{"id":"https://openalex.org/W2027125771","doi":"https://doi.org/10.1109/3dic.2012.6262949","title":"Wafer-level 3D integration with Cu TSV and micro-bump/adhesive hybrid bonding technologies","display_name":"Wafer-level 3D integration with Cu TSV and micro-bump/adhesive hybrid bonding technologies","publication_year":2012,"publication_date":"2012-01-01","ids":{"openalex":"https://openalex.org/W2027125771","doi":"https://doi.org/10.1109/3dic.2012.6262949","mag":"2027125771"},"language":"en","primary_location":{"id":"doi:10.1109/3dic.2012.6262949","is_oa":false,"landing_page_url":"https://doi.org/10.1109/3dic.2012.6262949","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2011 IEEE International 3D Systems Integration Conference (3DIC), 2011 IEEE International","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5111856105","display_name":"C. T. Ko","orcid":null},"institutions":[{"id":"https://openalex.org/I4210148468","display_name":"Industrial Technology Research Institute","ror":"https://ror.org/05szzwt63","country_code":"TW","type":"nonprofit","lineage":["https://openalex.org/I4210148468"]},{"id":"https://openalex.org/I148366613","display_name":"National Yang Ming Chiao Tung University","ror":"https://ror.org/00se2k293","country_code":"TW","type":"education","lineage":["https://openalex.org/I148366613"]}],"countries":["TW"],"is_corresponding":true,"raw_author_name":"C. T. Ko","raw_affiliation_strings":["Department of Electronics Engineering, National Chiao Tung University, Hsinchu, Taiwan","Electronics and Optoelectronics Research Laboratories, Industrial Technology Research Institute (ITRI), Hsinchu, Taiwan"],"affiliations":[{"raw_affiliation_string":"Department of Electronics Engineering, National Chiao Tung University, Hsinchu, Taiwan","institution_ids":["https://openalex.org/I148366613"]},{"raw_affiliation_string":"Electronics and Optoelectronics Research Laboratories, Industrial Technology Research Institute (ITRI), Hsinchu, Taiwan","institution_ids":["https://openalex.org/I4210148468"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5112047035","display_name":"Z. C. Hsiao","orcid":null},"institutions":[{"id":"https://openalex.org/I4210148468","display_name":"Industrial Technology Research Institute","ror":"https://ror.org/05szzwt63","country_code":"TW","type":"nonprofit","lineage":["https://openalex.org/I4210148468"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"Z. C. Hsiao","raw_affiliation_strings":["Electronics and Optoelectronics Research Laboratories, Industrial Technology Research Institute (ITRI), Hsinchu, Taiwan"],"affiliations":[{"raw_affiliation_string":"Electronics and Optoelectronics Research Laboratories, Industrial Technology Research Institute (ITRI), Hsinchu, Taiwan","institution_ids":["https://openalex.org/I4210148468"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5101900352","display_name":"Y. J. Chang","orcid":"https://orcid.org/0000-0002-0441-3385"},"institutions":[{"id":"https://openalex.org/I148366613","display_name":"National Yang Ming Chiao Tung University","ror":"https://ror.org/00se2k293","country_code":"TW","type":"education","lineage":["https://openalex.org/I148366613"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"Y. J. Chang","raw_affiliation_strings":["Department of Electronics Engineering, National Chiao Tung University, Hsinchu, Taiwan"],"affiliations":[{"raw_affiliation_string":"Department of Electronics Engineering, National Chiao Tung University, Hsinchu, Taiwan","institution_ids":["https://openalex.org/I148366613"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5061438204","display_name":"P. S. Chen","orcid":null},"institutions":[{"id":"https://openalex.org/I4210148468","display_name":"Industrial Technology Research Institute","ror":"https://ror.org/05szzwt63","country_code":"TW","type":"nonprofit","lineage":["https://openalex.org/I4210148468"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"P. S. Chen","raw_affiliation_strings":["Electronics and Optoelectronics Research Laboratories, Industrial Technology Research Institute (ITRI), Hsinchu, Taiwan"],"affiliations":[{"raw_affiliation_string":"Electronics and Optoelectronics Research Laboratories, Industrial Technology Research Institute (ITRI), Hsinchu, Taiwan","institution_ids":["https://openalex.org/I4210148468"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5038760315","display_name":"J. H. Huang","orcid":"https://orcid.org/0009-0008-1147-5518"},"institutions":[{"id":"https://openalex.org/I4210148468","display_name":"Industrial Technology Research Institute","ror":"https://ror.org/05szzwt63","country_code":"TW","type":"nonprofit","lineage":["https://openalex.org/I4210148468"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"J. H. Huang","raw_affiliation_strings":["Electronics and Optoelectronics Research Laboratories, Industrial Technology Research Institute (ITRI), Hsinchu, Taiwan"],"affiliations":[{"raw_affiliation_string":"Electronics and Optoelectronics Research Laboratories, Industrial Technology Research Institute (ITRI), Hsinchu, Taiwan","institution_ids":["https://openalex.org/I4210148468"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5100701743","display_name":"Han Fu","orcid":"https://orcid.org/0000-0001-5869-7275"},"institutions":[{"id":"https://openalex.org/I4210148468","display_name":"Industrial Technology Research Institute","ror":"https://ror.org/05szzwt63","country_code":"TW","type":"nonprofit","lineage":["https://openalex.org/I4210148468"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"H. C. Fu","raw_affiliation_strings":["Electronics and Optoelectronics Research Laboratories, Industrial Technology Research Institute (ITRI), Hsinchu, Taiwan"],"affiliations":[{"raw_affiliation_string":"Electronics and Optoelectronics Research Laboratories, Industrial Technology Research Institute (ITRI), Hsinchu, Taiwan","institution_ids":["https://openalex.org/I4210148468"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5088946293","display_name":"Yi\u2010June Huang","orcid":"https://orcid.org/0000-0003-4221-6910"},"institutions":[{"id":"https://openalex.org/I4210148468","display_name":"Industrial Technology Research Institute","ror":"https://ror.org/05szzwt63","country_code":"TW","type":"nonprofit","lineage":["https://openalex.org/I4210148468"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"Y. J. Huang","raw_affiliation_strings":["Electronics and Optoelectronics Research Laboratories, Industrial Technology Research Institute (ITRI), Hsinchu, Taiwan"],"affiliations":[{"raw_affiliation_string":"Electronics and Optoelectronics Research Laboratories, Industrial Technology Research Institute (ITRI), Hsinchu, Taiwan","institution_ids":["https://openalex.org/I4210148468"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5102769784","display_name":"Chia\u2010Wei Chiang","orcid":"https://orcid.org/0000-0002-9104-3190"},"institutions":[{"id":"https://openalex.org/I4210148468","display_name":"Industrial Technology Research Institute","ror":"https://ror.org/05szzwt63","country_code":"TW","type":"nonprofit","lineage":["https://openalex.org/I4210148468"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"C. W. Chiang","raw_affiliation_strings":["Electronics and Optoelectronics Research Laboratories, Industrial Technology Research Institute (ITRI), Hsinchu, Taiwan"],"affiliations":[{"raw_affiliation_string":"Electronics and Optoelectronics Research Laboratories, Industrial Technology Research Institute (ITRI), Hsinchu, Taiwan","institution_ids":["https://openalex.org/I4210148468"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5015972650","display_name":"Wei\u2010Chi Tsai","orcid":"https://orcid.org/0000-0002-3443-5788"},"institutions":[{"id":"https://openalex.org/I4210148468","display_name":"Industrial Technology Research Institute","ror":"https://ror.org/05szzwt63","country_code":"TW","type":"nonprofit","lineage":["https://openalex.org/I4210148468"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"W. L. Tsai","raw_affiliation_strings":["Electronics and Optoelectronics Research Laboratories, Industrial Technology Research Institute (ITRI), Hsinchu, Taiwan"],"affiliations":[{"raw_affiliation_string":"Electronics and Optoelectronics Research Laboratories, Industrial Technology Research Institute (ITRI), Hsinchu, Taiwan","institution_ids":["https://openalex.org/I4210148468"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5027385891","display_name":"Yizheng Chen","orcid":"https://orcid.org/0009-0009-6736-7994"},"institutions":[{"id":"https://openalex.org/I4210148468","display_name":"Industrial Technology Research Institute","ror":"https://ror.org/05szzwt63","country_code":"TW","type":"nonprofit","lineage":["https://openalex.org/I4210148468"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"Y. H. Chen","raw_affiliation_strings":["Electronics and Optoelectronics Research Laboratories, Industrial Technology Research Institute (ITRI), Hsinchu, Taiwan"],"affiliations":[{"raw_affiliation_string":"Electronics and Optoelectronics Research Laboratories, Industrial Technology Research Institute (ITRI), Hsinchu, Taiwan","institution_ids":["https://openalex.org/I4210148468"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5113477200","display_name":"W. C. Lo","orcid":null},"institutions":[{"id":"https://openalex.org/I4210148468","display_name":"Industrial Technology Research Institute","ror":"https://ror.org/05szzwt63","country_code":"TW","type":"nonprofit","lineage":["https://openalex.org/I4210148468"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"W. C. Lo","raw_affiliation_strings":["Electronics and Optoelectronics Research Laboratories, Industrial Technology Research Institute (ITRI), Hsinchu, Taiwan"],"affiliations":[{"raw_affiliation_string":"Electronics and Optoelectronics Research Laboratories, Industrial Technology Research Institute (ITRI), Hsinchu, Taiwan","institution_ids":["https://openalex.org/I4210148468"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5030670785","display_name":"Kuan\u2010Neng Chen","orcid":"https://orcid.org/0000-0003-4316-0007"},"institutions":[{"id":"https://openalex.org/I148366613","display_name":"National Yang Ming Chiao Tung University","ror":"https://ror.org/00se2k293","country_code":"TW","type":"education","lineage":["https://openalex.org/I148366613"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"K. N. Chen","raw_affiliation_strings":["Department of Electronics Engineering, National Chiao Tung University, Hsinchu, Taiwan"],"affiliations":[{"raw_affiliation_string":"Department of Electronics Engineering, National Chiao Tung University, Hsinchu, Taiwan","institution_ids":["https://openalex.org/I148366613"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":12,"corresponding_author_ids":["https://openalex.org/A5111856105"],"corresponding_institution_ids":["https://openalex.org/I148366613","https://openalex.org/I4210148468"],"apc_list":null,"apc_paid":null,"fwci":0.982,"has_fulltext":false,"cited_by_count":12,"citation_normalized_percentile":{"value":0.77945473,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":97},"biblio":{"volume":"139","issue":null,"first_page":"1","last_page":"4"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.9987999796867371,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10783","display_name":"Additive Manufacturing and 3D Printing Technologies","score":0.9977999925613403,"subfield":{"id":"https://openalex.org/subfields/2203","display_name":"Automotive Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/bumping","display_name":"Bumping","score":0.6875316500663757},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.6846417784690857},{"id":"https://openalex.org/keywords/three-dimensional-integrated-circuit","display_name":"Three-dimensional integrated circuit","score":0.6820364594459534},{"id":"https://openalex.org/keywords/interconnection","display_name":"Interconnection","score":0.649944543838501},{"id":"https://openalex.org/keywords/wafer","display_name":"Wafer","score":0.6183342337608337},{"id":"https://openalex.org/keywords/reliability","display_name":"Reliability (semiconductor)","score":0.5580447912216187},{"id":"https://openalex.org/keywords/through-silicon-via","display_name":"Through-silicon via","score":0.508878231048584},{"id":"https://openalex.org/keywords/stack","display_name":"Stack (abstract data type)","score":0.45310917496681213},{"id":"https://openalex.org/keywords/fabrication","display_name":"Fabrication","score":0.44186845421791077},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.4147277772426605},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.403110146522522},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.3754434585571289},{"id":"https://openalex.org/keywords/integrated-circuit","display_name":"Integrated circuit","score":0.3681876063346863},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.16634729504585266},{"id":"https://openalex.org/keywords/mechanical-engineering","display_name":"Mechanical engineering","score":0.1502499282360077}],"concepts":[{"id":"https://openalex.org/C2776512755","wikidata":"https://www.wikidata.org/wiki/Q632543","display_name":"Bumping","level":2,"score":0.6875316500663757},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.6846417784690857},{"id":"https://openalex.org/C59088047","wikidata":"https://www.wikidata.org/wiki/Q229370","display_name":"Three-dimensional integrated circuit","level":3,"score":0.6820364594459534},{"id":"https://openalex.org/C123745756","wikidata":"https://www.wikidata.org/wiki/Q1665949","display_name":"Interconnection","level":2,"score":0.649944543838501},{"id":"https://openalex.org/C160671074","wikidata":"https://www.wikidata.org/wiki/Q267131","display_name":"Wafer","level":2,"score":0.6183342337608337},{"id":"https://openalex.org/C43214815","wikidata":"https://www.wikidata.org/wiki/Q7310987","display_name":"Reliability (semiconductor)","level":3,"score":0.5580447912216187},{"id":"https://openalex.org/C45632049","wikidata":"https://www.wikidata.org/wiki/Q1578120","display_name":"Through-silicon via","level":3,"score":0.508878231048584},{"id":"https://openalex.org/C9395851","wikidata":"https://www.wikidata.org/wiki/Q177929","display_name":"Stack (abstract data type)","level":2,"score":0.45310917496681213},{"id":"https://openalex.org/C136525101","wikidata":"https://www.wikidata.org/wiki/Q5428139","display_name":"Fabrication","level":3,"score":0.44186845421791077},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.4147277772426605},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.403110146522522},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.3754434585571289},{"id":"https://openalex.org/C530198007","wikidata":"https://www.wikidata.org/wiki/Q80831","display_name":"Integrated circuit","level":2,"score":0.3681876063346863},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.16634729504585266},{"id":"https://openalex.org/C78519656","wikidata":"https://www.wikidata.org/wiki/Q101333","display_name":"Mechanical engineering","level":1,"score":0.1502499282360077},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.0},{"id":"https://openalex.org/C142724271","wikidata":"https://www.wikidata.org/wiki/Q7208","display_name":"Pathology","level":1,"score":0.0},{"id":"https://openalex.org/C163258240","wikidata":"https://www.wikidata.org/wiki/Q25342","display_name":"Power (physics)","level":2,"score":0.0},{"id":"https://openalex.org/C71924100","wikidata":"https://www.wikidata.org/wiki/Q11190","display_name":"Medicine","level":0,"score":0.0},{"id":"https://openalex.org/C62520636","wikidata":"https://www.wikidata.org/wiki/Q944","display_name":"Quantum mechanics","level":1,"score":0.0},{"id":"https://openalex.org/C31258907","wikidata":"https://www.wikidata.org/wiki/Q1301371","display_name":"Computer network","level":1,"score":0.0},{"id":"https://openalex.org/C199360897","wikidata":"https://www.wikidata.org/wiki/Q9143","display_name":"Programming language","level":1,"score":0.0},{"id":"https://openalex.org/C204787440","wikidata":"https://www.wikidata.org/wiki/Q188504","display_name":"Alternative medicine","level":2,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/3dic.2012.6262949","is_oa":false,"landing_page_url":"https://doi.org/10.1109/3dic.2012.6262949","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2011 IEEE International 3D Systems Integration Conference (3DIC), 2011 IEEE International","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"score":0.41999998688697815,"display_name":"Industry, innovation and infrastructure","id":"https://metadata.un.org/sdg/9"}],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":9,"referenced_works":["https://openalex.org/W2048444967","https://openalex.org/W2072357731","https://openalex.org/W2106514741","https://openalex.org/W2107304970","https://openalex.org/W2109500250","https://openalex.org/W2123529675","https://openalex.org/W2151167650","https://openalex.org/W2154060804","https://openalex.org/W2163387898"],"related_works":["https://openalex.org/W1990828594","https://openalex.org/W2016970881","https://openalex.org/W2027159884","https://openalex.org/W1549825742","https://openalex.org/W2333804548","https://openalex.org/W2534942874","https://openalex.org/W3093450488","https://openalex.org/W2016589506","https://openalex.org/W2376702355","https://openalex.org/W4385062230"],"abstract_inverted_index":{"Cu":[0,62],"TSV":[1,40,78],"combination":[2],"with":[3,61,129],"Cu/Sn":[4,66],"micro-joint":[5,42],"to":[6,28,94,127,138],"form":[7],"vertical":[8],"interconnection":[9],"is":[10,136],"a":[11,56,103],"good":[12],"alternative":[13],"for":[14,51,141],"3D":[15,58,97,118,122,142],"integration.":[16],"The":[17,121],"insertion":[18],"loss":[19],"of":[20,106,115],"two":[21],"chip":[22],"stack":[23],"was":[24,73,125],"evaluated":[25],"by":[26],"simulation":[27],"realize":[29],"the":[30,46,96,116],"signal":[31],"transmission":[32],"effects":[33],"in":[34,54],"high":[35],"speed":[36],"digital":[37],"signaling":[38],"via":[39],"and":[41,48,68,85,92,112,133,135],"interconnect.":[43],"To":[44],"satisfy":[45],"throughput":[47],"cost":[49],"requirement":[50],"mass":[52],"production":[53],"future,":[55],"wafer-level":[57,117],"integration":[59,98,119,123],"scheme":[60,124],"TSVs":[63],"based":[64],"on":[65],"micro-bump":[67],"BCB":[69],"adhesive":[70],"hybrid":[71,81],"bonding":[72],"demonstrated.":[74],"Key":[75],"techniques":[76],"including":[77],"fabrication,":[79],"micro-bumping,":[80],"bonding,":[82],"wafer":[83],"thinning":[84],"backside":[86],"RDL":[87],"formation":[88],"were":[89],"well":[90],"developed":[91],"integrated":[93],"perform":[95],"scheme.":[99,120],"This":[100],"paper":[101],"presents":[102],"complete":[104],"study":[105],"structure":[107],"design,":[108],"process":[109],"condition,":[110],"electrical":[111,131],"reliability":[113],"assessment":[114],"assessed":[126],"be":[128,139],"excellent":[130],"performance":[132],"reliability,":[134],"potentially":[137],"applied":[140],"IC":[143],"applications.":[144]},"counts_by_year":[{"year":2023,"cited_by_count":1},{"year":2020,"cited_by_count":2},{"year":2019,"cited_by_count":1},{"year":2018,"cited_by_count":2},{"year":2016,"cited_by_count":2},{"year":2014,"cited_by_count":1},{"year":2012,"cited_by_count":3}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}