{"id":"https://openalex.org/W2025217908","doi":"https://doi.org/10.1109/3dic.2013.6702338","title":"Highly efficient TSV repair technology for resilient 3-D stacked multicore processor system","display_name":"Highly efficient TSV repair technology for resilient 3-D stacked multicore processor system","publication_year":2013,"publication_date":"2013-10-01","ids":{"openalex":"https://openalex.org/W2025217908","doi":"https://doi.org/10.1109/3dic.2013.6702338","mag":"2025217908"},"language":"en","primary_location":{"id":"doi:10.1109/3dic.2013.6702338","is_oa":false,"landing_page_url":"https://doi.org/10.1109/3dic.2013.6702338","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2013 IEEE International 3D Systems Integration Conference (3DIC)","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5101642244","display_name":"Hiroyuki Hashimoto","orcid":"https://orcid.org/0000-0002-9458-8583"},"institutions":[{"id":"https://openalex.org/I201537933","display_name":"Tohoku University","ror":"https://ror.org/01dq60k83","country_code":"JP","type":"education","lineage":["https://openalex.org/I201537933"]}],"countries":["JP"],"is_corresponding":true,"raw_author_name":"H. Hashimoto","raw_affiliation_strings":["New Industry Creation Hatchery Center (NICHe), Tohoku University, Sendai, Japan","New Ind. Creation Hatchery Center (NICHe), Tohoku Univ., Sendai, Japan"],"affiliations":[{"raw_affiliation_string":"New Industry Creation Hatchery Center (NICHe), Tohoku University, Sendai, Japan","institution_ids":["https://openalex.org/I201537933"]},{"raw_affiliation_string":"New Ind. Creation Hatchery Center (NICHe), Tohoku Univ., Sendai, Japan","institution_ids":["https://openalex.org/I201537933"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5041535044","display_name":"Takafumi Fukushima","orcid":"https://orcid.org/0000-0003-2303-8178"},"institutions":[{"id":"https://openalex.org/I201537933","display_name":"Tohoku University","ror":"https://ror.org/01dq60k83","country_code":"JP","type":"education","lineage":["https://openalex.org/I201537933"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"T. Fukushima","raw_affiliation_strings":["New Industry Creation Hatchery Center (NICHe), Tohoku University, Sendai, Japan","New Ind. Creation Hatchery Center (NICHe), Tohoku Univ., Sendai, Japan"],"affiliations":[{"raw_affiliation_string":"New Industry Creation Hatchery Center (NICHe), Tohoku University, Sendai, Japan","institution_ids":["https://openalex.org/I201537933"]},{"raw_affiliation_string":"New Ind. Creation Hatchery Center (NICHe), Tohoku Univ., Sendai, Japan","institution_ids":["https://openalex.org/I201537933"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5111969982","display_name":"K. W. Lee","orcid":null},"institutions":[{"id":"https://openalex.org/I201537933","display_name":"Tohoku University","ror":"https://ror.org/01dq60k83","country_code":"JP","type":"education","lineage":["https://openalex.org/I201537933"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"K. W. Lee","raw_affiliation_strings":["New Industry Creation Hatchery Center (NICHe), Tohoku University, Sendai, Japan","New Ind. Creation Hatchery Center (NICHe), Tohoku Univ., Sendai, Japan"],"affiliations":[{"raw_affiliation_string":"New Industry Creation Hatchery Center (NICHe), Tohoku University, Sendai, Japan","institution_ids":["https://openalex.org/I201537933"]},{"raw_affiliation_string":"New Ind. Creation Hatchery Center (NICHe), Tohoku Univ., Sendai, Japan","institution_ids":["https://openalex.org/I201537933"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5059487693","display_name":"Mitsumasa Koyanagi","orcid":"https://orcid.org/0000-0003-4726-4217"},"institutions":[{"id":"https://openalex.org/I201537933","display_name":"Tohoku University","ror":"https://ror.org/01dq60k83","country_code":"JP","type":"education","lineage":["https://openalex.org/I201537933"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"M. Koyanagi","raw_affiliation_strings":["New Industry Creation Hatchery Center (NICHe), Tohoku University, Sendai, Japan","New Ind. Creation Hatchery Center (NICHe), Tohoku Univ., Sendai, Japan"],"affiliations":[{"raw_affiliation_string":"New Industry Creation Hatchery Center (NICHe), Tohoku University, Sendai, Japan","institution_ids":["https://openalex.org/I201537933"]},{"raw_affiliation_string":"New Ind. Creation Hatchery Center (NICHe), Tohoku Univ., Sendai, Japan","institution_ids":["https://openalex.org/I201537933"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5006295728","display_name":"Tetsu Tanaka","orcid":"https://orcid.org/0000-0001-7414-315X"},"institutions":[{"id":"https://openalex.org/I201537933","display_name":"Tohoku University","ror":"https://ror.org/01dq60k83","country_code":"JP","type":"education","lineage":["https://openalex.org/I201537933"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"T. Tanaka","raw_affiliation_strings":["Department of Biomedical engineering, Tohoku University, Sendai, Japan","Dept. of Biomed. Eng., Tohoku Univ., Sendai, Japan"],"affiliations":[{"raw_affiliation_string":"Department of Biomedical engineering, Tohoku University, Sendai, Japan","institution_ids":["https://openalex.org/I201537933"]},{"raw_affiliation_string":"Dept. of Biomed. Eng., Tohoku Univ., Sendai, Japan","institution_ids":["https://openalex.org/I201537933"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":5,"corresponding_author_ids":["https://openalex.org/A5101642244"],"corresponding_institution_ids":["https://openalex.org/I201537933"],"apc_list":null,"apc_paid":null,"fwci":0.7093,"has_fulltext":false,"cited_by_count":4,"citation_normalized_percentile":{"value":0.74182478,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":96},"biblio":{"volume":null,"issue":null,"first_page":"1","last_page":"5"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10783","display_name":"Additive Manufacturing and 3D Printing Technologies","score":0.9948999881744385,"subfield":{"id":"https://openalex.org/subfields/2203","display_name":"Automotive Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10472","display_name":"Semiconductor materials and devices","score":0.9891999959945679,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/multi-core-processor","display_name":"Multi-core processor","score":0.7762659788131714},{"id":"https://openalex.org/keywords/dependability","display_name":"Dependability","score":0.7116720080375671},{"id":"https://openalex.org/keywords/spare-part","display_name":"Spare part","score":0.6395267844200134},{"id":"https://openalex.org/keywords/embedded-system","display_name":"Embedded system","score":0.619356632232666},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.5996991991996765},{"id":"https://openalex.org/keywords/three-dimensional-integrated-circuit","display_name":"Three-dimensional integrated circuit","score":0.5377907752990723},{"id":"https://openalex.org/keywords/chip","display_name":"Chip","score":0.4485878646373749},{"id":"https://openalex.org/keywords/parallel-computing","display_name":"Parallel computing","score":0.265100359916687},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.24352332949638367},{"id":"https://openalex.org/keywords/telecommunications","display_name":"Telecommunications","score":0.06906348466873169}],"concepts":[{"id":"https://openalex.org/C78766204","wikidata":"https://www.wikidata.org/wiki/Q555032","display_name":"Multi-core processor","level":2,"score":0.7762659788131714},{"id":"https://openalex.org/C77019957","wikidata":"https://www.wikidata.org/wiki/Q2689057","display_name":"Dependability","level":2,"score":0.7116720080375671},{"id":"https://openalex.org/C194648553","wikidata":"https://www.wikidata.org/wiki/Q1364774","display_name":"Spare part","level":2,"score":0.6395267844200134},{"id":"https://openalex.org/C149635348","wikidata":"https://www.wikidata.org/wiki/Q193040","display_name":"Embedded system","level":1,"score":0.619356632232666},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.5996991991996765},{"id":"https://openalex.org/C59088047","wikidata":"https://www.wikidata.org/wiki/Q229370","display_name":"Three-dimensional integrated circuit","level":3,"score":0.5377907752990723},{"id":"https://openalex.org/C165005293","wikidata":"https://www.wikidata.org/wiki/Q1074500","display_name":"Chip","level":2,"score":0.4485878646373749},{"id":"https://openalex.org/C173608175","wikidata":"https://www.wikidata.org/wiki/Q232661","display_name":"Parallel computing","level":1,"score":0.265100359916687},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.24352332949638367},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.06906348466873169},{"id":"https://openalex.org/C78519656","wikidata":"https://www.wikidata.org/wiki/Q101333","display_name":"Mechanical engineering","level":1,"score":0.0},{"id":"https://openalex.org/C115903868","wikidata":"https://www.wikidata.org/wiki/Q80993","display_name":"Software engineering","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/3dic.2013.6702338","is_oa":false,"landing_page_url":"https://doi.org/10.1109/3dic.2013.6702338","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2013 IEEE International 3D Systems Integration Conference (3DIC)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"id":"https://metadata.un.org/sdg/7","display_name":"Affordable and clean energy","score":0.4699999988079071}],"awards":[],"funders":[{"id":"https://openalex.org/F4320338075","display_name":"Core Research for Evolutional Science and Technology","ror":"https://ror.org/00097mb19"}],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":5,"referenced_works":["https://openalex.org/W614595877","https://openalex.org/W2062899780","https://openalex.org/W2107304970","https://openalex.org/W2151613126","https://openalex.org/W6676317001"],"related_works":["https://openalex.org/W2169628522","https://openalex.org/W4252527915","https://openalex.org/W2409287660","https://openalex.org/W2233357156","https://openalex.org/W1976489385","https://openalex.org/W4256317220","https://openalex.org/W1506225852","https://openalex.org/W2141414364","https://openalex.org/W2376514150","https://openalex.org/W1523265213"],"abstract_inverted_index":{"Over":[0],"the":[1,44,47,54,104],"scaling":[2],"limit,":[3],"3D":[4,20,42],"LSI":[5,21],"using":[6],"Through":[7],"Silicon":[8],"Vias":[9],"(TSVs)":[10],"brings":[11],"in":[12,31],"a":[13,64],"huge":[14],"number":[15],"of":[16,46,56,92],"additional":[17],"logic":[18],"gates.":[19],"technology":[22],"allows":[23],"LSIs":[24],"to":[25,33,52,74,85],"adopt":[26],"redundant":[27,87],"or":[28,38],"spare":[29],"modules":[30],"order":[32],"raise":[34],"its":[35,98],"availability,":[36],"dependability":[37],"resiliency.":[39],"For":[40],"such":[41],"LSI,":[43],"one":[45],"most":[48],"important":[49,84],"matter":[50],"is":[51,72,83],"increase":[53],"connectivity":[55],"vertical":[57],"connections":[58],"between":[59],"stacked":[60,67,107],"tiers.":[61],"To":[62],"achieve":[63],"resilient":[65,105],"3-D":[66,106],"multicore":[68,108],"processor":[69,101,109],"system,":[70],"it":[71,82],"indispensable":[73],"develop":[75],"TSV":[76,118],"self-test":[77],"and":[78,113],"self-repair":[79],"circuit.":[80],"Especially,":[81],"reduce":[86],"TSVs":[88],"with":[89,115],"large-pitch":[90],"because":[91],"their":[93],"area":[94],"cost":[95],"while":[96],"increasing":[97],"repairability.":[99],"The":[100],"chip":[102],"for":[103],"has":[110],"been":[111],"designed":[112],"fabricated":[114],"highly":[116],"area-efficient":[117],"repair":[119],"technology.":[120]},"counts_by_year":[{"year":2017,"cited_by_count":1},{"year":2014,"cited_by_count":2},{"year":2013,"cited_by_count":1}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}