{"id":"https://openalex.org/W2094170939","doi":"https://doi.org/10.1109/3dic.2010.5751447","title":"Post-bond sub-500 nm alignment in 300 mm integrated face-to-face wafer-to-wafer Cu-Cu thermocompression, Si-Si fusion and oxideoxide fusion bonding","display_name":"Post-bond sub-500 nm alignment in 300 mm integrated face-to-face wafer-to-wafer Cu-Cu thermocompression, Si-Si fusion and oxideoxide fusion bonding","publication_year":2010,"publication_date":"2010-11-01","ids":{"openalex":"https://openalex.org/W2094170939","doi":"https://doi.org/10.1109/3dic.2010.5751447","mag":"2094170939"},"language":"en","primary_location":{"id":"doi:10.1109/3dic.2010.5751447","is_oa":false,"landing_page_url":"https://doi.org/10.1109/3dic.2010.5751447","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2010 IEEE International 3D Systems Integration Conference (3DIC)","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5029203965","display_name":"W. H. Teh","orcid":"https://orcid.org/0000-0003-2935-1886"},"institutions":[{"id":"https://openalex.org/I1343180700","display_name":"Intel (United States)","ror":"https://ror.org/01ek73717","country_code":"US","type":"company","lineage":["https://openalex.org/I1343180700"]}],"countries":["US"],"is_corresponding":true,"raw_author_name":"W. H. Teh","raw_affiliation_strings":["3D Interconnect, SEMATECH (Intel Assignee), Albany, NY, USA","SEMATECH (Intel Assignee), 3D Interconnect, 257 Fuller Road, Albany, NY 12203"],"affiliations":[{"raw_affiliation_string":"3D Interconnect, SEMATECH (Intel Assignee), Albany, NY, USA","institution_ids":["https://openalex.org/I1343180700"]},{"raw_affiliation_string":"SEMATECH (Intel Assignee), 3D Interconnect, 257 Fuller Road, Albany, NY 12203","institution_ids":["https://openalex.org/I1343180700"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5084418785","display_name":"Claire Deeb","orcid":"https://orcid.org/0000-0002-1323-0660"},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"C. Deeb","raw_affiliation_strings":["Metrology, ISMI, Albany, NY, USA","ISMI, Metrology, 257 Fuller Road, Albany, NY 12203"],"affiliations":[{"raw_affiliation_string":"Metrology, ISMI, Albany, NY, USA","institution_ids":[]},{"raw_affiliation_string":"ISMI, Metrology, 257 Fuller Road, Albany, NY 12203","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5110045167","display_name":"Julius Burggraf","orcid":null},"institutions":[{"id":"https://openalex.org/I4210121671","display_name":"EV Group (Austria)","ror":"https://ror.org/02e8b3g15","country_code":"AT","type":"company","lineage":["https://openalex.org/I4210121671"]}],"countries":["AT"],"is_corresponding":false,"raw_author_name":"J. Burggraf","raw_affiliation_strings":["EV Group, Inc., Florian, Austria","EV Group, DI Erich Thallner Strasse 1, 4782 St. Florian/Inn, Austria"],"affiliations":[{"raw_affiliation_string":"EV Group, Inc., Florian, Austria","institution_ids":["https://openalex.org/I4210121671"]},{"raw_affiliation_string":"EV Group, DI Erich Thallner Strasse 1, 4782 St. Florian/Inn, Austria","institution_ids":["https://openalex.org/I4210121671"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5040859376","display_name":"D. Arazi","orcid":null},"institutions":[{"id":"https://openalex.org/I4210121671","display_name":"EV Group (Austria)","ror":"https://ror.org/02e8b3g15","country_code":"AT","type":"company","lineage":["https://openalex.org/I4210121671"]}],"countries":["AT"],"is_corresponding":false,"raw_author_name":"D. Arazi","raw_affiliation_strings":["EV Group, Inc., Florian, Austria","EV Group, DI Erich Thallner Strasse 1, 4782 St. Florian/Inn, Austria"],"affiliations":[{"raw_affiliation_string":"EV Group, Inc., Florian, Austria","institution_ids":["https://openalex.org/I4210121671"]},{"raw_affiliation_string":"EV Group, DI Erich Thallner Strasse 1, 4782 St. Florian/Inn, Austria","institution_ids":["https://openalex.org/I4210121671"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5011571754","display_name":"Richard Young","orcid":"https://orcid.org/0000-0002-1409-4584"},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"R. Young","raw_affiliation_strings":["FEI Company, Hillsboro, OR, USA","FEI Company, 5350 NE Dawson Creek Dr., Hillsboro, OR 97124"],"affiliations":[{"raw_affiliation_string":"FEI Company, Hillsboro, OR, USA","institution_ids":[]},{"raw_affiliation_string":"FEI Company, 5350 NE Dawson Creek Dr., Hillsboro, OR 97124","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5045333852","display_name":"Corey Senowitz","orcid":null},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"C. Senowitz","raw_affiliation_strings":["FEI Company, Hillsboro, OR, USA","FEI Company, 5350 NE Dawson Creek Dr., Hillsboro, OR 97124"],"affiliations":[{"raw_affiliation_string":"FEI Company, Hillsboro, OR, USA","institution_ids":[]},{"raw_affiliation_string":"FEI Company, 5350 NE Dawson Creek Dr., Hillsboro, OR 97124","institution_ids":[]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5080146758","display_name":"A. Buxbaum","orcid":null},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"A. Buxbaum","raw_affiliation_strings":["FEI Company, Hillsboro, OR, USA","FEI Company, 5350 NE Dawson Creek Dr., Hillsboro, OR 97124"],"affiliations":[{"raw_affiliation_string":"FEI Company, Hillsboro, OR, USA","institution_ids":[]},{"raw_affiliation_string":"FEI Company, 5350 NE Dawson Creek Dr., Hillsboro, OR 97124","institution_ids":[]}]}],"institutions":[],"countries_distinct_count":2,"institutions_distinct_count":7,"corresponding_author_ids":["https://openalex.org/A5029203965"],"corresponding_institution_ids":["https://openalex.org/I1343180700"],"apc_list":null,"apc_paid":null,"fwci":0.5773,"has_fulltext":false,"cited_by_count":10,"citation_normalized_percentile":{"value":0.72660485,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":97},"biblio":{"volume":null,"issue":null,"first_page":"1","last_page":"6"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T14117","display_name":"Integrated Circuits and Semiconductor Failure Analysis","score":0.9997000098228455,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.9994000196456909,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.7073802351951599},{"id":"https://openalex.org/keywords/wafer","display_name":"Wafer","score":0.6556695699691772},{"id":"https://openalex.org/keywords/wafer-bonding","display_name":"Wafer bonding","score":0.6136854290962219},{"id":"https://openalex.org/keywords/thermocompression-bonding","display_name":"Thermocompression bonding","score":0.6094689965248108},{"id":"https://openalex.org/keywords/blanket","display_name":"Blanket","score":0.5744530558586121},{"id":"https://openalex.org/keywords/scanning-electron-microscope","display_name":"Scanning electron microscope","score":0.5290402770042419},{"id":"https://openalex.org/keywords/fusion","display_name":"Fusion","score":0.5059859156608582},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.41407376527786255},{"id":"https://openalex.org/keywords/nanotechnology","display_name":"Nanotechnology","score":0.3181590437889099},{"id":"https://openalex.org/keywords/composite-material","display_name":"Composite material","score":0.21930795907974243},{"id":"https://openalex.org/keywords/layer","display_name":"Layer (electronics)","score":0.10920798778533936}],"concepts":[{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.7073802351951599},{"id":"https://openalex.org/C160671074","wikidata":"https://www.wikidata.org/wiki/Q267131","display_name":"Wafer","level":2,"score":0.6556695699691772},{"id":"https://openalex.org/C2779133538","wikidata":"https://www.wikidata.org/wiki/Q677010","display_name":"Wafer bonding","level":3,"score":0.6136854290962219},{"id":"https://openalex.org/C201845621","wikidata":"https://www.wikidata.org/wiki/Q1111341","display_name":"Thermocompression bonding","level":3,"score":0.6094689965248108},{"id":"https://openalex.org/C2779261148","wikidata":"https://www.wikidata.org/wiki/Q5852","display_name":"Blanket","level":2,"score":0.5744530558586121},{"id":"https://openalex.org/C26771246","wikidata":"https://www.wikidata.org/wiki/Q321095","display_name":"Scanning electron microscope","level":2,"score":0.5290402770042419},{"id":"https://openalex.org/C158525013","wikidata":"https://www.wikidata.org/wiki/Q2593739","display_name":"Fusion","level":2,"score":0.5059859156608582},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.41407376527786255},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.3181590437889099},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.21930795907974243},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.10920798778533936},{"id":"https://openalex.org/C41895202","wikidata":"https://www.wikidata.org/wiki/Q8162","display_name":"Linguistics","level":1,"score":0.0},{"id":"https://openalex.org/C138885662","wikidata":"https://www.wikidata.org/wiki/Q5891","display_name":"Philosophy","level":0,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/3dic.2010.5751447","is_oa":false,"landing_page_url":"https://doi.org/10.1109/3dic.2010.5751447","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2010 IEEE International 3D Systems Integration Conference (3DIC)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":8,"referenced_works":["https://openalex.org/W1966162671","https://openalex.org/W2068614318","https://openalex.org/W2085087240","https://openalex.org/W2124067095","https://openalex.org/W2141361504","https://openalex.org/W2162856332","https://openalex.org/W3114600009","https://openalex.org/W6787762994"],"related_works":["https://openalex.org/W2053597733","https://openalex.org/W2228105431","https://openalex.org/W2073096817","https://openalex.org/W2488020685","https://openalex.org/W3043339446","https://openalex.org/W2540312267","https://openalex.org/W2068447932","https://openalex.org/W2936104641","https://openalex.org/W2001320522","https://openalex.org/W790172873"],"abstract_inverted_index":{"We":[0,25],"report":[1],"recent":[2],"advances":[3],"in":[4,86,129],"tool":[5],"and":[6,21,47,77,168],"process":[7,54],"hardening":[8],"of":[9,12,55,158],"a":[10,123],"first":[11],"its":[13],"kind":[14],"300":[15,34],"mm":[16,35],"wafer-to-wafer":[17],"(WtW)":[18],"preprocessing,":[19],"aligning,":[20],"bonding":[22,91,138],"integrated":[23],"tool.":[24],"have":[26,93,134],"demonstrated":[27],"sub-500":[28],"nm":[29],"post-bond":[30],"alignment":[31,95],"accuracies":[32,96],"for":[33],"WtW":[36,42,48,89],"face-to-face":[37],"(FtF)":[38],"Cu-Cu":[39,88],"thermocompression":[40,90],"bonds,":[41,46],"FtF":[43,49],"Si-Si":[44],"fusion":[45,51],"oxideoxide":[50],"bonds.":[52],"All":[53],"record":[56],"(POR)":[57],"recipes":[58],"that":[59,136],"were":[60],"developed":[61],"had":[62],"undetectable":[63],"voids":[64],"based":[65],"on":[66,72],"scanning":[67],"acoustic":[68],"microscope":[69],"(C-SAM)":[70],"measurements":[71],"representative":[73],"bonded":[74,82],"Cu,":[75],"oxide,":[76],"Si":[78],"blanket":[79],"wafers.":[80],"Optimized":[81],"patterned":[83],"wafer":[84],"splits":[85],"the":[87,101,137,141],"step":[92],"shown":[94],"down":[97],"to":[98,104,127],"\u223c190":[99],"nm,":[100],"highest":[102],"accuracy":[103],"date.":[105],"Using":[106],"an":[107],"infrared-enabled,":[108],"high":[109],"speed":[110],"focused":[111],"ion":[112],"beam":[113],"(FIB)":[114],"system":[115],"(with":[116],"XeF":[117],"<inf":[118],"xmlns:mml=\"http://www.w3.org/1998/Math/MathML\"":[119],"xmlns:xlink=\"http://www.w3.org/1999/xlink\">2</inf>":[120],")":[121],"with":[122,145],"CAD":[124],"overlay":[125],"function":[126],"assist":[128],"selective":[130],"sample":[131],"preparation,":[132],"we":[133],"verified":[135],"interfaces":[139],"at":[140],"via":[142],"chain":[143],"structures":[144],"1\u20135":[146],"\u03bcm":[147],"diameter":[148],"vias":[149],"show":[150],"no":[151],"interfacial":[152],"voids.":[153],"Also,":[154],"there":[155],"is":[156],"evidence":[157],"Cu":[159],"interdiffusion,":[160],"as":[161],"supported":[162],"by":[163],"transmission":[164],"electron":[165,169],"microscopy":[166],"(TEM)":[167],"backscattering":[170],"diffraction":[171],"(EBSD)":[172],"data.":[173]},"counts_by_year":[{"year":2019,"cited_by_count":2},{"year":2017,"cited_by_count":1},{"year":2015,"cited_by_count":2},{"year":2014,"cited_by_count":3},{"year":2012,"cited_by_count":1}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}