{"id":"https://openalex.org/W1980185380","doi":"https://doi.org/10.1109/3dic.2013.6702336","title":"Impact of 3-D integration process on memory retention characteristics in thinned DRAM chip for 3-D memory","display_name":"Impact of 3-D integration process on memory retention characteristics in thinned DRAM chip for 3-D memory","publication_year":2013,"publication_date":"2013-10-01","ids":{"openalex":"https://openalex.org/W1980185380","doi":"https://doi.org/10.1109/3dic.2013.6702336","mag":"1980185380"},"language":"en","primary_location":{"id":"doi:10.1109/3dic.2013.6702336","is_oa":false,"landing_page_url":"https://doi.org/10.1109/3dic.2013.6702336","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2013 IEEE International 3D Systems Integration Conference (3DIC)","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5018052057","display_name":"Kyung-Woo Lee","orcid":"https://orcid.org/0000-0002-3533-7979"},"institutions":[{"id":"https://openalex.org/I201537933","display_name":"Tohoku University","ror":"https://ror.org/01dq60k83","country_code":"JP","type":"education","lineage":["https://openalex.org/I201537933"]}],"countries":["JP"],"is_corresponding":true,"raw_author_name":"K-W Lee","raw_affiliation_strings":["Global INTegration Initiative (GINTI), Tohoku Univ., Japan","New Ind. Creation Hatchery Center (NICHe), Tohoku Univ., Sendai, Japan"],"affiliations":[{"raw_affiliation_string":"Global INTegration Initiative (GINTI), Tohoku Univ., Japan","institution_ids":["https://openalex.org/I201537933"]},{"raw_affiliation_string":"New Ind. Creation Hatchery Center (NICHe), Tohoku Univ., Sendai, Japan","institution_ids":["https://openalex.org/I201537933"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5112348824","display_name":"S. Tanikawa","orcid":null},"institutions":[{"id":"https://openalex.org/I201537933","display_name":"Tohoku University","ror":"https://ror.org/01dq60k83","country_code":"JP","type":"education","lineage":["https://openalex.org/I201537933"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"S. Tanikawa","raw_affiliation_strings":["Department of Biomedical Engineering, Tohoku Univ., Sendai, Japan","Dept. of Biomed. Eng., Tohoku Univ., Sendai, Japan"],"affiliations":[{"raw_affiliation_string":"Department of Biomedical Engineering, Tohoku Univ., Sendai, Japan","institution_ids":["https://openalex.org/I201537933"]},{"raw_affiliation_string":"Dept. of Biomed. Eng., Tohoku Univ., Sendai, Japan","institution_ids":["https://openalex.org/I201537933"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5101440058","display_name":"M. Murugesan","orcid":"https://orcid.org/0000-0002-3510-7110"},"institutions":[{"id":"https://openalex.org/I201537933","display_name":"Tohoku University","ror":"https://ror.org/01dq60k83","country_code":"JP","type":"education","lineage":["https://openalex.org/I201537933"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"M. Murugesan","raw_affiliation_strings":["Global INTegration Initiative (GINTI), Tohoku Univ., Japan","New Ind. Creation Hatchery Center (NICHe), Tohoku Univ., Sendai, Japan"],"affiliations":[{"raw_affiliation_string":"Global INTegration Initiative (GINTI), Tohoku Univ., Japan","institution_ids":["https://openalex.org/I201537933"]},{"raw_affiliation_string":"New Ind. Creation Hatchery Center (NICHe), Tohoku Univ., Sendai, Japan","institution_ids":["https://openalex.org/I201537933"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5000773500","display_name":"Hiroshi Naganuma","orcid":"https://orcid.org/0000-0003-2966-8269"},"institutions":[{"id":"https://openalex.org/I201537933","display_name":"Tohoku University","ror":"https://ror.org/01dq60k83","country_code":"JP","type":"education","lineage":["https://openalex.org/I201537933"]},{"id":"https://openalex.org/I103605164","display_name":"Tohoku Institute of Technology","ror":"https://ror.org/01phqre83","country_code":"JP","type":"education","lineage":["https://openalex.org/I103605164"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"H. Naganuma","raw_affiliation_strings":["Tohoku Daigaku, Sendai, Miyagi, JP","Dept. of Biomed. Eng., Tohoku Univ., Sendai, Japan"],"affiliations":[{"raw_affiliation_string":"Tohoku Daigaku, Sendai, Miyagi, JP","institution_ids":["https://openalex.org/I103605164"]},{"raw_affiliation_string":"Dept. of Biomed. Eng., Tohoku Univ., Sendai, Japan","institution_ids":["https://openalex.org/I201537933"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5113620043","display_name":"J-C Bea","orcid":null},"institutions":[{"id":"https://openalex.org/I201537933","display_name":"Tohoku University","ror":"https://ror.org/01dq60k83","country_code":"JP","type":"education","lineage":["https://openalex.org/I201537933"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"J-C Bea","raw_affiliation_strings":["Global INTegration Initiative (GINTI), Tohoku Univ., Japan","New Ind. Creation Hatchery Center (NICHe), Tohoku Univ., Sendai, Japan"],"affiliations":[{"raw_affiliation_string":"Global INTegration Initiative (GINTI), Tohoku Univ., Japan","institution_ids":["https://openalex.org/I201537933"]},{"raw_affiliation_string":"New Ind. Creation Hatchery Center (NICHe), Tohoku Univ., Sendai, Japan","institution_ids":["https://openalex.org/I201537933"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5041535044","display_name":"Takafumi Fukushima","orcid":"https://orcid.org/0000-0003-2303-8178"},"institutions":[{"id":"https://openalex.org/I201537933","display_name":"Tohoku University","ror":"https://ror.org/01dq60k83","country_code":"JP","type":"education","lineage":["https://openalex.org/I201537933"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"T. Fukushima","raw_affiliation_strings":["Global INTegration Initiative (GINTI), Tohoku Univ., Japan","New Ind. Creation Hatchery Center (NICHe), Tohoku Univ., Sendai, Japan"],"affiliations":[{"raw_affiliation_string":"Global INTegration Initiative (GINTI), Tohoku Univ., Japan","institution_ids":["https://openalex.org/I201537933"]},{"raw_affiliation_string":"New Ind. Creation Hatchery Center (NICHe), Tohoku Univ., Sendai, Japan","institution_ids":["https://openalex.org/I201537933"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5006295728","display_name":"Tetsu Tanaka","orcid":"https://orcid.org/0000-0001-7414-315X"},"institutions":[{"id":"https://openalex.org/I201537933","display_name":"Tohoku University","ror":"https://ror.org/01dq60k83","country_code":"JP","type":"education","lineage":["https://openalex.org/I201537933"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"T. Tanaka","raw_affiliation_strings":["Department of Biomedical Engineering, Tohoku Univ., Sendai, Japan","Dept. of Biomed. Eng., Tohoku Univ., Sendai, Japan"],"affiliations":[{"raw_affiliation_string":"Department of Biomedical Engineering, Tohoku Univ., Sendai, Japan","institution_ids":["https://openalex.org/I201537933"]},{"raw_affiliation_string":"Dept. of Biomed. Eng., Tohoku Univ., Sendai, Japan","institution_ids":["https://openalex.org/I201537933"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5059487693","display_name":"Mitsumasa Koyanagi","orcid":"https://orcid.org/0000-0003-4726-4217"},"institutions":[{"id":"https://openalex.org/I201537933","display_name":"Tohoku University","ror":"https://ror.org/01dq60k83","country_code":"JP","type":"education","lineage":["https://openalex.org/I201537933"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"M. Koyanagi","raw_affiliation_strings":["Global INTegration Initiative (GINTI), Tohoku Univ., Japan","New Ind. Creation Hatchery Center (NICHe), Tohoku Univ., Sendai, Japan"],"affiliations":[{"raw_affiliation_string":"Global INTegration Initiative (GINTI), Tohoku Univ., Japan","institution_ids":["https://openalex.org/I201537933"]},{"raw_affiliation_string":"New Ind. Creation Hatchery Center (NICHe), Tohoku Univ., Sendai, Japan","institution_ids":["https://openalex.org/I201537933"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":8,"corresponding_author_ids":["https://openalex.org/A5018052057"],"corresponding_institution_ids":["https://openalex.org/I201537933"],"apc_list":null,"apc_paid":null,"fwci":0.7094,"has_fulltext":false,"cited_by_count":3,"citation_normalized_percentile":{"value":0.73188007,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":96},"biblio":{"volume":null,"issue":null,"first_page":"1","last_page":"4"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10472","display_name":"Semiconductor materials and devices","score":0.9998000264167786,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10623","display_name":"Thin-Film Transistor Technologies","score":0.9988999962806702,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/dram","display_name":"Dram","score":0.8059567809104919},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.7722816467285156},{"id":"https://openalex.org/keywords/modulus","display_name":"Modulus","score":0.6551328897476196},{"id":"https://openalex.org/keywords/chip","display_name":"Chip","score":0.5883727669715881},{"id":"https://openalex.org/keywords/composite-material","display_name":"Composite material","score":0.5177675485610962},{"id":"https://openalex.org/keywords/substrate","display_name":"Substrate (aquarium)","score":0.5028366446495056},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.4676738679409027},{"id":"https://openalex.org/keywords/dynamic-random-access-memory","display_name":"Dynamic random-access memory","score":0.46602463722229004},{"id":"https://openalex.org/keywords/lattice","display_name":"Lattice (music)","score":0.45491671562194824},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.18167611956596375},{"id":"https://openalex.org/keywords/semiconductor-memory","display_name":"Semiconductor memory","score":0.06627050042152405}],"concepts":[{"id":"https://openalex.org/C7366592","wikidata":"https://www.wikidata.org/wiki/Q1255620","display_name":"Dram","level":2,"score":0.8059567809104919},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.7722816467285156},{"id":"https://openalex.org/C193867417","wikidata":"https://www.wikidata.org/wiki/Q6889814","display_name":"Modulus","level":2,"score":0.6551328897476196},{"id":"https://openalex.org/C165005293","wikidata":"https://www.wikidata.org/wiki/Q1074500","display_name":"Chip","level":2,"score":0.5883727669715881},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.5177675485610962},{"id":"https://openalex.org/C2777289219","wikidata":"https://www.wikidata.org/wiki/Q7632154","display_name":"Substrate (aquarium)","level":2,"score":0.5028366446495056},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.4676738679409027},{"id":"https://openalex.org/C118702147","wikidata":"https://www.wikidata.org/wiki/Q189396","display_name":"Dynamic random-access memory","level":3,"score":0.46602463722229004},{"id":"https://openalex.org/C2781204021","wikidata":"https://www.wikidata.org/wiki/Q6497091","display_name":"Lattice (music)","level":2,"score":0.45491671562194824},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.18167611956596375},{"id":"https://openalex.org/C98986596","wikidata":"https://www.wikidata.org/wiki/Q1143031","display_name":"Semiconductor memory","level":2,"score":0.06627050042152405},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.0},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.0},{"id":"https://openalex.org/C24890656","wikidata":"https://www.wikidata.org/wiki/Q82811","display_name":"Acoustics","level":1,"score":0.0},{"id":"https://openalex.org/C111368507","wikidata":"https://www.wikidata.org/wiki/Q43518","display_name":"Oceanography","level":1,"score":0.0},{"id":"https://openalex.org/C127313418","wikidata":"https://www.wikidata.org/wiki/Q1069","display_name":"Geology","level":0,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/3dic.2013.6702336","is_oa":false,"landing_page_url":"https://doi.org/10.1109/3dic.2013.6702336","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2013 IEEE International 3D Systems Integration Conference (3DIC)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[],"funders":[{"id":"https://openalex.org/F4320321679","display_name":"Ministry of Economy, Trade and Industry","ror":"https://ror.org/055tm7f07"}],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":11,"referenced_works":["https://openalex.org/W2009195513","https://openalex.org/W2011694493","https://openalex.org/W2032001081","https://openalex.org/W2036404459","https://openalex.org/W2064676658","https://openalex.org/W2096042906","https://openalex.org/W2115153333","https://openalex.org/W2144149750","https://openalex.org/W2151613126","https://openalex.org/W2157763436","https://openalex.org/W2532338040"],"related_works":["https://openalex.org/W2518930778","https://openalex.org/W2979599569","https://openalex.org/W3007039213","https://openalex.org/W3094611732","https://openalex.org/W2533585248","https://openalex.org/W2559795407","https://openalex.org/W2944414554","https://openalex.org/W3009022466","https://openalex.org/W2123644672","https://openalex.org/W2000563648"],"abstract_inverted_index":{"The":[0,14,82,102,130],"Young's":[1,15,55],"modulus":[2,16,29,56],"(E)":[3],"of":[4,30,41,49,66,85,105,124,132,151],"Si":[5,20,36,42,73],"substrate":[6,21,43],"begins":[7],"to":[8,27,71,78,118],"noticeably":[9],"decrease":[10],"below":[11,99],"50-\u03bcm":[12,31,100,120],"thickness.":[13,32,101],"in":[17,108,136],"30-\u03bcm":[18,34],"thick":[19,35,110,121],"decreased":[22,93],"by":[23,114],"approximately":[24,115],"30%":[25],"compared":[26,117],"the":[28,38,50,54,60,92,119,125,133,137,148],"In":[33],"substrate,":[37],"lattice":[39,51,134],"structure":[40,52,127,135],"is":[44,112],"highly":[45],"distorted.":[46],"Large":[47],"distortion":[48,131],"induces":[53],"reduction,":[57],"consequently":[58,146],"weakens":[59],"mechanical":[61],"strength.":[62],"A":[63],"DRAM":[64,86,106,152],"chip":[65,94,111,139],"200-\u03bcm":[67],"thickness":[68],"was":[69],"bonded":[70],"a":[72,141],"interposer":[74],"and":[75],"thinned":[76],"down":[77],"50/40/30/20-\u03bcm":[79],"thickness,":[80,95],"respectively.":[81],"retention":[83,103,149],"characteristics":[84],"cell":[87,107],"are":[88],"degraded":[89,98],"depending":[90],"on":[91],"especially":[96],"dramatically":[97],"time":[104,150],"20-\u03bcm":[109],"shortened":[113],"40%":[116],"chip,":[122],"regardless":[123],"well":[126],"(triple-well,":[128],"twin-well).":[129],"thin":[138],"effects":[140],"minority":[142],"carrier":[143],"generation":[144],"lifetime,":[145],"shortening":[147],"cell.":[153]},"counts_by_year":[{"year":2015,"cited_by_count":2},{"year":2014,"cited_by_count":1}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}