{"id":"https://openalex.org/W2015820405","doi":"https://doi.org/10.1109/3dic.2012.6262951","title":"3D stacking using ultra thin dies","display_name":"3D stacking using ultra thin dies","publication_year":2012,"publication_date":"2012-01-01","ids":{"openalex":"https://openalex.org/W2015820405","doi":"https://doi.org/10.1109/3dic.2012.6262951","mag":"2015820405"},"language":"en","primary_location":{"id":"doi:10.1109/3dic.2012.6262951","is_oa":false,"landing_page_url":"https://doi.org/10.1109/3dic.2012.6262951","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2011 IEEE International 3D Systems Integration Conference (3DIC), 2011 IEEE International","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5071223809","display_name":"Antonio Manna","orcid":"https://orcid.org/0000-0001-9776-3300"},"institutions":[{"id":"https://openalex.org/I4210114974","display_name":"IMEC","ror":"https://ror.org/02kcbn207","country_code":"BE","type":"nonprofit","lineage":["https://openalex.org/I4210114974"]}],"countries":["BE"],"is_corresponding":false,"raw_author_name":"A. La Manna","raw_affiliation_strings":["IMEC, Leuven, Belgium","Imec, Kapeldreef 75, B\u20103001 Leuven, Belgium"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"IMEC, Leuven, Belgium","institution_ids":["https://openalex.org/I4210114974"]},{"raw_affiliation_string":"Imec, Kapeldreef 75, B\u20103001 Leuven, Belgium","institution_ids":["https://openalex.org/I4210114974"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5050757937","display_name":"Dimitrios Velenis","orcid":"https://orcid.org/0000-0001-7947-8098"},"institutions":[{"id":"https://openalex.org/I4210114974","display_name":"IMEC","ror":"https://ror.org/02kcbn207","country_code":"BE","type":"nonprofit","lineage":["https://openalex.org/I4210114974"]}],"countries":["BE"],"is_corresponding":false,"raw_author_name":"D. Velenis","raw_affiliation_strings":["IMEC, Leuven, Belgium","Imec, Kapeldreef 75, B\u20103001 Leuven, Belgium"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"IMEC, Leuven, Belgium","institution_ids":["https://openalex.org/I4210114974"]},{"raw_affiliation_string":"Imec, Kapeldreef 75, B\u20103001 Leuven, Belgium","institution_ids":["https://openalex.org/I4210114974"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5058632834","display_name":"Thibault Buisson","orcid":null},"institutions":[{"id":"https://openalex.org/I4210114974","display_name":"IMEC","ror":"https://ror.org/02kcbn207","country_code":"BE","type":"nonprofit","lineage":["https://openalex.org/I4210114974"]}],"countries":["BE"],"is_corresponding":false,"raw_author_name":"T. Buisson","raw_affiliation_strings":["IMEC, Leuven, Belgium","Imec, Kapeldreef 75, B\u20103001 Leuven, Belgium"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"IMEC, Leuven, Belgium","institution_ids":["https://openalex.org/I4210114974"]},{"raw_affiliation_string":"Imec, Kapeldreef 75, B\u20103001 Leuven, Belgium","institution_ids":["https://openalex.org/I4210114974"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5004278657","display_name":"Mikael Detalle","orcid":null},"institutions":[{"id":"https://openalex.org/I4210114974","display_name":"IMEC","ror":"https://ror.org/02kcbn207","country_code":"BE","type":"nonprofit","lineage":["https://openalex.org/I4210114974"]}],"countries":["BE"],"is_corresponding":false,"raw_author_name":"M. Detalle","raw_affiliation_strings":["IMEC, Leuven, Belgium","Imec, Kapeldreef 75, B\u20103001 Leuven, Belgium"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"IMEC, Leuven, Belgium","institution_ids":["https://openalex.org/I4210114974"]},{"raw_affiliation_string":"Imec, Kapeldreef 75, B\u20103001 Leuven, Belgium","institution_ids":["https://openalex.org/I4210114974"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5063785314","display_name":"Kenneth June Rebibis","orcid":null},"institutions":[{"id":"https://openalex.org/I4210114974","display_name":"IMEC","ror":"https://ror.org/02kcbn207","country_code":"BE","type":"nonprofit","lineage":["https://openalex.org/I4210114974"]}],"countries":["BE"],"is_corresponding":false,"raw_author_name":"K. J. Rebibis","raw_affiliation_strings":["IMEC, Leuven, Belgium","Imec, Kapeldreef 75, B\u20103001 Leuven, Belgium"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"IMEC, Leuven, Belgium","institution_ids":["https://openalex.org/I4210114974"]},{"raw_affiliation_string":"Imec, Kapeldreef 75, B\u20103001 Leuven, Belgium","institution_ids":["https://openalex.org/I4210114974"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5015132604","display_name":"W. Zhang","orcid":null},"institutions":[{"id":"https://openalex.org/I4210114974","display_name":"IMEC","ror":"https://ror.org/02kcbn207","country_code":"BE","type":"nonprofit","lineage":["https://openalex.org/I4210114974"]}],"countries":["BE"],"is_corresponding":false,"raw_author_name":"W. Zhang","raw_affiliation_strings":["IMEC, Leuven, Belgium","Imec, Kapeldreef 75, B\u20103001 Leuven, Belgium"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"IMEC, Leuven, Belgium","institution_ids":["https://openalex.org/I4210114974"]},{"raw_affiliation_string":"Imec, Kapeldreef 75, B\u20103001 Leuven, Belgium","institution_ids":["https://openalex.org/I4210114974"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5051712390","display_name":"Eric Beyne","orcid":"https://orcid.org/0000-0002-3096-050X"},"institutions":[{"id":"https://openalex.org/I4210114974","display_name":"IMEC","ror":"https://ror.org/02kcbn207","country_code":"BE","type":"nonprofit","lineage":["https://openalex.org/I4210114974"]}],"countries":["BE"],"is_corresponding":false,"raw_author_name":"E. Beyne","raw_affiliation_strings":["IMEC, Leuven, Belgium","Imec, Kapeldreef 75, B\u20103001 Leuven, Belgium"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"IMEC, Leuven, Belgium","institution_ids":["https://openalex.org/I4210114974"]},{"raw_affiliation_string":"Imec, Kapeldreef 75, B\u20103001 Leuven, Belgium","institution_ids":["https://openalex.org/I4210114974"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":7,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":0.7495,"has_fulltext":false,"cited_by_count":5,"citation_normalized_percentile":{"value":0.74053563,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":96},"biblio":{"volume":null,"issue":null,"first_page":"1","last_page":"5"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11301","display_name":"Advanced Surface Polishing Techniques","score":0.9980999827384949,"subfield":{"id":"https://openalex.org/subfields/2204","display_name":"Biomedical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12224","display_name":"Nanofabrication and Lithography Techniques","score":0.9969000220298767,"subfield":{"id":"https://openalex.org/subfields/2204","display_name":"Biomedical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/stacking","display_name":"Stacking","score":0.7457787990570068},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.544124186038971},{"id":"https://openalex.org/keywords/die","display_name":"Die (integrated circuit)","score":0.44989272952079773},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.39859503507614136},{"id":"https://openalex.org/keywords/nanotechnology","display_name":"Nanotechnology","score":0.09677881002426147},{"id":"https://openalex.org/keywords/physics","display_name":"Physics","score":0.07538914680480957}],"concepts":[{"id":"https://openalex.org/C33347731","wikidata":"https://www.wikidata.org/wiki/Q285210","display_name":"Stacking","level":2,"score":0.7457787990570068},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.544124186038971},{"id":"https://openalex.org/C111106434","wikidata":"https://www.wikidata.org/wiki/Q1072430","display_name":"Die (integrated circuit)","level":2,"score":0.44989272952079773},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.39859503507614136},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.09677881002426147},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.07538914680480957},{"id":"https://openalex.org/C46141821","wikidata":"https://www.wikidata.org/wiki/Q209402","display_name":"Nuclear magnetic resonance","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/3dic.2012.6262951","is_oa":false,"landing_page_url":"https://doi.org/10.1109/3dic.2012.6262951","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2011 IEEE International 3D Systems Integration Conference (3DIC), 2011 IEEE International","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":3,"referenced_works":["https://openalex.org/W121044806","https://openalex.org/W1988722054","https://openalex.org/W2102433308"],"related_works":["https://openalex.org/W4391375266","https://openalex.org/W2748952813","https://openalex.org/W2035329725","https://openalex.org/W4376641153","https://openalex.org/W2070875936","https://openalex.org/W4250391473","https://openalex.org/W3045075405","https://openalex.org/W4302292679","https://openalex.org/W4241625287","https://openalex.org/W2050788868"],"abstract_inverted_index":{"3D":[0,46,113,141],"IC":[1,31,84],"integration":[2],"is":[3,26,48],"nowadays":[4],"considered":[5],"as":[6],"the":[7,13,73,76,91,109,116,135],"most":[8],"promising":[9],"technology":[10,53],"for":[11,95,112],"extending":[12],"scaling":[14],"concept":[15],"of":[16],"Moore's":[17],"Law.":[18],"By":[19],"using":[20,120],"TSVs":[21],"(Thru":[22],"Silicon":[23],"Vias)":[24],"it":[25],"possible":[27],"to":[28,61,66],"vertically":[29],"stack":[30],"devices":[32],"and":[33,54,57,75,81,103,115,126,140],"increase":[34,44],"device":[35,96],"functionalities":[36],"without":[37],"requiring":[38],"transistors":[39],"shrinkage":[40],"and/or":[41],"2D":[42],"sizes":[43],"[1].":[45],"stacking":[47,82,114],"anyway":[49],"a":[50],"relative":[51],"new":[52],"many":[55],"issues":[56],"concerns":[58],"are":[59],"still":[60],"be":[62],"resolved":[63],"before":[64],"moving":[65],"high":[67],"volume":[68],"manufacturing.":[69],"This":[70],"work":[71],"describes":[72],"learning":[74],"results":[77,136],"achieved":[78],"by":[79,119],"manufacturing":[80,97],"\u201cultra-thin\u201d":[83],"components":[85],"with":[86],"TSVs.":[87],"We":[88,132],"report":[89],"on":[90,108],"main":[92],"processes":[93],"required":[94],"like":[98],"backside":[99],"RDL":[100],"(Re-Distribution":[101],"Layer)":[102],"\u03bcbumping;":[104],"we":[105],"also":[106],"reports":[107],"approaches":[110],"used":[111],"effects":[117],"observed":[118],"NUF":[121],"(No":[122],"Flow":[123],"Under":[124],"Fill)":[125],"WAUF":[127],"(Wafer":[128],"Applied":[129],"Underfill)":[130],"[2].":[131],"finally":[133],"present":[134],"coming":[137],"from":[138],"wafers":[139],"stacks":[142],"characterization.":[143]},"counts_by_year":[{"year":2022,"cited_by_count":1},{"year":2021,"cited_by_count":1},{"year":2015,"cited_by_count":2},{"year":2014,"cited_by_count":1}],"updated_date":"2026-06-11T09:08:48.828518","created_date":"2025-10-10T00:00:00"}