{"id":"https://openalex.org/W2019266502","doi":"https://doi.org/10.1109/3dic.2013.6702358","title":"TSV capacitance aware 3-D floorplanning","display_name":"TSV capacitance aware 3-D floorplanning","publication_year":2013,"publication_date":"2013-10-01","ids":{"openalex":"https://openalex.org/W2019266502","doi":"https://doi.org/10.1109/3dic.2013.6702358","mag":"2019266502"},"language":"en","primary_location":{"id":"doi:10.1109/3dic.2013.6702358","is_oa":false,"landing_page_url":"https://doi.org/10.1109/3dic.2013.6702358","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2013 IEEE International 3D Systems Integration Conference (3DIC)","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5100836275","display_name":"Mohammad Ahmed","orcid":null},"institutions":[{"id":"https://openalex.org/I126345244","display_name":"Portland State University","ror":"https://ror.org/00yn2fy02","country_code":"US","type":"education","lineage":["https://openalex.org/I126345244"]}],"countries":["US"],"is_corresponding":true,"raw_author_name":"Mohammad A. Ahmed","raw_affiliation_strings":["Electrical and Computer Engineering, Portland State University","Portland State University, Portland, United States"],"affiliations":[{"raw_affiliation_string":"Electrical and Computer Engineering, Portland State University","institution_ids":["https://openalex.org/I126345244"]},{"raw_affiliation_string":"Portland State University, Portland, United States","institution_ids":["https://openalex.org/I126345244"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5040622659","display_name":"Malgorzata Chrzanowska-Jeske","orcid":"https://orcid.org/0000-0001-5927-1751"},"institutions":[{"id":"https://openalex.org/I126345244","display_name":"Portland State University","ror":"https://ror.org/00yn2fy02","country_code":"US","type":"education","lineage":["https://openalex.org/I126345244"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"M. Chrzanowska-Jeske","raw_affiliation_strings":["Electrical and Computer Engineering, Portland State University","Portland State University, Portland, United States"],"affiliations":[{"raw_affiliation_string":"Electrical and Computer Engineering, Portland State University","institution_ids":["https://openalex.org/I126345244"]},{"raw_affiliation_string":"Portland State University, Portland, United States","institution_ids":["https://openalex.org/I126345244"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":2,"corresponding_author_ids":["https://openalex.org/A5100836275"],"corresponding_institution_ids":["https://openalex.org/I126345244"],"apc_list":null,"apc_paid":null,"fwci":0.7093,"has_fulltext":false,"cited_by_count":7,"citation_normalized_percentile":{"value":0.7405145,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":96},"biblio":{"volume":null,"issue":null,"first_page":"1","last_page":"6"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10783","display_name":"Additive Manufacturing and 3D Printing Technologies","score":0.9919999837875366,"subfield":{"id":"https://openalex.org/subfields/2203","display_name":"Automotive Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11522","display_name":"VLSI and FPGA Design Techniques","score":0.9905999898910522,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/capacitance","display_name":"Capacitance","score":0.8595874309539795},{"id":"https://openalex.org/keywords/floorplan","display_name":"Floorplan","score":0.8526394963264465},{"id":"https://openalex.org/keywords/through-silicon-via","display_name":"Through-silicon via","score":0.799507737159729},{"id":"https://openalex.org/keywords/three-dimensional-integrated-circuit","display_name":"Three-dimensional integrated circuit","score":0.6532046794891357},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.5717670321464539},{"id":"https://openalex.org/keywords/reduction","display_name":"Reduction (mathematics)","score":0.5555039644241333},{"id":"https://openalex.org/keywords/power-consumption","display_name":"Power consumption","score":0.5429641008377075},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.4781844913959503},{"id":"https://openalex.org/keywords/redundancy","display_name":"Redundancy (engineering)","score":0.4661470949649811},{"id":"https://openalex.org/keywords/stacking","display_name":"Stacking","score":0.465257465839386},{"id":"https://openalex.org/keywords/dynamic-demand","display_name":"Dynamic demand","score":0.4367789924144745},{"id":"https://openalex.org/keywords/power","display_name":"Power (physics)","score":0.3957958221435547},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.36482685804367065},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.3268626928329468},{"id":"https://openalex.org/keywords/integrated-circuit","display_name":"Integrated circuit","score":0.292966365814209},{"id":"https://openalex.org/keywords/embedded-system","display_name":"Embedded system","score":0.25843802094459534},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.22678297758102417},{"id":"https://openalex.org/keywords/silicon","display_name":"Silicon","score":0.19094404578208923},{"id":"https://openalex.org/keywords/reliability-engineering","display_name":"Reliability engineering","score":0.07846438884735107}],"concepts":[{"id":"https://openalex.org/C30066665","wikidata":"https://www.wikidata.org/wiki/Q164399","display_name":"Capacitance","level":3,"score":0.8595874309539795},{"id":"https://openalex.org/C130145326","wikidata":"https://www.wikidata.org/wiki/Q1553985","display_name":"Floorplan","level":2,"score":0.8526394963264465},{"id":"https://openalex.org/C45632049","wikidata":"https://www.wikidata.org/wiki/Q1578120","display_name":"Through-silicon via","level":3,"score":0.799507737159729},{"id":"https://openalex.org/C59088047","wikidata":"https://www.wikidata.org/wiki/Q229370","display_name":"Three-dimensional integrated circuit","level":3,"score":0.6532046794891357},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.5717670321464539},{"id":"https://openalex.org/C111335779","wikidata":"https://www.wikidata.org/wiki/Q3454686","display_name":"Reduction (mathematics)","level":2,"score":0.5555039644241333},{"id":"https://openalex.org/C2984118289","wikidata":"https://www.wikidata.org/wiki/Q29954","display_name":"Power consumption","level":3,"score":0.5429641008377075},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.4781844913959503},{"id":"https://openalex.org/C152124472","wikidata":"https://www.wikidata.org/wiki/Q1204361","display_name":"Redundancy (engineering)","level":2,"score":0.4661470949649811},{"id":"https://openalex.org/C33347731","wikidata":"https://www.wikidata.org/wiki/Q285210","display_name":"Stacking","level":2,"score":0.465257465839386},{"id":"https://openalex.org/C45872418","wikidata":"https://www.wikidata.org/wiki/Q5318966","display_name":"Dynamic demand","level":3,"score":0.4367789924144745},{"id":"https://openalex.org/C163258240","wikidata":"https://www.wikidata.org/wiki/Q25342","display_name":"Power (physics)","level":2,"score":0.3957958221435547},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.36482685804367065},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.3268626928329468},{"id":"https://openalex.org/C530198007","wikidata":"https://www.wikidata.org/wiki/Q80831","display_name":"Integrated circuit","level":2,"score":0.292966365814209},{"id":"https://openalex.org/C149635348","wikidata":"https://www.wikidata.org/wiki/Q193040","display_name":"Embedded system","level":1,"score":0.25843802094459534},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.22678297758102417},{"id":"https://openalex.org/C544956773","wikidata":"https://www.wikidata.org/wiki/Q670","display_name":"Silicon","level":2,"score":0.19094404578208923},{"id":"https://openalex.org/C200601418","wikidata":"https://www.wikidata.org/wiki/Q2193887","display_name":"Reliability engineering","level":1,"score":0.07846438884735107},{"id":"https://openalex.org/C147789679","wikidata":"https://www.wikidata.org/wiki/Q11372","display_name":"Physical chemistry","level":1,"score":0.0},{"id":"https://openalex.org/C17525397","wikidata":"https://www.wikidata.org/wiki/Q176140","display_name":"Electrode","level":2,"score":0.0},{"id":"https://openalex.org/C2524010","wikidata":"https://www.wikidata.org/wiki/Q8087","display_name":"Geometry","level":1,"score":0.0},{"id":"https://openalex.org/C46141821","wikidata":"https://www.wikidata.org/wiki/Q209402","display_name":"Nuclear magnetic resonance","level":1,"score":0.0},{"id":"https://openalex.org/C62520636","wikidata":"https://www.wikidata.org/wiki/Q944","display_name":"Quantum mechanics","level":1,"score":0.0},{"id":"https://openalex.org/C185592680","wikidata":"https://www.wikidata.org/wiki/Q2329","display_name":"Chemistry","level":0,"score":0.0},{"id":"https://openalex.org/C33923547","wikidata":"https://www.wikidata.org/wiki/Q395","display_name":"Mathematics","level":0,"score":0.0},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/3dic.2013.6702358","is_oa":false,"landing_page_url":"https://doi.org/10.1109/3dic.2013.6702358","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2013 IEEE International 3D Systems Integration Conference (3DIC)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"id":"https://metadata.un.org/sdg/7","score":0.8899999856948853,"display_name":"Affordable and clean energy"}],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":14,"referenced_works":["https://openalex.org/W1977384983","https://openalex.org/W2031326212","https://openalex.org/W2089322412","https://openalex.org/W2109314689","https://openalex.org/W2119911998","https://openalex.org/W2139002947","https://openalex.org/W2142850400","https://openalex.org/W2142909193","https://openalex.org/W2152102280","https://openalex.org/W2152965341","https://openalex.org/W2161137937","https://openalex.org/W2162454039","https://openalex.org/W2171186885","https://openalex.org/W3145230405"],"related_works":["https://openalex.org/W2027159884","https://openalex.org/W1990828594","https://openalex.org/W2089377260","https://openalex.org/W2076263604","https://openalex.org/W2028082191","https://openalex.org/W2886805502","https://openalex.org/W2046139226","https://openalex.org/W2513353273","https://openalex.org/W2549021975","https://openalex.org/W2809933636"],"abstract_inverted_index":{"3D-IC":[0,25,38],"design":[1],"facilitates":[2],"reduction":[3],"in":[4,24,35,62,73,109],"wirelength":[5],"by":[6,28,42,113,136,142],"vertically":[7],"stacking":[8],"dies.":[9],"Through-silicon-vias":[10],"(TSVs)":[11],"are":[12,71],"used":[13],"to":[14,54],"connect":[15],"inter-die":[16],"signals.":[17],"The":[18,33,64,122],"dynamic":[19,59],"power":[20,60,107],"consumption":[21,61,108],"of":[22,90],"interconnects":[23,36,110],"is":[26,39],"contributed":[27],"wires,":[29],"buffers":[30],"and":[31,58,69,86,99,118,138],"TSVs.":[32],"delay":[34,57,127],"for":[37,120,128],"greatly":[40],"influence":[41],"TSV":[43,50,75,92,96,102],"capacitance.":[44],"In":[45],"this":[46],"paper":[47],"we":[48],"propose":[49],"capacitance-aware":[51],"3D":[52],"floorplanning":[53,105],"reduce":[55],"the":[56],"3D-interconnects.":[63],"TSVs":[65,81,133,141],"with":[66],"specified":[67],"dimensions":[68],"pitch":[70,98],"positioned":[72],"islands.":[74],"islands":[76],"offer":[77],"advantages":[78],"over":[79],"individual":[80],"like":[82],"reduced":[83],"stress":[84],"impact":[85],"more":[87],"efficient":[88],"inclusion":[89],"redundancy.":[91],"capacitance":[93,103],"depends":[94],"on":[95,111,134],"dimensions,":[97],"wire":[100],"technology.":[101],"aware":[104],"reduces":[106,125],"average":[112,135],"7%":[114],"when":[115],"using":[116,130],"Cu-TSVs":[117],"9%":[119],"W-TSVs.":[121],"approach":[123],"also":[124],"peak":[126],"nets":[129],"Cu":[131],"based":[132,140],"15%":[137],"W":[139],"21%.":[143]},"counts_by_year":[{"year":2020,"cited_by_count":1},{"year":2017,"cited_by_count":1},{"year":2016,"cited_by_count":2},{"year":2014,"cited_by_count":1}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}