{"id":"https://openalex.org/W2064186587","doi":"https://doi.org/10.1109/3dic.2013.6702335","title":"Challenges of Cu CMP of TSVs and RDLs fabricated from the backside of a thin wafer","display_name":"Challenges of Cu CMP of TSVs and RDLs fabricated from the backside of a thin wafer","publication_year":2013,"publication_date":"2013-10-01","ids":{"openalex":"https://openalex.org/W2064186587","doi":"https://doi.org/10.1109/3dic.2013.6702335","mag":"2064186587"},"language":"en","primary_location":{"id":"doi:10.1109/3dic.2013.6702335","is_oa":false,"landing_page_url":"https://doi.org/10.1109/3dic.2013.6702335","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2013 IEEE International 3D Systems Integration Conference (3DIC)","raw_type":"proceedings-article"},"type":"conference-paper","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5034490227","display_name":"Jui\u2010Chin Chen","orcid":null},"institutions":[{"id":"https://openalex.org/I4210148468","display_name":"Industrial Technology Research Institute","ror":"https://ror.org/05szzwt63","country_code":"TW","type":"nonprofit","lineage":["https://openalex.org/I4210148468"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"Jui-Chin Chen","raw_affiliation_strings":["Electronics and Optoelectronics Research Labs, Industrial Technology Research Institute, Hsinchu, Taiwan","Electron. & Optoelectron. Res. Labs., Ind. Technol. Res. Inst., Hsinchu, Taiwan"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Electronics and Optoelectronics Research Labs, Industrial Technology Research Institute, Hsinchu, Taiwan","institution_ids":["https://openalex.org/I4210148468"]},{"raw_affiliation_string":"Electron. & Optoelectron. Res. Labs., Ind. Technol. Res. Inst., Hsinchu, Taiwan","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5000222202","display_name":"John H. Lau","orcid":"https://orcid.org/0000-0003-1284-8829"},"institutions":[{"id":"https://openalex.org/I4210148468","display_name":"Industrial Technology Research Institute","ror":"https://ror.org/05szzwt63","country_code":"TW","type":"nonprofit","lineage":["https://openalex.org/I4210148468"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"John H. Lau","raw_affiliation_strings":["Electronics and Optoelectronics Research Labs, Industrial Technology Research Institute, Hsinchu, Taiwan","Electron. & Optoelectron. Res. Labs., Ind. Technol. Res. Inst., Hsinchu, Taiwan"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Electronics and Optoelectronics Research Labs, Industrial Technology Research Institute, Hsinchu, Taiwan","institution_ids":["https://openalex.org/I4210148468"]},{"raw_affiliation_string":"Electron. & Optoelectron. Res. Labs., Ind. Technol. Res. Inst., Hsinchu, Taiwan","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5100826162","display_name":"Tzu\u2010Chien Hsu","orcid":null},"institutions":[{"id":"https://openalex.org/I4210148468","display_name":"Industrial Technology Research Institute","ror":"https://ror.org/05szzwt63","country_code":"TW","type":"nonprofit","lineage":["https://openalex.org/I4210148468"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"Tzu-Chien Hsu","raw_affiliation_strings":["Electronics and Optoelectronics Research Labs, Industrial Technology Research Institute, Hsinchu, Taiwan","Electron. & Optoelectron. Res. Labs., Ind. Technol. Res. Inst., Hsinchu, Taiwan"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Electronics and Optoelectronics Research Labs, Industrial Technology Research Institute, Hsinchu, Taiwan","institution_ids":["https://openalex.org/I4210148468"]},{"raw_affiliation_string":"Electron. & Optoelectron. Res. Labs., Ind. Technol. Res. Inst., Hsinchu, Taiwan","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5031201443","display_name":"Chien\u2010Chou Chen","orcid":"https://orcid.org/0000-0001-5167-2630"},"institutions":[{"id":"https://openalex.org/I4210148468","display_name":"Industrial Technology Research Institute","ror":"https://ror.org/05szzwt63","country_code":"TW","type":"nonprofit","lineage":["https://openalex.org/I4210148468"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"Chien-Chou Chen","raw_affiliation_strings":["Electronics and Optoelectronics Research Labs, Industrial Technology Research Institute, Hsinchu, Taiwan","Electron. & Optoelectron. Res. Labs., Ind. Technol. Res. Inst., Hsinchu, Taiwan"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Electronics and Optoelectronics Research Labs, Industrial Technology Research Institute, Hsinchu, Taiwan","institution_ids":["https://openalex.org/I4210148468"]},{"raw_affiliation_string":"Electron. & Optoelectron. Res. Labs., Ind. Technol. Res. Inst., Hsinchu, Taiwan","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5110124084","display_name":"Pei-Jer Tzeng","orcid":null},"institutions":[{"id":"https://openalex.org/I4210148468","display_name":"Industrial Technology Research Institute","ror":"https://ror.org/05szzwt63","country_code":"TW","type":"nonprofit","lineage":["https://openalex.org/I4210148468"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"Pei-Jer Tzeng","raw_affiliation_strings":["Electronics and Optoelectronics Research Labs, Industrial Technology Research Institute, Hsinchu, Taiwan","Electron. & Optoelectron. Res. Labs., Ind. Technol. Res. Inst., Hsinchu, Taiwan"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Electronics and Optoelectronics Research Labs, Industrial Technology Research Institute, Hsinchu, Taiwan","institution_ids":["https://openalex.org/I4210148468"]},{"raw_affiliation_string":"Electron. & Optoelectron. Res. Labs., Ind. Technol. Res. Inst., Hsinchu, Taiwan","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5100897534","display_name":"Po-Chih Chang","orcid":null},"institutions":[{"id":"https://openalex.org/I4210148468","display_name":"Industrial Technology Research Institute","ror":"https://ror.org/05szzwt63","country_code":"TW","type":"nonprofit","lineage":["https://openalex.org/I4210148468"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"Po-Chih Chang","raw_affiliation_strings":["Electronics and Optoelectronics Research Labs, Industrial Technology Research Institute, Hsinchu, Taiwan","Electron. & Optoelectron. Res. Labs., Ind. Technol. Res. Inst., Hsinchu, Taiwan"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Electronics and Optoelectronics Research Labs, Industrial Technology Research Institute, Hsinchu, Taiwan","institution_ids":["https://openalex.org/I4210148468"]},{"raw_affiliation_string":"Electron. & Optoelectron. Res. Labs., Ind. Technol. Res. Inst., Hsinchu, Taiwan","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5103613530","display_name":"Chun-Hsien Chien","orcid":null},"institutions":[{"id":"https://openalex.org/I4210148468","display_name":"Industrial Technology Research Institute","ror":"https://ror.org/05szzwt63","country_code":"TW","type":"nonprofit","lineage":["https://openalex.org/I4210148468"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"Chun-Hsien Chien","raw_affiliation_strings":["Electronics and Optoelectronics Research Labs, Industrial Technology Research Institute, Hsinchu, Taiwan","Electron. & Optoelectron. Res. Labs., Ind. Technol. Res. Inst., Hsinchu, Taiwan"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Electronics and Optoelectronics Research Labs, Industrial Technology Research Institute, Hsinchu, Taiwan","institution_ids":["https://openalex.org/I4210148468"]},{"raw_affiliation_string":"Electron. & Optoelectron. Res. Labs., Ind. Technol. Res. Inst., Hsinchu, Taiwan","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5103337029","display_name":"Yiu-Hsiang Chang","orcid":null},"institutions":[{"id":"https://openalex.org/I4210148468","display_name":"Industrial Technology Research Institute","ror":"https://ror.org/05szzwt63","country_code":"TW","type":"nonprofit","lineage":["https://openalex.org/I4210148468"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"Yiu-Hsiang Chang","raw_affiliation_strings":["Electronics and Optoelectronics Research Labs, Industrial Technology Research Institute, Hsinchu, Taiwan","Electron. & Optoelectron. Res. Labs., Ind. Technol. Res. Inst., Hsinchu, Taiwan"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Electronics and Optoelectronics Research Labs, Industrial Technology Research Institute, Hsinchu, Taiwan","institution_ids":["https://openalex.org/I4210148468"]},{"raw_affiliation_string":"Electron. & Optoelectron. Res. Labs., Ind. Technol. Res. Inst., Hsinchu, Taiwan","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5105364119","display_name":"Shang-Chun Chen","orcid":null},"institutions":[{"id":"https://openalex.org/I4210148468","display_name":"Industrial Technology Research Institute","ror":"https://ror.org/05szzwt63","country_code":"TW","type":"nonprofit","lineage":["https://openalex.org/I4210148468"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"Shang-Chun Chen","raw_affiliation_strings":["Electronics and Optoelectronics Research Labs, Industrial Technology Research Institute, Hsinchu, Taiwan","Electron. & Optoelectron. Res. Labs., Ind. Technol. Res. Inst., Hsinchu, Taiwan"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Electronics and Optoelectronics Research Labs, Industrial Technology Research Institute, Hsinchu, Taiwan","institution_ids":["https://openalex.org/I4210148468"]},{"raw_affiliation_string":"Electron. & Optoelectron. Res. Labs., Ind. Technol. Res. Inst., Hsinchu, Taiwan","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5111744268","display_name":"Yu-Chen Hsin","orcid":null},"institutions":[{"id":"https://openalex.org/I4210148468","display_name":"Industrial Technology Research Institute","ror":"https://ror.org/05szzwt63","country_code":"TW","type":"nonprofit","lineage":["https://openalex.org/I4210148468"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"Yu-Chen Hsin","raw_affiliation_strings":["Electronics and Optoelectronics Research Labs, Industrial Technology Research Institute, Hsinchu, Taiwan","Electron. & Optoelectron. Res. Labs., Ind. Technol. Res. Inst., Hsinchu, Taiwan"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Electronics and Optoelectronics Research Labs, Industrial Technology Research Institute, Hsinchu, Taiwan","institution_ids":["https://openalex.org/I4210148468"]},{"raw_affiliation_string":"Electron. & Optoelectron. Res. Labs., Ind. Technol. Res. Inst., Hsinchu, Taiwan","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5102153821","display_name":"Sue-Chen Liao","orcid":null},"institutions":[{"id":"https://openalex.org/I4210148468","display_name":"Industrial Technology Research Institute","ror":"https://ror.org/05szzwt63","country_code":"TW","type":"nonprofit","lineage":["https://openalex.org/I4210148468"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"Sue-Chen Liao","raw_affiliation_strings":["Electronics and Optoelectronics Research Labs, Industrial Technology Research Institute, Hsinchu, Taiwan","Electron. & Optoelectron. Res. Labs., Ind. Technol. Res. Inst., Hsinchu, Taiwan"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Electronics and Optoelectronics Research Labs, Industrial Technology Research Institute, Hsinchu, Taiwan","institution_ids":["https://openalex.org/I4210148468"]},{"raw_affiliation_string":"Electron. & Optoelectron. Res. Labs., Ind. Technol. Res. Inst., Hsinchu, Taiwan","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5111938642","display_name":"Cha-Hsin Lin","orcid":null},"institutions":[{"id":"https://openalex.org/I4210148468","display_name":"Industrial Technology Research Institute","ror":"https://ror.org/05szzwt63","country_code":"TW","type":"nonprofit","lineage":["https://openalex.org/I4210148468"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"Cha-Hsin Lin","raw_affiliation_strings":["Electronics and Optoelectronics Research Labs, Industrial Technology Research Institute, Hsinchu, Taiwan","Electron. & Optoelectron. Res. Labs., Ind. Technol. Res. Inst., Hsinchu, Taiwan"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Electronics and Optoelectronics Research Labs, Industrial Technology Research Institute, Hsinchu, Taiwan","institution_ids":["https://openalex.org/I4210148468"]},{"raw_affiliation_string":"Electron. & Optoelectron. Res. Labs., Ind. Technol. Res. Inst., Hsinchu, Taiwan","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5068496383","display_name":"Tzu-Kun Ku","orcid":null},"institutions":[{"id":"https://openalex.org/I4210148468","display_name":"Industrial Technology Research Institute","ror":"https://ror.org/05szzwt63","country_code":"TW","type":"nonprofit","lineage":["https://openalex.org/I4210148468"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"Tzu-Kun Ku","raw_affiliation_strings":["Electronics and Optoelectronics Research Labs, Industrial Technology Research Institute, Hsinchu, Taiwan","Electron. & Optoelectron. Res. Labs., Ind. Technol. Res. Inst., Hsinchu, Taiwan"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Electronics and Optoelectronics Research Labs, Industrial Technology Research Institute, Hsinchu, Taiwan","institution_ids":["https://openalex.org/I4210148468"]},{"raw_affiliation_string":"Electron. & Optoelectron. Res. Labs., Ind. Technol. Res. Inst., Hsinchu, Taiwan","institution_ids":[]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5080130969","display_name":"Ming\u2010Jer Kao","orcid":"https://orcid.org/0000-0003-3401-5238"},"institutions":[{"id":"https://openalex.org/I4210148468","display_name":"Industrial Technology Research Institute","ror":"https://ror.org/05szzwt63","country_code":"TW","type":"nonprofit","lineage":["https://openalex.org/I4210148468"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"Ming-Jer Kao","raw_affiliation_strings":["Electronics and Optoelectronics Research Labs, Industrial Technology Research Institute, Hsinchu, Taiwan","Electron. & Optoelectron. Res. Labs., Ind. Technol. Res. Inst., Hsinchu, Taiwan"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Electronics and Optoelectronics Research Labs, Industrial Technology Research Institute, Hsinchu, Taiwan","institution_ids":["https://openalex.org/I4210148468"]},{"raw_affiliation_string":"Electron. & Optoelectron. Res. Labs., Ind. Technol. Res. Inst., Hsinchu, Taiwan","institution_ids":[]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":1,"corresponding_author_ids":[],"corresponding_institution_ids":["https://openalex.org/I4210148468"],"apc_list":null,"apc_paid":null,"fwci":0.8106,"has_fulltext":false,"cited_by_count":11,"citation_normalized_percentile":{"value":0.68702303,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":97},"biblio":{"volume":null,"issue":null,"first_page":"1","last_page":"5"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.9994000196456909,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11661","display_name":"Copper Interconnects and Reliability","score":0.9991000294685364,"subfield":{"id":"https://openalex.org/subfields/2504","display_name":"Electronic, Optical and Magnetic Materials"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/wafer","display_name":"Wafer","score":0.7962839603424072},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.7026056051254272},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.5761212110519409},{"id":"https://openalex.org/keywords/thin-film","display_name":"Thin film","score":0.4644463360309601},{"id":"https://openalex.org/keywords/nanotechnology","display_name":"Nanotechnology","score":0.3708542287349701}],"concepts":[{"id":"https://openalex.org/C160671074","wikidata":"https://www.wikidata.org/wiki/Q267131","display_name":"Wafer","level":2,"score":0.7962839603424072},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.7026056051254272},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.5761212110519409},{"id":"https://openalex.org/C19067145","wikidata":"https://www.wikidata.org/wiki/Q1137203","display_name":"Thin film","level":2,"score":0.4644463360309601},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.3708542287349701}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/3dic.2013.6702335","is_oa":false,"landing_page_url":"https://doi.org/10.1109/3dic.2013.6702335","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2013 IEEE International 3D Systems Integration Conference (3DIC)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[],"funders":[{"id":"https://openalex.org/F4320322214","display_name":"Industrial Technology Research Institute","ror":"https://ror.org/05szzwt63"}],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":8,"referenced_works":["https://openalex.org/W2004305691","https://openalex.org/W2010698226","https://openalex.org/W2044876757","https://openalex.org/W2059279012","https://openalex.org/W2106469776","https://openalex.org/W2117182320","https://openalex.org/W2134145522","https://openalex.org/W2150190846"],"related_works":["https://openalex.org/W2899084033","https://openalex.org/W2016187641","https://openalex.org/W4404725684","https://openalex.org/W2805339068","https://openalex.org/W4246450666","https://openalex.org/W4388998267","https://openalex.org/W2898370298","https://openalex.org/W2137437058","https://openalex.org/W4404784341","https://openalex.org/W4390401159"],"abstract_inverted_index":{"TSVs":[0,21,115,142],"(through-silicon":[1],"vias)":[2],"can":[3],"be":[4],"fabricated":[5,145],"by":[6,128,236,251,297],"the":[7,13,25,28,38,61,63,69,73,77,80,89,92,98,106,109,123,126,129,147,155,158,162,171,179,186,194,203,207,217,227,231,245,252,261,264,269,275,285,289,301,308,311],"via-first,":[8],"via-middle,":[9],"and":[10,18,44,55,65,102,104,116,143,198,280,284],"via-last":[11,78],"from":[12,24,79,122,146,170],"backside":[14,39,81,107,124,148],"processes.":[15],"For":[16],"via-first":[17],"via-middle":[19],"processes,":[20],"are":[22,120,133,219,233,249,295],"formed":[23,121],"frontside":[26,90],"of":[27,68,91,108,125,138,141,149,164,173,206,263,271,292],"wafer":[29,94,110,127,182,196,211,266],"which":[30],"is":[31,40,85],"temporary":[32,86,176],"bonded":[33,87],"to":[34,42,59,111,161,185,192,221,259,306],"a":[35,83,150,238,242,255],"carrier.":[36],"Then":[37],"subjected":[41],"backgrinding":[43],"Cu":[45,64,139,200,228,272,277,282,286,298,304,309],"revealing":[46],"such":[47],"as":[48],"silicon":[49],"dry":[50],"etching,":[51],"low-temperature":[52],"isolation":[53],"SiN/SiO2deposition,":[54],"CMP":[56,140,191],"(chemical-mechanical":[57],"polishing)":[58],"remove":[60,307],"SiN/SiO2and":[62],"seed/barrier":[66],"layers":[67],"Cu-filled":[70],"TSV.":[71],"On":[72],"other":[74],"hand,":[75],"for":[76],"process,":[82],"carrier":[84],"on":[88,181,310],"\u201cfinished\u201d":[93],"(which":[95],"includes":[96],"all":[97],"metal":[99,247],"layers,":[100],"pads":[101],"passivation)":[103],"backgrind":[105],"\u226450":[112],"\u03bcm":[113],"thick.":[114],"RDLs":[117,144],"(redistribution":[118],"layers)":[119],"dual-damascene":[130],"process.":[131,213],"There":[132],"at":[134],"least":[135],"3":[136],"challenges":[137],"thin":[151,195,265],"wafer,":[152],"namely":[153],"(a)":[154],"residues":[156,180,201,229,248,287],"in":[157,230,274],"dies":[159,232],"due":[160,184],"excess":[163],"TTV":[165],"(total":[166],"thickness":[167],"variation)":[168],"resulting":[169],"degassing/deformation":[172],"glue":[174,240],"during":[175,190,210],"bonding;":[177],"(b)":[178],"edge":[183,246],"low":[187,256],"down":[188,257],"force":[189,258],"avoid":[193,260],"chipping;":[197],"(c)":[199],"along":[202,288],"recess":[204,290,312],"areas":[205,291],"grinding":[208,293],"traces":[209,294],"thinning":[212],"In":[214],"this":[215],"study,":[216],"processes":[218],"developed":[220],"overcome":[222],"these":[223],"three":[224],"challenges.":[225],"Specifically,":[226],"reduced":[234],"substantially":[235],"choosing":[237],"thermosetting":[239],"over":[241],"thermoplastic":[243],"glue;":[244],"eliminated":[250],"process":[253],"with":[254],"chipping":[262],"but":[267],"increasing":[268],"time":[270],"over-polishing":[273,299],"high":[276,302],"rate":[278],"slurry":[279,305],"avoiding":[281],"corrosion;":[283],"resolved":[296],"using":[300],"passivation":[303],"areas.":[313]},"counts_by_year":[{"year":2026,"cited_by_count":1},{"year":2025,"cited_by_count":1},{"year":2024,"cited_by_count":2},{"year":2023,"cited_by_count":3},{"year":2021,"cited_by_count":1},{"year":2017,"cited_by_count":1},{"year":2016,"cited_by_count":1},{"year":2014,"cited_by_count":1}],"updated_date":"2026-07-29T14:22:42.915294","created_date":"2025-10-10T00:00:00"}