{"id":"https://openalex.org/W1982770732","doi":"https://doi.org/10.1109/3dic.2013.6702353","title":"High performance 3D stacked DRAM processor architectures with micro-fluidic cooling","display_name":"High performance 3D stacked DRAM processor architectures with micro-fluidic cooling","publication_year":2013,"publication_date":"2013-10-01","ids":{"openalex":"https://openalex.org/W1982770732","doi":"https://doi.org/10.1109/3dic.2013.6702353","mag":"1982770732"},"language":"en","primary_location":{"id":"doi:10.1109/3dic.2013.6702353","is_oa":false,"landing_page_url":"https://doi.org/10.1109/3dic.2013.6702353","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2013 IEEE International 3D Systems Integration Conference (3DIC)","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5082126220","display_name":"Caleb Serafy","orcid":null},"institutions":[{"id":"https://openalex.org/I66946132","display_name":"University of Maryland, College Park","ror":"https://ror.org/047s2c258","country_code":"US","type":"education","lineage":["https://openalex.org/I66946132"]}],"countries":["US"],"is_corresponding":true,"raw_author_name":"Caleb Serafy","raw_affiliation_strings":["Department of Electrical and Computer Engineering, University of Maryland, Maryland","Dept of Electr. & Comput. Eng., Univ. of Maryland, College Park, MD, USA"],"affiliations":[{"raw_affiliation_string":"Department of Electrical and Computer Engineering, University of Maryland, Maryland","institution_ids":["https://openalex.org/I66946132"]},{"raw_affiliation_string":"Dept of Electr. & Comput. Eng., Univ. of Maryland, College Park, MD, USA","institution_ids":["https://openalex.org/I66946132"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5064598993","display_name":"Bing Shi","orcid":"https://orcid.org/0000-0002-5828-1736"},"institutions":[{"id":"https://openalex.org/I66946132","display_name":"University of Maryland, College Park","ror":"https://ror.org/047s2c258","country_code":"US","type":"education","lineage":["https://openalex.org/I66946132"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Bing Shi","raw_affiliation_strings":["Department of Electrical and Computer Engineering, University of Maryland, Maryland","Dept of Electr. & Comput. Eng., Univ. of Maryland, College Park, MD, USA"],"affiliations":[{"raw_affiliation_string":"Department of Electrical and Computer Engineering, University of Maryland, Maryland","institution_ids":["https://openalex.org/I66946132"]},{"raw_affiliation_string":"Dept of Electr. & Comput. Eng., Univ. of Maryland, College Park, MD, USA","institution_ids":["https://openalex.org/I66946132"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5089770783","display_name":"Ankur Srivastava","orcid":"https://orcid.org/0000-0002-5445-904X"},"institutions":[{"id":"https://openalex.org/I66946132","display_name":"University of Maryland, College Park","ror":"https://ror.org/047s2c258","country_code":"US","type":"education","lineage":["https://openalex.org/I66946132"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Ankur Srivastava","raw_affiliation_strings":["Department of Electrical and Computer Engineering, University of Maryland, Maryland","Dept of Electr. & Comput. Eng., Univ. of Maryland, College Park, MD, USA"],"affiliations":[{"raw_affiliation_string":"Department of Electrical and Computer Engineering, University of Maryland, Maryland","institution_ids":["https://openalex.org/I66946132"]},{"raw_affiliation_string":"Dept of Electr. & Comput. Eng., Univ. of Maryland, College Park, MD, USA","institution_ids":["https://openalex.org/I66946132"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5042239243","display_name":"Donald Yeung","orcid":"https://orcid.org/0000-0003-0341-2644"},"institutions":[{"id":"https://openalex.org/I66946132","display_name":"University of Maryland, College Park","ror":"https://ror.org/047s2c258","country_code":"US","type":"education","lineage":["https://openalex.org/I66946132"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Donald Yeung","raw_affiliation_strings":["Department of Electrical and Computer Engineering, University of Maryland, Maryland","Dept of Electr. & Comput. Eng., Univ. of Maryland, College Park, MD, USA"],"affiliations":[{"raw_affiliation_string":"Department of Electrical and Computer Engineering, University of Maryland, Maryland","institution_ids":["https://openalex.org/I66946132"]},{"raw_affiliation_string":"Dept of Electr. & Comput. Eng., Univ. of Maryland, College Park, MD, USA","institution_ids":["https://openalex.org/I66946132"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":4,"corresponding_author_ids":["https://openalex.org/A5082126220"],"corresponding_institution_ids":["https://openalex.org/I66946132"],"apc_list":null,"apc_paid":null,"fwci":0.3152,"has_fulltext":false,"cited_by_count":5,"citation_normalized_percentile":{"value":0.57619855,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":90,"max":96},"biblio":{"volume":null,"issue":null,"first_page":"1","last_page":"8"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10054","display_name":"Parallel Computing and Optimization Techniques","score":0.9997000098228455,"subfield":{"id":"https://openalex.org/subfields/1708","display_name":"Hardware and Architecture"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10054","display_name":"Parallel Computing and Optimization Techniques","score":0.9997000098228455,"subfield":{"id":"https://openalex.org/subfields/1708","display_name":"Hardware and Architecture"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10502","display_name":"Advanced Memory and Neural Computing","score":0.9968000054359436,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11181","display_name":"Advanced Data Storage Technologies","score":0.9937999844551086,"subfield":{"id":"https://openalex.org/subfields/1705","display_name":"Computer Networks and Communications"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/dram","display_name":"Dram","score":0.6860876679420471},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.6484671831130981},{"id":"https://openalex.org/keywords/computer-cooling","display_name":"Computer cooling","score":0.6019962430000305},{"id":"https://openalex.org/keywords/embedded-system","display_name":"Embedded system","score":0.5460479259490967},{"id":"https://openalex.org/keywords/efficient-energy-use","display_name":"Efficient energy use","score":0.5270258188247681},{"id":"https://openalex.org/keywords/chip","display_name":"Chip","score":0.4756457507610321},{"id":"https://openalex.org/keywords/microarchitecture","display_name":"Microarchitecture","score":0.4649117887020111},{"id":"https://openalex.org/keywords/performance-improvement","display_name":"Performance improvement","score":0.4240020215511322},{"id":"https://openalex.org/keywords/thermal-management-of-electronic-devices-and-systems","display_name":"Thermal management of electronic devices and systems","score":0.3006507456302643},{"id":"https://openalex.org/keywords/computer-hardware","display_name":"Computer hardware","score":0.2536157965660095},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.17858275771141052},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.16939809918403625},{"id":"https://openalex.org/keywords/mechanical-engineering","display_name":"Mechanical engineering","score":0.1693907082080841}],"concepts":[{"id":"https://openalex.org/C7366592","wikidata":"https://www.wikidata.org/wiki/Q1255620","display_name":"Dram","level":2,"score":0.6860876679420471},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.6484671831130981},{"id":"https://openalex.org/C11026015","wikidata":"https://www.wikidata.org/wiki/Q840551","display_name":"Computer cooling","level":3,"score":0.6019962430000305},{"id":"https://openalex.org/C149635348","wikidata":"https://www.wikidata.org/wiki/Q193040","display_name":"Embedded system","level":1,"score":0.5460479259490967},{"id":"https://openalex.org/C2742236","wikidata":"https://www.wikidata.org/wiki/Q924713","display_name":"Efficient energy use","level":2,"score":0.5270258188247681},{"id":"https://openalex.org/C165005293","wikidata":"https://www.wikidata.org/wiki/Q1074500","display_name":"Chip","level":2,"score":0.4756457507610321},{"id":"https://openalex.org/C107598950","wikidata":"https://www.wikidata.org/wiki/Q259864","display_name":"Microarchitecture","level":2,"score":0.4649117887020111},{"id":"https://openalex.org/C2778915421","wikidata":"https://www.wikidata.org/wiki/Q3643177","display_name":"Performance improvement","level":2,"score":0.4240020215511322},{"id":"https://openalex.org/C114834414","wikidata":"https://www.wikidata.org/wiki/Q15477170","display_name":"Thermal management of electronic devices and systems","level":2,"score":0.3006507456302643},{"id":"https://openalex.org/C9390403","wikidata":"https://www.wikidata.org/wiki/Q3966","display_name":"Computer hardware","level":1,"score":0.2536157965660095},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.17858275771141052},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.16939809918403625},{"id":"https://openalex.org/C78519656","wikidata":"https://www.wikidata.org/wiki/Q101333","display_name":"Mechanical engineering","level":1,"score":0.1693907082080841},{"id":"https://openalex.org/C21547014","wikidata":"https://www.wikidata.org/wiki/Q1423657","display_name":"Operations management","level":1,"score":0.0},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/3dic.2013.6702353","is_oa":false,"landing_page_url":"https://doi.org/10.1109/3dic.2013.6702353","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2013 IEEE International 3D Systems Integration Conference (3DIC)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"score":0.8999999761581421,"display_name":"Affordable and clean energy","id":"https://metadata.un.org/sdg/7"}],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":17,"referenced_works":["https://openalex.org/W1993089791","https://openalex.org/W2038061869","https://openalex.org/W2106342588","https://openalex.org/W2114727053","https://openalex.org/W2117236903","https://openalex.org/W2122636510","https://openalex.org/W2126339718","https://openalex.org/W2129960401","https://openalex.org/W2131413854","https://openalex.org/W2133279383","https://openalex.org/W2137001807","https://openalex.org/W2139730616","https://openalex.org/W2141923369","https://openalex.org/W2149043897","https://openalex.org/W2170382128","https://openalex.org/W2171969605","https://openalex.org/W3139689176"],"related_works":["https://openalex.org/W4400036629","https://openalex.org/W2765638973","https://openalex.org/W1991777115","https://openalex.org/W2334185725","https://openalex.org/W2274093345","https://openalex.org/W2396347320","https://openalex.org/W4200509154","https://openalex.org/W4386262739","https://openalex.org/W2147685934","https://openalex.org/W2742900615"],"abstract_inverted_index":{"In":[0,19],"this":[1],"work":[2],"we":[3],"consider":[4],"new":[5,50,110],"3D":[6,23,66,77,135],"IC":[7],"processor":[8,78,138],"architectures":[9,38,113],"that":[10,53,70],"become":[11,107],"feasible":[12],"only":[13],"when":[14,59,117,132],"aggressive":[15,163,197],"cooling":[16,61,118,150,180,198],"is":[17,27,54,62,119],"used.":[18],"traditional":[20],"air":[21],"cooled":[22],"processors,":[24],"heat":[25],"removal":[26],"a":[28,76,126,134,176],"big":[29],"issue,":[30],"and":[31,109,140],"so":[32],"designers":[33],"often":[34],"pursue":[35],"low":[36],"performance":[37,105,112,131,145,194],"in":[39,86,129,179,193],"order":[40],"to":[41,47,56,64,75,183,196,200],"prevent":[42],"thermal":[43],"violations.":[44],"We":[45,68,124],"attempt":[46],"explore":[48],"the":[49,65,81,92,122,149,152,169,173,186],"design":[51],"space":[52],"available":[55],"computer":[57],"architects":[58],"micro-fluidic":[60,102,142],"applied":[63],"chip.":[67],"show":[69],"adding":[71,155],"more":[72,156,162],"memory":[73,137,157],"controllers":[74,158],"can":[79,114],"offer":[80],"potential":[82],"for":[83],"huge":[84],"increases":[85,91,106],"performance,":[87],"but":[88],"also":[89,167],"drastically":[90],"temperature":[93],"of":[94,154,172],"an":[95],"uncooled":[96],"chip,":[97],"making":[98],"them":[99],"infeasible.":[100],"With":[101],"cooling,":[103],"these":[104],"realizable":[108],"high":[111],"be":[115],"designed":[116],"co-designed":[120],"with":[121,139,191],"architecture.":[123],"observe":[125],"2.4x":[127],"increase":[128,146,178,201],"average":[130,205],"comparing":[133],"stacked":[136],"without":[141],"cooling.":[143],"This":[144,189],"occurs":[147],"because":[148],"unlocks":[151],"possibility":[153],"as":[159,161],"well":[160],"frequency":[164],"scaling.":[165],"Cooling":[166],"improves":[168],"energy":[170,202],"efficiency":[171,203],"processors":[174],"since":[175],"slight":[177],"power":[181],"helps":[182,199],"significantly":[184],"reduce":[185],"leakage":[187],"levels.":[188],"combined":[190],"improvements":[192],"due":[195],"on":[204],"16.8x.":[206]},"counts_by_year":[{"year":2018,"cited_by_count":2},{"year":2017,"cited_by_count":2},{"year":2016,"cited_by_count":1}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}