave","level":2,"score":0.12002593278884888},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.1168442964553833},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.10786101222038269},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.0928061306476593},{"id":"https://openalex.org/C17525397","wikidata":"https://www.wikidata.org/wiki/Q176140","display_name":"Electrode","level":2,"score":0.08648189902305603},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.0721951425075531},{"id":"https://openalex.org/C71924100","wikidata":"https://www.wikidata.org/wiki/Q11190","display_name":"Medicine","level":0,"score":0.0},{"id":"https://openalex.org/C147789679","wikidata":"https://www.wikidata.org/wiki/Q11372","display_name":"Physical chemistry","level":1,"score":0.0},{"id":"https://openalex.org/C204787440","wikidata":"https://www.wikidata.org/wiki/Q188504","display_name":"Alternative medicine","level":2,"score":0.0},{"id":"https://openalex.org/C185592680","wikidata":"https://www.wikidata.org/wiki/Q2329","display_name":"Chemistry","level":0,"score":0.0},{"id":"https://openalex.org/C165801399","wikidata":"https://www.wikidata.org/wiki/Q25428","display_name":"Voltage","level":2,"score":0.0},{"id":"https://openalex.org/C142724271","wikidata":"https://www.wikidata.org/wiki/Q7208","display_name":"Pathology","level":1,"score":0.0}],"mesh":[],"locations_count":3,"locations":[{"id":"doi:10.1109/3dic.2013.6702382","is_oa":false,"landing_page_url":"https://doi.org/10.1109/3dic.2013.6702382","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2013 IEEE International 3D Systems Integration Conference (3DIC)","raw_type":"proceedings-article"},{"id":"pmh:oai:oai-pmh.tno.nl:39586","is_oa":false,"landing_page_url":"https://resolver.tno.nl/uuid:fbbe786c-f3be-4016-b04d-90c013eda781","pdf_url":null,"source":{"id":"https://openalex.org/S7407055233","display_name":"TNO Repository","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"repository"},"license":null,"license_id":null,"version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":null,"raw_type":"info:eu-repo/semantics/conferencePaper"},{"id":"pmh:tno:oai:tudelft.nl:uuid:fbbe786c-f3be-4016-b04d-90c013eda781","is_oa":false,"landing_page_url":"http://resolver.tudelft.nl/uuid:fbbe786c-f3be-4016-b04d-90c013eda781","pdf_url":null,"source":{"id":"https://openalex.org/S4306401843","display_name":"Data Archiving and Networked Services (DANS)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":"https://openalex.org/I1322597698","host_organization_name":"Royal Netherlands Academy of Arts and Sciences","host_organization_lineage":["https://openalex.org/I1322597698"],"host_organization_lineage_names":[],"type":"repository"},"license":null,"license_id":null,"version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"","raw_type":"info:eu-repo/semantics/article"}],"best_oa_location":null,"sustainable_development_goals":[{"score":0.4300000071525574,"display_name":"Industry, innovation and infrastructure","id":"https://metadata.un.org/sdg/9"}],"awards":[],"funders":[{"id":"https://openalex.org/F4320320300","display_name":"European Commission","ror":"https://ror.org/00k4n6c32"},{"id":"https://openalex.org/F4320321030","display_name":"VINNOVA","ror":"https://ror.org/01kd5m353"},{"id":"https://openalex.org/F4320321855","display_name":"Tekes","ror":"https://ror.org/02ag8cq23"}],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":10,"referenced_works":["https://openalex.org/W648694940","https://openalex.org/W1498656857","https://openalex.org/W2043529430","https://openalex.org/W2067734750","https://openalex.org/W2118465325","https://openalex.org/W2137810177","https://openalex.org/W2163659250","https://openalex.org/W3217269181","https://openalex.org/W6667438965","https://openalex.org/W6677916861"],"related_works":["https://openalex.org/W2026710642","https://openalex.org/W1606557396","https://openalex.org/W2896557720","https://openalex.org/W1992573569","https://openalex.org/W2172207893","https://openalex.org/W2011182927","https://openalex.org/W1990828594","https://openalex.org/W2310189477","https://openalex.org/W2019002696","https://openalex.org/W2092686655"],"abstract_inverted_index":{"In":[0],"this":[1],"paper,":[2],"Silex":[3],"Microsystems,":[4],"the":[5,38,86,94,144,254],"world's":[6],"largest":[7],"Pure-Play":[8],"MEMS":[9],"foundry,":[10],"together":[11,185],"with":[12,37,151,186,284],"partners":[13],"TNO":[14,239],"and":[15,111,123,133,179,189,197,244,260,289,295,313],"VTT,":[16],"present":[17],"our":[18],"recent":[19],"advancements":[20],"in":[21,35,76,93,156,253],"RF":[22,154,159,181],"through":[23],"silicon":[24],"Vias":[25,68],"(TSV)":[26],"for":[27,138,250,280,304],"3D":[28,97,231,251,285],"integrated":[29,282,307],"passive":[30],"devices":[31,146],"(IPD)":[32],"applications,":[33],"achieved":[34],"conjunction":[36],"European":[39],"consortium":[40],"EPAMO.":[41],"A":[42,276],"novel":[43],"open":[44,129],"TSV":[45,125,131,182,205,224,286],"fabrication":[46,87,101,277],"process":[47],"on":[48,72,113],"200":[49],"mm":[50],"diameter":[51],"305":[52,81],"\u03bcm":[53,82],"thick":[54],"High":[55,63],"Resistivity":[56],"wafers":[57,137],"has":[58],"been":[59],"used":[60],"to":[61,135,218,229,272],"demonstrated":[62],"Aspect":[64],"Ratio":[65],"Through":[66],"Silicon":[67],"(HAR":[69],"TSV),":[70],"focusing":[71],"tight":[73],"pitch,":[74],"resulting":[75],"36":[77],"TSV/mm2":[78],"Via":[79],"density.":[80],"wafer":[83],"thickness":[84],"enables":[85],"of":[88,96,128,143,167,201,256],"rigid":[89,130],"interposers,":[90],"an":[91],"advancement":[92],"commercialization":[95,314],"packaging":[98],"technology.":[99],"The":[100,140,199,222],"includes":[102],"double":[103],"sided":[104],"deep":[105],"reactive":[106],"ion":[107],"etching":[108],"(DRIE),":[109],"developments":[110],"evaluation":[112],"various":[114],"conformal":[115],"high":[116,241,290,308],"aspect":[117],"ratio":[118],"(HAR)":[119],"plating":[120,127],"seedlayer":[121],"processes,":[122],"void-free":[124],"Cu":[126],"structures":[132,184,193],"bonding":[134],"glass":[136],"characterization.":[139],"electrical":[141],"characterization":[142],"fabricated":[145,196],"was":[147,226],"performed":[148],"by":[149,238],"VTT":[150],"excellent":[152],"measured":[153],"properties:":[155],"specific,":[157],"low":[158,164],"losses":[160],"as":[161,163],"well":[162],"DC":[165],"resistances":[166],"less":[168,208],"than":[169,209],"20":[170],"mOhm/TSV.":[171],"Several":[172],"different":[173],"coplanar":[174,204],"waveguide":[175],"(CPW)":[176],"test":[177,183,192],"vehicles":[178],"other":[180],"Daisy":[187],"Chain":[188],"parasitic":[190],"Capacitance":[191],"were":[194,236],"designed,":[195],"evaluated.":[198],"loss":[200],"a":[202],"single":[203],"transition":[206],"is":[207,216],"0.04":[210],"dB":[211],"@":[212],"5":[213],"GHz,":[214],"which":[215],"considered":[217],"be":[219],"very":[220],"small.":[221],"developed":[223],"technology":[225],"also":[227],"employed":[228],"fabricate":[230],"toroidal":[232],"inductors.":[233],"These":[234],"inductors":[235,252,288],"characterized":[237],"showing":[240],"Q-factor":[242],"(>30)":[243],"self-resonance":[245],"frequency":[246,309],"(>":[247],"6":[248],"GHz)":[249],"range":[255],"1-15":[257],"nH.":[258],"1":[259],"2":[261],"port":[262],"inductor":[263],"temperature":[264,267,271],"characteristics":[265],"over":[266],"interval":[268],"from":[269],"room":[270],"111\u00b0C":[273],"are":[274,301,316],"reported.":[275],"integration":[278],"scheme":[279],"fully":[281],"RF-IPD":[283],"based":[287],"ohmic":[291],"polysilicon":[292],"(p-Si)":[293],"resistors":[294],"piezoelectric":[296],"(PZT)":[297],"metal-insulator-metal":[298],"(MIM)":[299],"capacitors":[300],"discussed.":[302],"Outlook":[303],"improvements":[305],"using":[306],"magnetic":[310],"flux":[311],"materials":[312],"aspects":[315],"described.":[317]},"counts_by_year":[{"year":2025,"cited_by_count":5},{"year":2024,"cited_by_count":1},{"year":2023,"cited_by_count":2},{"year":2022,"cited_by_count":8},{"year":2021,"cited_by_count":6},{"year":2020,"cited_by_count":5},{"year":2019,"cited_by_count":3},{"year":2018,"cited_by_count":8},{"year":2017,"cited_by_count":3},{"year":2016,"cited_by_count":6},{"year":2015,"cited_by_count":7},{"year":2014,"cited_by_count":1}],"updated_date":"2026-04-04T16:13:02.066488","created_date":"2025-10-10T00:00:00"}