{"id":"https://openalex.org/W2031263138","doi":"https://doi.org/10.1109/3dic.2013.6702355","title":"A study on wafer level TSV build-up integration method","display_name":"A study on wafer level TSV build-up integration method","publication_year":2013,"publication_date":"2013-10-01","ids":{"openalex":"https://openalex.org/W2031263138","doi":"https://doi.org/10.1109/3dic.2013.6702355","mag":"2031263138"},"language":"en","primary_location":{"id":"doi:10.1109/3dic.2013.6702355","is_oa":false,"landing_page_url":"https://doi.org/10.1109/3dic.2013.6702355","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2013 IEEE International 3D Systems Integration Conference (3DIC)","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5042954376","display_name":"Jae\u2010Hak Lee","orcid":"https://orcid.org/0000-0003-4239-9016"},"institutions":[{"id":"https://openalex.org/I4210111434","display_name":"Korea Institute of Machinery and Materials","ror":"https://ror.org/01qcq9d74","country_code":"KR","type":"facility","lineage":["https://openalex.org/I2801339556","https://openalex.org/I2801339556","https://openalex.org/I4210111434","https://openalex.org/I4210144908","https://openalex.org/I4387152098","https://openalex.org/I4387152098"]}],"countries":["KR"],"is_corresponding":true,"raw_author_name":"Jae Hak Lee","raw_affiliation_strings":["Department of Ultra Precision Machines and Systems, Korea Institute of Machinery and Materials (KIMM), Daejeon, Republic of Korea","Dept. of Ultra Precision Machines & Syst., Korea Inst. of Machinery & Mater. (KIMM), Daejeon, South Korea"],"affiliations":[{"raw_affiliation_string":"Department of Ultra Precision Machines and Systems, Korea Institute of Machinery and Materials (KIMM), Daejeon, Republic of Korea","institution_ids":["https://openalex.org/I4210111434"]},{"raw_affiliation_string":"Dept. of Ultra Precision Machines & Syst., Korea Inst. of Machinery & Mater. (KIMM), Daejeon, South Korea","institution_ids":["https://openalex.org/I4210111434"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5033739850","display_name":"Hyoung Joon Kim","orcid":null},"institutions":[{"id":"https://openalex.org/I4210111434","display_name":"Korea Institute of Machinery and Materials","ror":"https://ror.org/01qcq9d74","country_code":"KR","type":"facility","lineage":["https://openalex.org/I2801339556","https://openalex.org/I2801339556","https://openalex.org/I4210111434","https://openalex.org/I4210144908","https://openalex.org/I4387152098","https://openalex.org/I4387152098"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Hyoung Joon Kim","raw_affiliation_strings":["Department of Ultra Precision Machines and Systems, Korea Institute of Machinery and Materials (KIMM), Daejeon, Republic of Korea","Dept. of Ultra Precision Machines & Syst., Korea Inst. of Machinery & Mater. (KIMM), Daejeon, South Korea"],"affiliations":[{"raw_affiliation_string":"Department of Ultra Precision Machines and Systems, Korea Institute of Machinery and Materials (KIMM), Daejeon, Republic of Korea","institution_ids":["https://openalex.org/I4210111434"]},{"raw_affiliation_string":"Dept. of Ultra Precision Machines & Syst., Korea Inst. of Machinery & Mater. (KIMM), Daejeon, South Korea","institution_ids":["https://openalex.org/I4210111434"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5112498374","display_name":"Jun\u2010Yeob Song","orcid":null},"institutions":[{"id":"https://openalex.org/I4210111434","display_name":"Korea Institute of Machinery and Materials","ror":"https://ror.org/01qcq9d74","country_code":"KR","type":"facility","lineage":["https://openalex.org/I2801339556","https://openalex.org/I2801339556","https://openalex.org/I4210111434","https://openalex.org/I4210144908","https://openalex.org/I4387152098","https://openalex.org/I4387152098"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Jun-Yeob Song","raw_affiliation_strings":["Department of Ultra Precision Machines and Systems, Korea Institute of Machinery and Materials (KIMM), Daejeon, Republic of Korea","Dept. of Ultra Precision Machines & Syst., Korea Inst. of Machinery & Mater. (KIMM), Daejeon, South Korea"],"affiliations":[{"raw_affiliation_string":"Department of Ultra Precision Machines and Systems, Korea Institute of Machinery and Materials (KIMM), Daejeon, Republic of Korea","institution_ids":["https://openalex.org/I4210111434"]},{"raw_affiliation_string":"Dept. of Ultra Precision Machines & Syst., Korea Inst. of Machinery & Mater. (KIMM), Daejeon, South Korea","institution_ids":["https://openalex.org/I4210111434"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5100714324","display_name":"Chang Woo Lee","orcid":"https://orcid.org/0000-0002-9425-7776"},"institutions":[{"id":"https://openalex.org/I4210111434","display_name":"Korea Institute of Machinery and Materials","ror":"https://ror.org/01qcq9d74","country_code":"KR","type":"facility","lineage":["https://openalex.org/I2801339556","https://openalex.org/I2801339556","https://openalex.org/I4210111434","https://openalex.org/I4210144908","https://openalex.org/I4387152098","https://openalex.org/I4387152098"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Chang Woo Lee","raw_affiliation_strings":["Department of Ultra Precision Machines and Systems, Korea Institute of Machinery and Materials (KIMM), Daejeon, Republic of Korea","Dept. of Ultra Precision Machines & Syst., Korea Inst. of Machinery & Mater. (KIMM), Daejeon, South Korea"],"affiliations":[{"raw_affiliation_string":"Department of Ultra Precision Machines and Systems, Korea Institute of Machinery and Materials (KIMM), Daejeon, Republic of Korea","institution_ids":["https://openalex.org/I4210111434"]},{"raw_affiliation_string":"Dept. of Ultra Precision Machines & Syst., Korea Inst. of Machinery & Mater. (KIMM), Daejeon, South Korea","institution_ids":["https://openalex.org/I4210111434"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5109736801","display_name":"Tae Ho Ha","orcid":null},"institutions":[{"id":"https://openalex.org/I4210111434","display_name":"Korea Institute of Machinery and Materials","ror":"https://ror.org/01qcq9d74","country_code":"KR","type":"facility","lineage":["https://openalex.org/I2801339556","https://openalex.org/I2801339556","https://openalex.org/I4210111434","https://openalex.org/I4210144908","https://openalex.org/I4387152098","https://openalex.org/I4387152098"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Tae Ho Ha","raw_affiliation_strings":["Department of Ultra Precision Machines and Systems, Korea Institute of Machinery and Materials (KIMM), Daejeon, Republic of Korea","Dept. of Ultra Precision Machines & Syst., Korea Inst. of Machinery & Mater. (KIMM), Daejeon, South Korea"],"affiliations":[{"raw_affiliation_string":"Department of Ultra Precision Machines and Systems, Korea Institute of Machinery and Materials (KIMM), Daejeon, Republic of Korea","institution_ids":["https://openalex.org/I4210111434"]},{"raw_affiliation_string":"Dept. of Ultra Precision Machines & Syst., Korea Inst. of Machinery & Mater. (KIMM), Daejeon, South Korea","institution_ids":["https://openalex.org/I4210111434"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":5,"corresponding_author_ids":["https://openalex.org/A5042954376"],"corresponding_institution_ids":["https://openalex.org/I4210111434"],"apc_list":null,"apc_paid":null,"fwci":0.7093,"has_fulltext":false,"cited_by_count":4,"citation_normalized_percentile":{"value":0.74320367,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":96},"biblio":{"volume":null,"issue":null,"first_page":"1","last_page":"4"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.993399977684021,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10783","display_name":"Additive Manufacturing and 3D Printing Technologies","score":0.9886999726295471,"subfield":{"id":"https://openalex.org/subfields/2203","display_name":"Automotive Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/stacking","display_name":"Stacking","score":0.9222842454910278},{"id":"https://openalex.org/keywords/three-dimensional-integrated-circuit","display_name":"Three-dimensional integrated circuit","score":0.7754822969436646},{"id":"https://openalex.org/keywords/interconnection","display_name":"Interconnection","score":0.693574070930481},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.6929687261581421},{"id":"https://openalex.org/keywords/through-silicon-via","display_name":"Through-silicon via","score":0.6727582216262817},{"id":"https://openalex.org/keywords/wafer","display_name":"Wafer","score":0.6648179292678833},{"id":"https://openalex.org/keywords/stack","display_name":"Stack (abstract data type)","score":0.612684965133667},{"id":"https://openalex.org/keywords/reliability","display_name":"Reliability (semiconductor)","score":0.6043925285339355},{"id":"https://openalex.org/keywords/chip","display_name":"Chip","score":0.49679067730903625},{"id":"https://openalex.org/keywords/thermocompression-bonding","display_name":"Thermocompression bonding","score":0.49671703577041626},{"id":"https://openalex.org/keywords/yield","display_name":"Yield (engineering)","score":0.4918477535247803},{"id":"https://openalex.org/keywords/throughput","display_name":"Throughput","score":0.45799240469932556},{"id":"https://openalex.org/keywords/process","display_name":"Process (computing)","score":0.4531233608722687},{"id":"https://openalex.org/keywords/stress","display_name":"Stress (linguistics)","score":0.42696523666381836},{"id":"https://openalex.org/keywords/anodic-bonding","display_name":"Anodic bonding","score":0.4107826054096222},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.37670260667800903},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.3749006688594818},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.3439982533454895},{"id":"https://openalex.org/keywords/integrated-circuit","display_name":"Integrated circuit","score":0.32858940958976746},{"id":"https://openalex.org/keywords/power","display_name":"Power (physics)","score":0.23243707418441772},{"id":"https://openalex.org/keywords/composite-material","display_name":"Composite material","score":0.19897732138633728},{"id":"https://openalex.org/keywords/layer","display_name":"Layer (electronics)","score":0.19821399450302124},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.14277786016464233}],"concepts":[{"id":"https://openalex.org/C33347731","wikidata":"https://www.wikidata.org/wiki/Q285210","display_name":"Stacking","level":2,"score":0.9222842454910278},{"id":"https://openalex.org/C59088047","wikidata":"https://www.wikidata.org/wiki/Q229370","display_name":"Three-dimensional integrated circuit","level":3,"score":0.7754822969436646},{"id":"https://openalex.org/C123745756","wikidata":"https://www.wikidata.org/wiki/Q1665949","display_name":"Interconnection","level":2,"score":0.693574070930481},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.6929687261581421},{"id":"https://openalex.org/C45632049","wikidata":"https://www.wikidata.org/wiki/Q1578120","display_name":"Through-silicon via","level":3,"score":0.6727582216262817},{"id":"https://openalex.org/C160671074","wikidata":"https://www.wikidata.org/wiki/Q267131","display_name":"Wafer","level":2,"score":0.6648179292678833},{"id":"https://openalex.org/C9395851","wikidata":"https://www.wikidata.org/wiki/Q177929","display_name":"Stack (abstract data type)","level":2,"score":0.612684965133667},{"id":"https://openalex.org/C43214815","wikidata":"https://www.wikidata.org/wiki/Q7310987","display_name":"Reliability (semiconductor)","level":3,"score":0.6043925285339355},{"id":"https://openalex.org/C165005293","wikidata":"https://www.wikidata.org/wiki/Q1074500","display_name":"Chip","level":2,"score":0.49679067730903625},{"id":"https://openalex.org/C201845621","wikidata":"https://www.wikidata.org/wiki/Q1111341","display_name":"Thermocompression bonding","level":3,"score":0.49671703577041626},{"id":"https://openalex.org/C134121241","wikidata":"https://www.wikidata.org/wiki/Q899301","display_name":"Yield (engineering)","level":2,"score":0.4918477535247803},{"id":"https://openalex.org/C157764524","wikidata":"https://www.wikidata.org/wiki/Q1383412","display_name":"Throughput","level":3,"score":0.45799240469932556},{"id":"https://openalex.org/C98045186","wikidata":"https://www.wikidata.org/wiki/Q205663","display_name":"Process (computing)","level":2,"score":0.4531233608722687},{"id":"https://openalex.org/C21036866","wikidata":"https://www.wikidata.org/wiki/Q181767","display_name":"Stress (linguistics)","level":2,"score":0.42696523666381836},{"id":"https://openalex.org/C201414436","wikidata":"https://www.wikidata.org/wiki/Q567503","display_name":"Anodic bonding","level":3,"score":0.4107826054096222},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.37670260667800903},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.3749006688594818},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.3439982533454895},{"id":"https://openalex.org/C530198007","wikidata":"https://www.wikidata.org/wiki/Q80831","display_name":"Integrated circuit","level":2,"score":0.32858940958976746},{"id":"https://openalex.org/C163258240","wikidata":"https://www.wikidata.org/wiki/Q25342","display_name":"Power (physics)","level":2,"score":0.23243707418441772},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.19897732138633728},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.19821399450302124},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.14277786016464233},{"id":"https://openalex.org/C46141821","wikidata":"https://www.wikidata.org/wiki/Q209402","display_name":"Nuclear magnetic resonance","level":1,"score":0.0},{"id":"https://openalex.org/C31258907","wikidata":"https://www.wikidata.org/wiki/Q1301371","display_name":"Computer network","level":1,"score":0.0},{"id":"https://openalex.org/C62520636","wikidata":"https://www.wikidata.org/wiki/Q944","display_name":"Quantum mechanics","level":1,"score":0.0},{"id":"https://openalex.org/C111919701","wikidata":"https://www.wikidata.org/wiki/Q9135","display_name":"Operating system","level":1,"score":0.0},{"id":"https://openalex.org/C41895202","wikidata":"https://www.wikidata.org/wiki/Q8162","display_name":"Linguistics","level":1,"score":0.0},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.0},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.0},{"id":"https://openalex.org/C199360897","wikidata":"https://www.wikidata.org/wiki/Q9143","display_name":"Programming language","level":1,"score":0.0},{"id":"https://openalex.org/C138885662","wikidata":"https://www.wikidata.org/wiki/Q5891","display_name":"Philosophy","level":0,"score":0.0},{"id":"https://openalex.org/C555944384","wikidata":"https://www.wikidata.org/wiki/Q249","display_name":"Wireless","level":2,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/3dic.2013.6702355","is_oa":false,"landing_page_url":"https://doi.org/10.1109/3dic.2013.6702355","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2013 IEEE International 3D Systems Integration Conference (3DIC)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"display_name":"Affordable and clean energy","id":"https://metadata.un.org/sdg/7","score":0.8600000143051147}],"awards":[],"funders":[{"id":"https://openalex.org/F4320322066","display_name":"Korea Research Council for Industrial Science and Technology","ror":"https://ror.org/039fwba89"}],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":5,"referenced_works":["https://openalex.org/W173866309","https://openalex.org/W1993400043","https://openalex.org/W2158523395","https://openalex.org/W2484844306","https://openalex.org/W4239250096"],"related_works":["https://openalex.org/W1990828594","https://openalex.org/W2016970881","https://openalex.org/W2027159884","https://openalex.org/W2090223096","https://openalex.org/W2333804548","https://openalex.org/W2534942874","https://openalex.org/W3093450488","https://openalex.org/W3211414309","https://openalex.org/W2971335276","https://openalex.org/W2016589506"],"abstract_inverted_index":{"TSV":[0,167,171,180],"(Through-Silicon":[1],"Via)":[2],"3D":[3,59,71,75,97,114],"packaging":[4],"technology":[5,61],"has":[6,66,80],"been":[7],"and":[8,19,30,44,74,86,138,149,168],"continues":[9],"to":[10,26,104,160,191],"be":[11,101],"investigated":[12],"by":[13,53],"many":[14],"of":[15,50,83,113,121],"the":[16,81,94,119,162,169,178,186,194],"semiconductor":[17],"manufacturer":[18],"research":[20],"institute":[21],"as":[22,70],"a":[23],"practical":[24],"way":[25],"achieve":[27],"higher":[28,87],"performance":[29],"smaller":[31],"form":[32],"factors.":[33],"Compared":[34],"with":[35,90,106,189],"conventional":[36,166,187],"2D":[37],"packaging,":[38],"this":[39,126],"can":[40,100],"increase":[41],"packing":[42],"density":[43],"reduce":[45],"power":[46],"consumption":[47],"dramatically":[48],"because":[49,78,110],"shorter":[51],"interconnection":[52],"vertical":[54],"directional":[55],"stacking.":[56],"So":[57],"far":[58],"stacking":[60,76,98,115,133],"based":[62],"on":[63,118],"W2W":[64],"bonding":[65,137,145],"developed":[67],"widely":[68],"such":[69],"Image":[72],"sensor":[73],"memory":[77],"it":[79,151],"advantage":[82],"easier":[84],"alignment":[85],"throughput":[88],"compared":[89],"chip-to-chip":[91],"bonding.":[92],"However,":[93],"wafer":[95,130],"level":[96,131],"method":[99],"only":[102],"applicable":[103],"products":[105],"high":[107],"production":[108],"yield":[109,112,120],"overall":[111],"chips":[116],"depends":[117],"multiple":[122],"stacked":[123],"layers.":[124],"In":[125],"paper,":[127],"we":[128],"suggested":[129],"build-up":[132],"process":[134,146],"using":[135],"oxide":[136],"molten":[139],"metal":[140],"filling":[141],"newly,":[142],"which":[143],"temporary":[144],"is":[147,182],"unnecessary":[148],"demonstrated":[150],"through":[152],"experiments.":[153],"Thermal":[154],"stress":[155,192],"analysis":[156],"was":[157],"carried":[158],"out":[159],"compare":[161],"structural":[163],"reliability":[164],"between":[165],"proposed":[170,179],"model.":[172],"The":[173],"simulation":[174],"results":[175],"indicate":[176],"that":[177],"model":[181,188],"more":[183],"reliable":[184],"than":[185],"respect":[190],"in":[193],"stack":[195],"chip.":[196]},"counts_by_year":[{"year":2021,"cited_by_count":1},{"year":2016,"cited_by_count":2},{"year":2015,"cited_by_count":1}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}