{"id":"https://openalex.org/W2011760458","doi":"https://doi.org/10.1109/3dic.2012.6262997","title":"Minimization of the local residual stress in 3DICs by controlling the structures and mechanical properties of 3D interconnections","display_name":"Minimization of the local residual stress in 3DICs by controlling the structures and mechanical properties of 3D interconnections","publication_year":2012,"publication_date":"2012-01-01","ids":{"openalex":"https://openalex.org/W2011760458","doi":"https://doi.org/10.1109/3dic.2012.6262997","mag":"2011760458"},"language":"en","primary_location":{"id":"doi:10.1109/3dic.2012.6262997","is_oa":false,"landing_page_url":"https://doi.org/10.1109/3dic.2012.6262997","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2011 IEEE International 3D Systems Integration Conference (3DIC), 2011 IEEE International","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5044452350","display_name":"Kota Nakahira","orcid":null},"institutions":[{"id":"https://openalex.org/I201537933","display_name":"Tohoku University","ror":"https://ror.org/01dq60k83","country_code":"JP","type":"education","lineage":["https://openalex.org/I201537933"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"Kota Nakahira","raw_affiliation_strings":["Fracture and Reliability Research Institute, Graduate School of Engineering, University of Tohoku, Sendai, Miyagi, Japan","Fracture and Reliability Research Institute, Graduate School of Engineering, Tohoku University, 6-6-11-712 Aobayama, Aoba-ku, Sendai, Miyagi, Japan"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Fracture and Reliability Research Institute, Graduate School of Engineering, University of Tohoku, Sendai, Miyagi, Japan","institution_ids":["https://openalex.org/I201537933"]},{"raw_affiliation_string":"Fracture and Reliability Research Institute, Graduate School of Engineering, Tohoku University, 6-6-11-712 Aobayama, Aoba-ku, Sendai, Miyagi, Japan","institution_ids":["https://openalex.org/I201537933"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5090244549","display_name":"Fumiaki Endo","orcid":null},"institutions":[{"id":"https://openalex.org/I201537933","display_name":"Tohoku University","ror":"https://ror.org/01dq60k83","country_code":"JP","type":"education","lineage":["https://openalex.org/I201537933"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"Fumiaki Endo","raw_affiliation_strings":["Fracture and Reliability Research Institute, Graduate School of Engineering, University of Tohoku, Sendai, Miyagi, Japan","Fracture and Reliability Research Institute, Graduate School of Engineering, Tohoku University, 6-6-11-712 Aobayama, Aoba-ku, Sendai, Miyagi, Japan"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Fracture and Reliability Research Institute, Graduate School of Engineering, University of Tohoku, Sendai, Miyagi, Japan","institution_ids":["https://openalex.org/I201537933"]},{"raw_affiliation_string":"Fracture and Reliability Research Institute, Graduate School of Engineering, Tohoku University, 6-6-11-712 Aobayama, Aoba-ku, Sendai, Miyagi, Japan","institution_ids":["https://openalex.org/I201537933"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5073196141","display_name":"Ryosuke Furuya","orcid":"https://orcid.org/0000-0002-0751-6267"},"institutions":[{"id":"https://openalex.org/I201537933","display_name":"Tohoku University","ror":"https://ror.org/01dq60k83","country_code":"JP","type":"education","lineage":["https://openalex.org/I201537933"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"Ryosuke Furuya","raw_affiliation_strings":["Fracture and Reliability Research Institute, Graduate School of Engineering, University of Tohoku, Sendai, Miyagi, Japan","Fracture and Reliability Research Institute, Graduate School of Engineering, Tohoku University, 6-6-11-712 Aobayama, Aoba-ku, Sendai, Miyagi, Japan"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Fracture and Reliability Research Institute, Graduate School of Engineering, University of Tohoku, Sendai, Miyagi, Japan","institution_ids":["https://openalex.org/I201537933"]},{"raw_affiliation_string":"Fracture and Reliability Research Institute, Graduate School of Engineering, Tohoku University, 6-6-11-712 Aobayama, Aoba-ku, Sendai, Miyagi, Japan","institution_ids":["https://openalex.org/I201537933"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5004453040","display_name":"Ken Suzuki","orcid":"https://orcid.org/0000-0002-8346-9634"},"institutions":[{"id":"https://openalex.org/I201537933","display_name":"Tohoku University","ror":"https://ror.org/01dq60k83","country_code":"JP","type":"education","lineage":["https://openalex.org/I201537933"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"Ken Suzuki","raw_affiliation_strings":["Fracture and Reliability Research Institute, Graduate School of Engineering, University of Tohoku, Sendai, Miyagi, Japan","Fracture and Reliability Research Institute, Graduate School of Engineering, Tohoku University, 6-6-11-712 Aobayama, Aoba-ku, Sendai, Miyagi, Japan"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Fracture and Reliability Research Institute, Graduate School of Engineering, University of Tohoku, Sendai, Miyagi, Japan","institution_ids":["https://openalex.org/I201537933"]},{"raw_affiliation_string":"Fracture and Reliability Research Institute, Graduate School of Engineering, Tohoku University, 6-6-11-712 Aobayama, Aoba-ku, Sendai, Miyagi, Japan","institution_ids":["https://openalex.org/I201537933"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5112287028","display_name":"Hideo Miura","orcid":null},"institutions":[{"id":"https://openalex.org/I201537933","display_name":"Tohoku University","ror":"https://ror.org/01dq60k83","country_code":"JP","type":"education","lineage":["https://openalex.org/I201537933"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"Hideo Miura","raw_affiliation_strings":["Fracture and Reliability Research Institute, Graduate School of Engineering, University of Tohoku, Sendai, Miyagi, Japan","Fracture and Reliability Research Institute, Graduate School of Engineering, Tohoku University, 6-6-11-712 Aobayama, Aoba-ku, Sendai, Miyagi, Japan"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Fracture and Reliability Research Institute, Graduate School of Engineering, University of Tohoku, Sendai, Miyagi, Japan","institution_ids":["https://openalex.org/I201537933"]},{"raw_affiliation_string":"Fracture and Reliability Research Institute, Graduate School of Engineering, Tohoku University, 6-6-11-712 Aobayama, Aoba-ku, Sendai, Miyagi, Japan","institution_ids":["https://openalex.org/I201537933"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":1,"corresponding_author_ids":[],"corresponding_institution_ids":["https://openalex.org/I201537933"],"apc_list":null,"apc_paid":null,"fwci":0.0,"has_fulltext":false,"cited_by_count":1,"citation_normalized_percentile":{"value":0.08269048,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":90,"max":94},"biblio":{"volume":"42","issue":null,"first_page":"1","last_page":"6"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10623","display_name":"Thin-Film Transistor Technologies","score":0.9988999962806702,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11301","display_name":"Advanced Surface Polishing Techniques","score":0.9988999962806702,"subfield":{"id":"https://openalex.org/subfields/2204","display_name":"Biomedical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/residual-stress","display_name":"Residual stress","score":0.8049848079681396},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.7617696523666382},{"id":"https://openalex.org/keywords/reliability","display_name":"Reliability (semiconductor)","score":0.6151942014694214},{"id":"https://openalex.org/keywords/stress","display_name":"Stress (linguistics)","score":0.5908697843551636},{"id":"https://openalex.org/keywords/finite-element-method","display_name":"Finite element method","score":0.5783407092094421},{"id":"https://openalex.org/keywords/residual","display_name":"Residual","score":0.5720876455307007},{"id":"https://openalex.org/keywords/deformation","display_name":"Deformation (meteorology)","score":0.5203623175621033},{"id":"https://openalex.org/keywords/strain-gauge","display_name":"Strain gauge","score":0.5143969655036926},{"id":"https://openalex.org/keywords/chip","display_name":"Chip","score":0.495077520608902},{"id":"https://openalex.org/keywords/composite-material","display_name":"Composite material","score":0.49505963921546936},{"id":"https://openalex.org/keywords/flip-chip","display_name":"Flip chip","score":0.44354182481765747},{"id":"https://openalex.org/keywords/silicon","display_name":"Silicon","score":0.4275517165660858},{"id":"https://openalex.org/keywords/structural-engineering","display_name":"Structural engineering","score":0.4077768921852112},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.15338066220283508},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.1532004177570343},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.11477524042129517},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.07434040307998657}],"concepts":[{"id":"https://openalex.org/C37292000","wikidata":"https://www.wikidata.org/wiki/Q1257918","display_name":"Residual stress","level":2,"score":0.8049848079681396},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.7617696523666382},{"id":"https://openalex.org/C43214815","wikidata":"https://www.wikidata.org/wiki/Q7310987","display_name":"Reliability (semiconductor)","level":3,"score":0.6151942014694214},{"id":"https://openalex.org/C21036866","wikidata":"https://www.wikidata.org/wiki/Q181767","display_name":"Stress (linguistics)","level":2,"score":0.5908697843551636},{"id":"https://openalex.org/C135628077","wikidata":"https://www.wikidata.org/wiki/Q220184","display_name":"Finite element method","level":2,"score":0.5783407092094421},{"id":"https://openalex.org/C155512373","wikidata":"https://www.wikidata.org/wiki/Q287450","display_name":"Residual","level":2,"score":0.5720876455307007},{"id":"https://openalex.org/C204366326","wikidata":"https://www.wikidata.org/wiki/Q3027650","display_name":"Deformation (meteorology)","level":2,"score":0.5203623175621033},{"id":"https://openalex.org/C60584519","wikidata":"https://www.wikidata.org/wiki/Q610723","display_name":"Strain gauge","level":2,"score":0.5143969655036926},{"id":"https://openalex.org/C165005293","wikidata":"https://www.wikidata.org/wiki/Q1074500","display_name":"Chip","level":2,"score":0.495077520608902},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.49505963921546936},{"id":"https://openalex.org/C79072407","wikidata":"https://www.wikidata.org/wiki/Q432439","display_name":"Flip chip","level":4,"score":0.44354182481765747},{"id":"https://openalex.org/C544956773","wikidata":"https://www.wikidata.org/wiki/Q670","display_name":"Silicon","level":2,"score":0.4275517165660858},{"id":"https://openalex.org/C66938386","wikidata":"https://www.wikidata.org/wiki/Q633538","display_name":"Structural engineering","level":1,"score":0.4077768921852112},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.15338066220283508},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.1532004177570343},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.11477524042129517},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.07434040307998657},{"id":"https://openalex.org/C62520636","wikidata":"https://www.wikidata.org/wiki/Q944","display_name":"Quantum mechanics","level":1,"score":0.0},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.0},{"id":"https://openalex.org/C68928338","wikidata":"https://www.wikidata.org/wiki/Q131790","display_name":"Adhesive","level":3,"score":0.0},{"id":"https://openalex.org/C11413529","wikidata":"https://www.wikidata.org/wiki/Q8366","display_name":"Algorithm","level":1,"score":0.0},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.0},{"id":"https://openalex.org/C41895202","wikidata":"https://www.wikidata.org/wiki/Q8162","display_name":"Linguistics","level":1,"score":0.0},{"id":"https://openalex.org/C163258240","wikidata":"https://www.wikidata.org/wiki/Q25342","display_name":"Power (physics)","level":2,"score":0.0},{"id":"https://openalex.org/C138885662","wikidata":"https://www.wikidata.org/wiki/Q5891","display_name":"Philosophy","level":0,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/3dic.2012.6262997","is_oa":false,"landing_page_url":"https://doi.org/10.1109/3dic.2012.6262997","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2011 IEEE International 3D Systems Integration Conference (3DIC), 2011 IEEE International","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":12,"referenced_works":["https://openalex.org/W89689571","https://openalex.org/W1975885381","https://openalex.org/W2017910542","https://openalex.org/W2041893890","https://openalex.org/W2078535267","https://openalex.org/W2079594558","https://openalex.org/W2092162095","https://openalex.org/W2151613126","https://openalex.org/W2160281164","https://openalex.org/W2342238189","https://openalex.org/W2538754013","https://openalex.org/W6670340592"],"related_works":["https://openalex.org/W2350159546","https://openalex.org/W2915158639","https://openalex.org/W4232272518","https://openalex.org/W1530391261","https://openalex.org/W4211121654","https://openalex.org/W2532422067","https://openalex.org/W2115932404","https://openalex.org/W2046757767","https://openalex.org/W2261056475","https://openalex.org/W2151795613"],"abstract_inverted_index":{"Since":[0],"the":[1,13,21,25,51,60],"residual":[2,26,45],"stress":[3,27,46],"in":[4,9],"a":[5,32],"silicon":[6],"chip":[7,52],"mounted":[8],"3D":[10],"modules":[11],"causes":[12],"degradation":[14],"of":[15,24,50,63],"both":[16],"electrical":[17],"and":[18,36,47,65,67],"mechanical":[19,61],"reliability,":[20],"dominant":[22],"factors":[23],"was":[28],"investigated":[29],"by":[30],"using":[31],"finite":[33],"element":[34],"method":[35],"experiments":[37],"applying":[38],"2-\u03bcm":[39],"long":[40],"piezoresistance":[41],"strain":[42],"gauges.":[43],"The":[44],"local":[48],"deformation":[49],"were":[53],"found":[54],"to":[55],"vary":[56],"drastically":[57],"depending":[58],"on":[59],"properties":[62],"bumps":[64],"underfill":[66],"bump":[68],"alignment":[69],"structures.":[70]},"counts_by_year":[{"year":2016,"cited_by_count":1}],"updated_date":"2026-06-26T08:34:08.712188","created_date":"2025-10-10T00:00:00"}