{"id":"https://openalex.org/W2029757509","doi":"https://doi.org/10.1109/3dic.2013.6702378","title":"Evaluation of 3DICs and fabrication of monolithic interlayer vias","display_name":"Evaluation of 3DICs and fabrication of monolithic interlayer vias","publication_year":2013,"publication_date":"2013-10-01","ids":{"openalex":"https://openalex.org/W2029757509","doi":"https://doi.org/10.1109/3dic.2013.6702378","mag":"2029757509"},"language":"en","primary_location":{"id":"doi:10.1109/3dic.2013.6702378","is_oa":false,"landing_page_url":"https://doi.org/10.1109/3dic.2013.6702378","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2013 IEEE International 3D Systems Integration Conference (3DIC)","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5073577025","display_name":"William Wahby","orcid":"https://orcid.org/0000-0002-1066-8915"},"institutions":[{"id":"https://openalex.org/I130701444","display_name":"Georgia Institute of Technology","ror":"https://ror.org/01zkghx44","country_code":"US","type":"education","lineage":["https://openalex.org/I130701444"]}],"countries":["US"],"is_corresponding":true,"raw_author_name":"William Wahby","raw_affiliation_strings":["Georgia Institute of Technology","Georgia Institute of Technology, Atlanta, United States"],"affiliations":[{"raw_affiliation_string":"Georgia Institute of Technology","institution_ids":["https://openalex.org/I130701444"]},{"raw_affiliation_string":"Georgia Institute of Technology, Atlanta, United States","institution_ids":["https://openalex.org/I130701444"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5060693361","display_name":"Ashish Dembla","orcid":null},"institutions":[{"id":"https://openalex.org/I130701444","display_name":"Georgia Institute of Technology","ror":"https://ror.org/01zkghx44","country_code":"US","type":"education","lineage":["https://openalex.org/I130701444"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Ashish Dembla","raw_affiliation_strings":["Georgia Institute of Technology","Georgia Institute of Technology, Atlanta, United States"],"affiliations":[{"raw_affiliation_string":"Georgia Institute of Technology","institution_ids":["https://openalex.org/I130701444"]},{"raw_affiliation_string":"Georgia Institute of Technology, Atlanta, United States","institution_ids":["https://openalex.org/I130701444"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5044507102","display_name":"Muhannad S. Bakir","orcid":"https://orcid.org/0000-0002-0380-0842"},"institutions":[{"id":"https://openalex.org/I130701444","display_name":"Georgia Institute of Technology","ror":"https://ror.org/01zkghx44","country_code":"US","type":"education","lineage":["https://openalex.org/I130701444"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Muhannad Bakir","raw_affiliation_strings":["Georgia Institute of Technology","Georgia Institute of Technology, Atlanta, United States"],"affiliations":[{"raw_affiliation_string":"Georgia Institute of Technology","institution_ids":["https://openalex.org/I130701444"]},{"raw_affiliation_string":"Georgia Institute of Technology, Atlanta, United States","institution_ids":["https://openalex.org/I130701444"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":3,"corresponding_author_ids":["https://openalex.org/A5073577025"],"corresponding_institution_ids":["https://openalex.org/I130701444"],"apc_list":null,"apc_paid":null,"fwci":0.4729,"has_fulltext":false,"cited_by_count":5,"citation_normalized_percentile":{"value":0.68713367,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":96},"biblio":{"volume":null,"issue":null,"first_page":"1","last_page":"6"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.9994999766349792,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11338","display_name":"Advancements in Photolithography Techniques","score":0.9990000128746033,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/fabrication","display_name":"Fabrication","score":0.8248046636581421},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.7711033821105957},{"id":"https://openalex.org/keywords/interconnection","display_name":"Interconnection","score":0.7694097757339478},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.5278453826904297},{"id":"https://openalex.org/keywords/homogeneous","display_name":"Homogeneous","score":0.48106861114501953},{"id":"https://openalex.org/keywords/through-silicon-via","display_name":"Through-silicon via","score":0.4248456358909607},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.4145374894142151},{"id":"https://openalex.org/keywords/silicon","display_name":"Silicon","score":0.3571864366531372},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.178277850151062},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.118329256772995},{"id":"https://openalex.org/keywords/telecommunications","display_name":"Telecommunications","score":0.05608060956001282}],"concepts":[{"id":"https://openalex.org/C136525101","wikidata":"https://www.wikidata.org/wiki/Q5428139","display_name":"Fabrication","level":3,"score":0.8248046636581421},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.7711033821105957},{"id":"https://openalex.org/C123745756","wikidata":"https://www.wikidata.org/wiki/Q1665949","display_name":"Interconnection","level":2,"score":0.7694097757339478},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.5278453826904297},{"id":"https://openalex.org/C66882249","wikidata":"https://www.wikidata.org/wiki/Q169336","display_name":"Homogeneous","level":2,"score":0.48106861114501953},{"id":"https://openalex.org/C45632049","wikidata":"https://www.wikidata.org/wiki/Q1578120","display_name":"Through-silicon via","level":3,"score":0.4248456358909607},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.4145374894142151},{"id":"https://openalex.org/C544956773","wikidata":"https://www.wikidata.org/wiki/Q670","display_name":"Silicon","level":2,"score":0.3571864366531372},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.178277850151062},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.118329256772995},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.05608060956001282},{"id":"https://openalex.org/C97355855","wikidata":"https://www.wikidata.org/wiki/Q11473","display_name":"Thermodynamics","level":1,"score":0.0},{"id":"https://openalex.org/C71924100","wikidata":"https://www.wikidata.org/wiki/Q11190","display_name":"Medicine","level":0,"score":0.0},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.0},{"id":"https://openalex.org/C142724271","wikidata":"https://www.wikidata.org/wiki/Q7208","display_name":"Pathology","level":1,"score":0.0},{"id":"https://openalex.org/C204787440","wikidata":"https://www.wikidata.org/wiki/Q188504","display_name":"Alternative medicine","level":2,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/3dic.2013.6702378","is_oa":false,"landing_page_url":"https://doi.org/10.1109/3dic.2013.6702378","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2013 IEEE International 3D Systems Integration Conference (3DIC)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"id":"https://metadata.un.org/sdg/9","score":0.5699999928474426,"display_name":"Industry, innovation and infrastructure"}],"awards":[],"funders":[{"id":"https://openalex.org/F4320306087","display_name":"Semiconductor Research Corporation","ror":"https://ror.org/047z4n946"}],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":15,"referenced_works":["https://openalex.org/W1556480701","https://openalex.org/W1603767330","https://openalex.org/W1963985775","https://openalex.org/W2015755932","https://openalex.org/W2028954821","https://openalex.org/W2041214634","https://openalex.org/W2087417986","https://openalex.org/W2103714239","https://openalex.org/W2109013505","https://openalex.org/W2125082141","https://openalex.org/W2133308853","https://openalex.org/W2146306637","https://openalex.org/W2160007566","https://openalex.org/W2165792244","https://openalex.org/W6633284831"],"related_works":["https://openalex.org/W2082914599","https://openalex.org/W2756570351","https://openalex.org/W2606427896","https://openalex.org/W2014709025","https://openalex.org/W2384315251","https://openalex.org/W2748443500","https://openalex.org/W2636764471","https://openalex.org/W2018670357","https://openalex.org/W1983191281","https://openalex.org/W2011967496"],"abstract_inverted_index":{"A":[0],"compact":[1],"model":[2,13],"for":[3,15,66],"interconnect":[4],"length":[5],"in":[6],"homogeneous":[7],"3DICs":[8],"is":[9,20,50],"presented.":[10],"The":[11,39],"new":[12],"accounts":[14],"lateral":[16],"TSV":[17,42],"size,":[18],"which":[19,86],"often":[21],"much":[22],"larger":[23],"than":[24],"the":[25,36,76],"gate":[26,31,92],"pitch,":[27],"leading":[28],"to":[29,59,74],"TSV-induced":[30,91],"blockage":[32],"and":[33,47,52],"potentially":[34],"affecting":[35],"wire-length":[37],"distribution.":[38],"impact":[40],"of":[41,78],"diameter":[43],"on":[44],"maximum":[45],"wirelength":[46],"wiring":[48],"power":[49],"investigated,":[51],"systems":[53,81],"with":[54,82],"smaller":[55],"vias":[56,71],"are":[57,72],"found":[58],"have":[60],"better":[61],"properties.":[62],"Accordingly,":[63],"fabrication":[64],"results":[65],"nanoscale":[67],"monolithically":[68],"integrated":[69],"copper":[70],"presented":[73],"demonstrate":[75],"feasibility":[77],"developing":[79],"3D":[80],"dense":[83],"vertical":[84],"integration":[85],"do":[87],"not":[88],"suffer":[89],"from":[90],"blockage.":[93]},"counts_by_year":[{"year":2024,"cited_by_count":1},{"year":2022,"cited_by_count":1},{"year":2019,"cited_by_count":1},{"year":2016,"cited_by_count":2}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}