{"id":"https://openalex.org/W1975782245","doi":"https://doi.org/10.1109/3dic.2012.6262964","title":"In-tier diagnosis of power domains in 3D TSV ICs","display_name":"In-tier diagnosis of power domains in 3D TSV ICs","publication_year":2012,"publication_date":"2012-01-01","ids":{"openalex":"https://openalex.org/W1975782245","doi":"https://doi.org/10.1109/3dic.2012.6262964","mag":"1975782245"},"language":"en","primary_location":{"id":"doi:10.1109/3dic.2012.6262964","is_oa":false,"landing_page_url":"https://doi.org/10.1109/3dic.2012.6262964","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2011 IEEE International 3D Systems Integration Conference (3DIC), 2011 IEEE International","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5043478731","display_name":"Yuuki Araga","orcid":"https://orcid.org/0000-0002-2081-3303"},"institutions":[{"id":"https://openalex.org/I65837984","display_name":"Kobe University","ror":"https://ror.org/03tgsfw79","country_code":"JP","type":"education","lineage":["https://openalex.org/I65837984"]}],"countries":["JP"],"is_corresponding":true,"raw_author_name":"Y. Araga","raw_affiliation_strings":["Graduate School of System Informatics, Kobe University, Kobe, Japan","Graduate School of System Informatics, Kobe University Kobe, Japan"],"affiliations":[{"raw_affiliation_string":"Graduate School of System Informatics, Kobe University, Kobe, Japan","institution_ids":["https://openalex.org/I65837984"]},{"raw_affiliation_string":"Graduate School of System Informatics, Kobe University Kobe, Japan","institution_ids":["https://openalex.org/I65837984"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5070370721","display_name":"Makoto Nagata","orcid":"https://orcid.org/0000-0002-0625-9107"},"institutions":[{"id":"https://openalex.org/I65837984","display_name":"Kobe University","ror":"https://ror.org/03tgsfw79","country_code":"JP","type":"education","lineage":["https://openalex.org/I65837984"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"M. Nagata","raw_affiliation_strings":["Graduate School of System Informatics, Kobe University, Kobe, Japan","Graduate School of System Informatics, Kobe University Kobe, Japan"],"affiliations":[{"raw_affiliation_string":"Graduate School of System Informatics, Kobe University, Kobe, Japan","institution_ids":["https://openalex.org/I65837984"]},{"raw_affiliation_string":"Graduate School of System Informatics, Kobe University Kobe, Japan","institution_ids":["https://openalex.org/I65837984"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5073931298","display_name":"Geert Van der Plas","orcid":"https://orcid.org/0000-0002-4975-6672"},"institutions":[{"id":"https://openalex.org/I4210114974","display_name":"IMEC","ror":"https://ror.org/02kcbn207","country_code":"BE","type":"nonprofit","lineage":["https://openalex.org/I4210114974"]}],"countries":["BE"],"is_corresponding":false,"raw_author_name":"G. Van der Plas","raw_affiliation_strings":["IMEC, Leuven, Belgium","IMEC, Kapeldreef 75, 3001 Leuven Belgium,"],"affiliations":[{"raw_affiliation_string":"IMEC, Leuven, Belgium","institution_ids":["https://openalex.org/I4210114974"]},{"raw_affiliation_string":"IMEC, Kapeldreef 75, 3001 Leuven Belgium,","institution_ids":["https://openalex.org/I4210114974"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5112674893","display_name":"Jaemin Kim","orcid":"https://orcid.org/0000-0002-2841-4446"},"institutions":[{"id":"https://openalex.org/I4210114974","display_name":"IMEC","ror":"https://ror.org/02kcbn207","country_code":"BE","type":"nonprofit","lineage":["https://openalex.org/I4210114974"]}],"countries":["BE"],"is_corresponding":false,"raw_author_name":"Jaemin Kim","raw_affiliation_strings":["IMEC, Leuven, Belgium","IMEC, Kapeldreef 75, 3001 Leuven Belgium,"],"affiliations":[{"raw_affiliation_string":"IMEC, Leuven, Belgium","institution_ids":["https://openalex.org/I4210114974"]},{"raw_affiliation_string":"IMEC, Kapeldreef 75, 3001 Leuven Belgium,","institution_ids":["https://openalex.org/I4210114974"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5026091296","display_name":"Nikolaos Minas","orcid":null},"institutions":[{"id":"https://openalex.org/I4210114974","display_name":"IMEC","ror":"https://ror.org/02kcbn207","country_code":"BE","type":"nonprofit","lineage":["https://openalex.org/I4210114974"]}],"countries":["BE"],"is_corresponding":false,"raw_author_name":"N. Minas","raw_affiliation_strings":["IMEC, Leuven, Belgium","IMEC, Kapeldreef 75, 3001 Leuven Belgium,"],"affiliations":[{"raw_affiliation_string":"IMEC, Leuven, Belgium","institution_ids":["https://openalex.org/I4210114974"]},{"raw_affiliation_string":"IMEC, Kapeldreef 75, 3001 Leuven Belgium,","institution_ids":["https://openalex.org/I4210114974"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5109152811","display_name":"Pierre Marchal","orcid":null},"institutions":[{"id":"https://openalex.org/I4210114974","display_name":"IMEC","ror":"https://ror.org/02kcbn207","country_code":"BE","type":"nonprofit","lineage":["https://openalex.org/I4210114974"]}],"countries":["BE"],"is_corresponding":false,"raw_author_name":"P. Marchal","raw_affiliation_strings":["IMEC, Leuven, Belgium","IMEC, Kapeldreef 75, 3001 Leuven Belgium,"],"affiliations":[{"raw_affiliation_string":"IMEC, Leuven, Belgium","institution_ids":["https://openalex.org/I4210114974"]},{"raw_affiliation_string":"IMEC, Kapeldreef 75, 3001 Leuven Belgium,","institution_ids":["https://openalex.org/I4210114974"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5016839480","display_name":"Youssef Travaly","orcid":null},"institutions":[{"id":"https://openalex.org/I4210114974","display_name":"IMEC","ror":"https://ror.org/02kcbn207","country_code":"BE","type":"nonprofit","lineage":["https://openalex.org/I4210114974"]}],"countries":["BE"],"is_corresponding":false,"raw_author_name":"Y. Travaly","raw_affiliation_strings":["IMEC, Leuven, Belgium","IMEC, Kapeldreef 75, 3001 Leuven Belgium,"],"affiliations":[{"raw_affiliation_string":"IMEC, Leuven, Belgium","institution_ids":["https://openalex.org/I4210114974"]},{"raw_affiliation_string":"IMEC, Kapeldreef 75, 3001 Leuven Belgium,","institution_ids":["https://openalex.org/I4210114974"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5111373454","display_name":"M. Libois","orcid":null},"institutions":[{"id":"https://openalex.org/I4210114974","display_name":"IMEC","ror":"https://ror.org/02kcbn207","country_code":"BE","type":"nonprofit","lineage":["https://openalex.org/I4210114974"]}],"countries":["BE"],"is_corresponding":false,"raw_author_name":"M. Libois","raw_affiliation_strings":["IMEC, Leuven, Belgium","IMEC, Kapeldreef 75, 3001 Leuven Belgium,"],"affiliations":[{"raw_affiliation_string":"IMEC, Leuven, Belgium","institution_ids":["https://openalex.org/I4210114974"]},{"raw_affiliation_string":"IMEC, Kapeldreef 75, 3001 Leuven Belgium,","institution_ids":["https://openalex.org/I4210114974"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5071223809","display_name":"Antonio Manna","orcid":"https://orcid.org/0000-0001-9776-3300"},"institutions":[{"id":"https://openalex.org/I4210114974","display_name":"IMEC","ror":"https://ror.org/02kcbn207","country_code":"BE","type":"nonprofit","lineage":["https://openalex.org/I4210114974"]}],"countries":["BE"],"is_corresponding":false,"raw_author_name":"A. La Manna","raw_affiliation_strings":["IMEC, Leuven, Belgium","IMEC, Kapeldreef 75, 3001 Leuven Belgium,"],"affiliations":[{"raw_affiliation_string":"IMEC, Leuven, Belgium","institution_ids":["https://openalex.org/I4210114974"]},{"raw_affiliation_string":"IMEC, Kapeldreef 75, 3001 Leuven Belgium,","institution_ids":["https://openalex.org/I4210114974"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5084369635","display_name":"Wen Qi Zhang","orcid":"https://orcid.org/0000-0002-6524-6138"},"institutions":[{"id":"https://openalex.org/I4210114974","display_name":"IMEC","ror":"https://ror.org/02kcbn207","country_code":"BE","type":"nonprofit","lineage":["https://openalex.org/I4210114974"]}],"countries":["BE"],"is_corresponding":false,"raw_author_name":"Wenqi Zhang","raw_affiliation_strings":["IMEC, Leuven, Belgium","IMEC, Kapeldreef 75, 3001 Leuven Belgium,"],"affiliations":[{"raw_affiliation_string":"IMEC, Leuven, Belgium","institution_ids":["https://openalex.org/I4210114974"]},{"raw_affiliation_string":"IMEC, Kapeldreef 75, 3001 Leuven Belgium,","institution_ids":["https://openalex.org/I4210114974"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5051712390","display_name":"Eric Beyne","orcid":"https://orcid.org/0000-0002-3096-050X"},"institutions":[{"id":"https://openalex.org/I4210114974","display_name":"IMEC","ror":"https://ror.org/02kcbn207","country_code":"BE","type":"nonprofit","lineage":["https://openalex.org/I4210114974"]}],"countries":["BE"],"is_corresponding":false,"raw_author_name":"E. Beyne","raw_affiliation_strings":["IMEC, Leuven, Belgium","IMEC, Kapeldreef 75, 3001 Leuven Belgium,"],"affiliations":[{"raw_affiliation_string":"IMEC, Leuven, Belgium","institution_ids":["https://openalex.org/I4210114974"]},{"raw_affiliation_string":"IMEC, Kapeldreef 75, 3001 Leuven Belgium,","institution_ids":["https://openalex.org/I4210114974"]}]}],"institutions":[],"countries_distinct_count":2,"institutions_distinct_count":11,"corresponding_author_ids":["https://openalex.org/A5043478731"],"corresponding_institution_ids":["https://openalex.org/I65837984"],"apc_list":null,"apc_paid":null,"fwci":0.491,"has_fulltext":false,"cited_by_count":2,"citation_normalized_percentile":{"value":0.66414543,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":94},"biblio":{"volume":null,"issue":null,"first_page":"1","last_page":"6"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.9975000023841858,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10472","display_name":"Semiconductor materials and devices","score":0.9973999857902527,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/three-dimensional-integrated-circuit","display_name":"Three-dimensional integrated circuit","score":0.6931742429733276},{"id":"https://openalex.org/keywords/cmos","display_name":"CMOS","score":0.6393867135047913},{"id":"https://openalex.org/keywords/substrate","display_name":"Substrate (aquarium)","score":0.557589590549469},{"id":"https://openalex.org/keywords/stack","display_name":"Stack (abstract data type)","score":0.5538955330848694},{"id":"https://openalex.org/keywords/power","display_name":"Power (physics)","score":0.4701029658317566},{"id":"https://openalex.org/keywords/coupling","display_name":"Coupling (piping)","score":0.4567711055278778},{"id":"https://openalex.org/keywords/chip","display_name":"Chip","score":0.44654208421707153},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.42739975452423096},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.37720322608947754},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.3761116564273834},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.30120524764060974},{"id":"https://openalex.org/keywords/integrated-circuit","display_name":"Integrated circuit","score":0.26978302001953125},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.19773265719413757},{"id":"https://openalex.org/keywords/telecommunications","display_name":"Telecommunications","score":0.15502259135246277},{"id":"https://openalex.org/keywords/physics","display_name":"Physics","score":0.06407365202903748}],"concepts":[{"id":"https://openalex.org/C59088047","wikidata":"https://www.wikidata.org/wiki/Q229370","display_name":"Three-dimensional integrated circuit","level":3,"score":0.6931742429733276},{"id":"https://openalex.org/C46362747","wikidata":"https://www.wikidata.org/wiki/Q173431","display_name":"CMOS","level":2,"score":0.6393867135047913},{"id":"https://openalex.org/C2777289219","wikidata":"https://www.wikidata.org/wiki/Q7632154","display_name":"Substrate (aquarium)","level":2,"score":0.557589590549469},{"id":"https://openalex.org/C9395851","wikidata":"https://www.wikidata.org/wiki/Q177929","display_name":"Stack (abstract data type)","level":2,"score":0.5538955330848694},{"id":"https://openalex.org/C163258240","wikidata":"https://www.wikidata.org/wiki/Q25342","display_name":"Power (physics)","level":2,"score":0.4701029658317566},{"id":"https://openalex.org/C131584629","wikidata":"https://www.wikidata.org/wiki/Q4308705","display_name":"Coupling (piping)","level":2,"score":0.4567711055278778},{"id":"https://openalex.org/C165005293","wikidata":"https://www.wikidata.org/wiki/Q1074500","display_name":"Chip","level":2,"score":0.44654208421707153},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.42739975452423096},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.37720322608947754},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.3761116564273834},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.30120524764060974},{"id":"https://openalex.org/C530198007","wikidata":"https://www.wikidata.org/wiki/Q80831","display_name":"Integrated circuit","level":2,"score":0.26978302001953125},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.19773265719413757},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.15502259135246277},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.06407365202903748},{"id":"https://openalex.org/C127313418","wikidata":"https://www.wikidata.org/wiki/Q1069","display_name":"Geology","level":0,"score":0.0},{"id":"https://openalex.org/C111368507","wikidata":"https://www.wikidata.org/wiki/Q43518","display_name":"Oceanography","level":1,"score":0.0},{"id":"https://openalex.org/C191897082","wikidata":"https://www.wikidata.org/wiki/Q11467","display_name":"Metallurgy","level":1,"score":0.0},{"id":"https://openalex.org/C62520636","wikidata":"https://www.wikidata.org/wiki/Q944","display_name":"Quantum mechanics","level":1,"score":0.0},{"id":"https://openalex.org/C199360897","wikidata":"https://www.wikidata.org/wiki/Q9143","display_name":"Programming language","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/3dic.2012.6262964","is_oa":false,"landing_page_url":"https://doi.org/10.1109/3dic.2012.6262964","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2011 IEEE International 3D Systems Integration Conference (3DIC), 2011 IEEE International","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"display_name":"Industry, innovation and infrastructure","id":"https://metadata.un.org/sdg/9","score":0.47999998927116394}],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":6,"referenced_works":["https://openalex.org/W1993400043","https://openalex.org/W2013232664","https://openalex.org/W2082499523","https://openalex.org/W2107304970","https://openalex.org/W2154133941","https://openalex.org/W4231938743"],"related_works":["https://openalex.org/W2380576232","https://openalex.org/W2937054111","https://openalex.org/W2066223521","https://openalex.org/W373327546","https://openalex.org/W3014521742","https://openalex.org/W2058958858","https://openalex.org/W1835805572","https://openalex.org/W2321534397","https://openalex.org/W2122018048","https://openalex.org/W50048258"],"abstract_inverted_index":{"Power":[0],"and":[1,21,33],"substrate":[2,22],"domains":[3],"are":[4],"strategically":[5],"isolated":[6],"or":[7],"unified":[8],"in":[9,24,46],"heterogeneous":[10],"3D":[11,30],"integration.":[12],"In-tier":[13],"probing":[14],"circuitry":[15],"provides":[16],"accessibility":[17],"to":[18],"power":[19],"delivery":[20],"networks":[23],"a":[25,29,47],"deep":[26],"tier":[27,38],"of":[28,35],"chip":[31],"stack":[32],"capability":[34],"diagnosing":[36],"intra/inter":[37],"coupling.":[39],"A":[40],"two-tier":[41],"demonstrator":[42],"was":[43],"successfully":[44],"tested":[45],"130":[48],"nm":[49],"CMOS,":[50],"3D-SIC":[51],"Cu":[52],"TSV":[53],"technology.":[54]},"counts_by_year":[{"year":2014,"cited_by_count":1},{"year":2013,"cited_by_count":1}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}