{"id":"https://openalex.org/W2082564332","doi":"https://doi.org/10.1109/3dic.2012.6263011","title":"High frequency signal transmission characteristics of cone bump interconnections","display_name":"High frequency signal transmission characteristics of cone bump interconnections","publication_year":2012,"publication_date":"2012-01-01","ids":{"openalex":"https://openalex.org/W2082564332","doi":"https://doi.org/10.1109/3dic.2012.6263011","mag":"2082564332"},"language":"en","primary_location":{"id":"doi:10.1109/3dic.2012.6263011","is_oa":false,"landing_page_url":"https://doi.org/10.1109/3dic.2012.6263011","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2011 IEEE International 3D Systems Integration Conference (3DIC), 2011 IEEE International","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5070186809","display_name":"Akihiro Ikeda","orcid":"https://orcid.org/0000-0001-8440-3891"},"institutions":[{"id":"https://openalex.org/I135598925","display_name":"Kyushu University","ror":"https://ror.org/00p4k0j84","country_code":"JP","type":"education","lineage":["https://openalex.org/I135598925"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"A. Ikeda","raw_affiliation_strings":["Graduate School of Information Science and Electrical Engineering, Kyushu University, Fukuoka, Japan"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Graduate School of Information Science and Electrical Engineering, Kyushu University, Fukuoka, Japan","institution_ids":["https://openalex.org/I135598925"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5064802411","display_name":"Naoya Watanabe","orcid":"https://orcid.org/0000-0003-4274-0974"},"institutions":[{"id":"https://openalex.org/I135598925","display_name":"Kyushu University","ror":"https://ror.org/00p4k0j84","country_code":"JP","type":"education","lineage":["https://openalex.org/I135598925"]},{"id":"https://openalex.org/I73613424","display_name":"National Institute of Advanced Industrial Science and Technology","ror":"https://ror.org/01703db54","country_code":"JP","type":"government","lineage":["https://openalex.org/I73613424"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"N. Watanabe","raw_affiliation_strings":["Graduate School of Information Science and Electrical Engineering, Kyushu University, Fukuoka, Japan","National Institute for Advanced Industrial Science and Technology, Tsukuba, Ibaraki, Japan"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Graduate School of Information Science and Electrical Engineering, Kyushu University, Fukuoka, Japan","institution_ids":["https://openalex.org/I135598925"]},{"raw_affiliation_string":"National Institute for Advanced Industrial Science and Technology, Tsukuba, Ibaraki, Japan","institution_ids":["https://openalex.org/I73613424"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5101450972","display_name":"Tanemasa Asano","orcid":"https://orcid.org/0000-0003-2887-5055"},"institutions":[{"id":"https://openalex.org/I135598925","display_name":"Kyushu University","ror":"https://ror.org/00p4k0j84","country_code":"JP","type":"education","lineage":["https://openalex.org/I135598925"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"T. Asano","raw_affiliation_strings":["Graduate School of Information Science and Electrical Engineering, Kyushu University, Fukuoka, Japan"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Graduate School of Information Science and Electrical Engineering, Kyushu University, Fukuoka, Japan","institution_ids":["https://openalex.org/I135598925"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":3,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":0.0,"has_fulltext":false,"cited_by_count":1,"citation_normalized_percentile":{"value":0.13723634,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":90,"max":94},"biblio":{"volume":null,"issue":null,"first_page":"1","last_page":"5"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.9995999932289124,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.9995999932289124,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.9970999956130981,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11429","display_name":"Semiconductor Lasers and Optical Devices","score":0.9894000291824341,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.7729158997535706},{"id":"https://openalex.org/keywords/signal","display_name":"SIGNAL (programming language)","score":0.648561954498291},{"id":"https://openalex.org/keywords/insertion-loss","display_name":"Insertion loss","score":0.5339186787605286},{"id":"https://openalex.org/keywords/transmission","display_name":"Transmission (telecommunications)","score":0.524071216583252},{"id":"https://openalex.org/keywords/cone","display_name":"Cone (formal languages)","score":0.41697609424591064},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.37433114647865295},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.3249523639678955},{"id":"https://openalex.org/keywords/optics","display_name":"Optics","score":0.32293328642845154},{"id":"https://openalex.org/keywords/physics","display_name":"Physics","score":0.12170666456222534},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.11846163868904114},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.09091266989707947}],"concepts":[{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.7729158997535706},{"id":"https://openalex.org/C2779843651","wikidata":"https://www.wikidata.org/wiki/Q7390335","display_name":"SIGNAL (programming language)","level":2,"score":0.648561954498291},{"id":"https://openalex.org/C90327742","wikidata":"https://www.wikidata.org/wiki/Q947396","display_name":"Insertion loss","level":2,"score":0.5339186787605286},{"id":"https://openalex.org/C761482","wikidata":"https://www.wikidata.org/wiki/Q118093","display_name":"Transmission (telecommunications)","level":2,"score":0.524071216583252},{"id":"https://openalex.org/C30014739","wikidata":"https://www.wikidata.org/wiki/Q5159445","display_name":"Cone (formal languages)","level":2,"score":0.41697609424591064},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.37433114647865295},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.3249523639678955},{"id":"https://openalex.org/C120665830","wikidata":"https://www.wikidata.org/wiki/Q14620","display_name":"Optics","level":1,"score":0.32293328642845154},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.12170666456222534},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.11846163868904114},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.09091266989707947},{"id":"https://openalex.org/C199360897","wikidata":"https://www.wikidata.org/wiki/Q9143","display_name":"Programming language","level":1,"score":0.0},{"id":"https://openalex.org/C11413529","wikidata":"https://www.wikidata.org/wiki/Q8366","display_name":"Algorithm","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/3dic.2012.6263011","is_oa":false,"landing_page_url":"https://doi.org/10.1109/3dic.2012.6263011","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2011 IEEE International 3D Systems Integration Conference (3DIC), 2011 IEEE International","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"id":"https://metadata.un.org/sdg/7","score":0.5899999737739563,"display_name":"Affordable and clean energy"}],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":9,"referenced_works":["https://openalex.org/W1970531526","https://openalex.org/W1991680123","https://openalex.org/W2035713496","https://openalex.org/W2067993046","https://openalex.org/W2075358317","https://openalex.org/W2077638910","https://openalex.org/W2101632481","https://openalex.org/W2152892232","https://openalex.org/W2546300527"],"related_works":["https://openalex.org/W2748952813","https://openalex.org/W2060249924","https://openalex.org/W1516468884","https://openalex.org/W1604868505","https://openalex.org/W2917030261","https://openalex.org/W2404132866","https://openalex.org/W2012676207","https://openalex.org/W2146388118","https://openalex.org/W2546968638","https://openalex.org/W2054039886"],"abstract_inverted_index":{"We":[0],"evaluated":[1],"high":[2],"frequency":[3],"signal":[4,31,45],"transmission":[5,32],"characteristics":[6],"of":[7,38,105,117],"coplanar":[8],"waveguides":[9],"fabricated":[10],"using":[11],"Au":[12,19,27,66,87,121],"cone":[13,28],"bump":[14,39,51,57,95],"interconnections.":[15,40,96],"Electroless":[16],"Ni":[17,64,85,119],"/":[18,56,65,86,120],"bumps":[20],"were":[21],"used":[22],"as":[23],"counter-electrodes":[24],"against":[25],"the":[26,36,44,50,59,80,94,106,110,114,118],"bumps.":[29,67,122],"The":[30,97],"loss":[33,47],"increased":[34],"with":[35,58,79],"number":[37],"At":[41],"40":[42],"GHz,":[43],"insertion":[46],"due":[48,112],"to":[49,75,113],"interconnections":[52],"was":[53,70,91],"0.017":[54],"dB":[55],"10":[60],"\u03bcm":[61,82],"square":[62,83],"size":[63,84],"This":[68],"value":[69],"small":[71],"enough":[72],"for":[73],"application":[74],"radio-frequency":[76],"devices.":[77],"While,":[78],"5":[81],"bumps,":[88,111],"open":[89,98],"failure":[90,99],"observed":[92],"between":[93,109],"might":[100],"be":[101],"caused":[102],"by":[103],"decreasing":[104],"contact":[107],"pressure":[108],"mushroom-like":[115],"shape":[116]},"counts_by_year":[{"year":2019,"cited_by_count":1}],"updated_date":"2026-06-11T09:08:48.828518","created_date":"2025-10-10T00:00:00"}