{"id":"https://openalex.org/W2055948640","doi":"https://doi.org/10.1109/3dic.2010.5751436","title":"Evaluation of alignment accuracy on chip-to-wafer self-assembly and mechanism on the direct chip bonding at room temperature","display_name":"Evaluation of alignment accuracy on chip-to-wafer self-assembly and mechanism on the direct chip bonding at room temperature","publication_year":2010,"publication_date":"2010-11-01","ids":{"openalex":"https://openalex.org/W2055948640","doi":"https://doi.org/10.1109/3dic.2010.5751436","mag":"2055948640"},"language":"en","primary_location":{"id":"doi:10.1109/3dic.2010.5751436","is_oa":false,"landing_page_url":"https://doi.org/10.1109/3dic.2010.5751436","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2010 IEEE International 3D Systems Integration Conference (3DIC)","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5041535044","display_name":"Takafumi Fukushima","orcid":"https://orcid.org/0000-0003-2303-8178"},"institutions":[{"id":"https://openalex.org/I201537933","display_name":"Tohoku University","ror":"https://ror.org/01dq60k83","country_code":"JP","type":"education","lineage":["https://openalex.org/I201537933"]}],"countries":["JP"],"is_corresponding":true,"raw_author_name":"T Fukushima","raw_affiliation_strings":["New Industry Creation Hatchery Center (NICHe), University of Tohoku, Japan","New Industry Creation Hatchery Center (NICHe), Tohoku University"],"affiliations":[{"raw_affiliation_string":"New Industry Creation Hatchery Center (NICHe), University of Tohoku, Japan","institution_ids":["https://openalex.org/I201537933"]},{"raw_affiliation_string":"New Industry Creation Hatchery Center (NICHe), Tohoku University","institution_ids":["https://openalex.org/I201537933"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5004346138","display_name":"Eiji Iwata","orcid":"https://orcid.org/0000-0002-4010-8062"},"institutions":[{"id":"https://openalex.org/I201537933","display_name":"Tohoku University","ror":"https://ror.org/01dq60k83","country_code":"JP","type":"education","lineage":["https://openalex.org/I201537933"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"E Iwata","raw_affiliation_strings":["Graduate School of Engineering, University of Tohoku, Japan","Graduate School of Engineering / Tohoku University"],"affiliations":[{"raw_affiliation_string":"Graduate School of Engineering, University of Tohoku, Japan","institution_ids":["https://openalex.org/I201537933"]},{"raw_affiliation_string":"Graduate School of Engineering / Tohoku University","institution_ids":["https://openalex.org/I201537933"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5113659962","display_name":"J. C. Bea","orcid":null},"institutions":[{"id":"https://openalex.org/I201537933","display_name":"Tohoku University","ror":"https://ror.org/01dq60k83","country_code":"JP","type":"education","lineage":["https://openalex.org/I201537933"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"J Bea","raw_affiliation_strings":["New Industry Creation Hatchery Center (NICHe), University of Tohoku, Japan","New Industry Creation Hatchery Center (NICHe), Tohoku University"],"affiliations":[{"raw_affiliation_string":"New Industry Creation Hatchery Center (NICHe), University of Tohoku, Japan","institution_ids":["https://openalex.org/I201537933"]},{"raw_affiliation_string":"New Industry Creation Hatchery Center (NICHe), Tohoku University","institution_ids":["https://openalex.org/I201537933"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5101440058","display_name":"M. Murugesan","orcid":"https://orcid.org/0000-0002-3510-7110"},"institutions":[{"id":"https://openalex.org/I201537933","display_name":"Tohoku University","ror":"https://ror.org/01dq60k83","country_code":"JP","type":"education","lineage":["https://openalex.org/I201537933"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"M Murugesan","raw_affiliation_strings":["New Industry Creation Hatchery Center (NICHe), University of Tohoku, Japan","New Industry Creation Hatchery Center (NICHe), Tohoku University"],"affiliations":[{"raw_affiliation_string":"New Industry Creation Hatchery Center (NICHe), University of Tohoku, Japan","institution_ids":["https://openalex.org/I201537933"]},{"raw_affiliation_string":"New Industry Creation Hatchery Center (NICHe), Tohoku University","institution_ids":["https://openalex.org/I201537933"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5111090326","display_name":"K Lee","orcid":null},"institutions":[{"id":"https://openalex.org/I201537933","display_name":"Tohoku University","ror":"https://ror.org/01dq60k83","country_code":"JP","type":"education","lineage":["https://openalex.org/I201537933"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"K Lee","raw_affiliation_strings":["New Industry Creation Hatchery Center (NICHe), University of Tohoku, Japan","New Industry Creation Hatchery Center (NICHe), Tohoku University"],"affiliations":[{"raw_affiliation_string":"New Industry Creation Hatchery Center (NICHe), University of Tohoku, Japan","institution_ids":["https://openalex.org/I201537933"]},{"raw_affiliation_string":"New Industry Creation Hatchery Center (NICHe), Tohoku University","institution_ids":["https://openalex.org/I201537933"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5006295728","display_name":"Tetsu Tanaka","orcid":"https://orcid.org/0000-0001-7414-315X"},"institutions":[{"id":"https://openalex.org/I201537933","display_name":"Tohoku University","ror":"https://ror.org/01dq60k83","country_code":"JP","type":"education","lineage":["https://openalex.org/I201537933"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"T Tanaka","raw_affiliation_strings":["Graduate School of Biomedical Engineering, University of Tohoku, Japan","Graduate School of Engineering / Tohoku University"],"affiliations":[{"raw_affiliation_string":"Graduate School of Biomedical Engineering, University of Tohoku, Japan","institution_ids":["https://openalex.org/I201537933"]},{"raw_affiliation_string":"Graduate School of Engineering / Tohoku University","institution_ids":["https://openalex.org/I201537933"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5059487693","display_name":"Mitsumasa Koyanagi","orcid":"https://orcid.org/0000-0003-4726-4217"},"institutions":[{"id":"https://openalex.org/I201537933","display_name":"Tohoku University","ror":"https://ror.org/01dq60k83","country_code":"JP","type":"education","lineage":["https://openalex.org/I201537933"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"M Koyanagi","raw_affiliation_strings":["New Industry Creation Hatchery Center (NICHe), University of Tohoku, Japan","New Industry Creation Hatchery Center (NICHe), Tohoku University"],"affiliations":[{"raw_affiliation_string":"New Industry Creation Hatchery Center (NICHe), University of Tohoku, Japan","institution_ids":["https://openalex.org/I201537933"]},{"raw_affiliation_string":"New Industry Creation Hatchery Center (NICHe), Tohoku University","institution_ids":["https://openalex.org/I201537933"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":7,"corresponding_author_ids":["https://openalex.org/A5041535044"],"corresponding_institution_ids":["https://openalex.org/I201537933"],"apc_list":null,"apc_paid":null,"fwci":1.7318,"has_fulltext":false,"cited_by_count":17,"citation_normalized_percentile":{"value":0.85655531,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":97},"biblio":{"volume":null,"issue":null,"first_page":"1","last_page":"5"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10783","display_name":"Additive Manufacturing and 3D Printing Technologies","score":0.9909999966621399,"subfield":{"id":"https://openalex.org/subfields/2203","display_name":"Automotive Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.9908000230789185,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/wafer","display_name":"Wafer","score":0.8884369134902954},{"id":"https://openalex.org/keywords/chip","display_name":"Chip","score":0.7710575461387634},{"id":"https://openalex.org/keywords/wafer-bonding","display_name":"Wafer bonding","score":0.6112154126167297},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.6093595623970032},{"id":"https://openalex.org/keywords/three-dimensional-integrated-circuit","display_name":"Three-dimensional integrated circuit","score":0.5784628391265869},{"id":"https://openalex.org/keywords/direct-bonding","display_name":"Direct bonding","score":0.5562569499015808},{"id":"https://openalex.org/keywords/throughput","display_name":"Throughput","score":0.5158440470695496},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.4558185636997223},{"id":"https://openalex.org/keywords/surface-tension","display_name":"Surface tension","score":0.4389176666736603},{"id":"https://openalex.org/keywords/wafer-scale-integration","display_name":"Wafer-scale integration","score":0.4157508313655853},{"id":"https://openalex.org/keywords/nanotechnology","display_name":"Nanotechnology","score":0.37172579765319824},{"id":"https://openalex.org/keywords/integrated-circuit","display_name":"Integrated circuit","score":0.3090895116329193},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.278445303440094},{"id":"https://openalex.org/keywords/physics","display_name":"Physics","score":0.06631141901016235}],"concepts":[{"id":"https://openalex.org/C160671074","wikidata":"https://www.wikidata.org/wiki/Q267131","display_name":"Wafer","level":2,"score":0.8884369134902954},{"id":"https://openalex.org/C165005293","wikidata":"https://www.wikidata.org/wiki/Q1074500","display_name":"Chip","level":2,"score":0.7710575461387634},{"id":"https://openalex.org/C2779133538","wikidata":"https://www.wikidata.org/wiki/Q677010","display_name":"Wafer bonding","level":3,"score":0.6112154126167297},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.6093595623970032},{"id":"https://openalex.org/C59088047","wikidata":"https://www.wikidata.org/wiki/Q229370","display_name":"Three-dimensional integrated circuit","level":3,"score":0.5784628391265869},{"id":"https://openalex.org/C2778071519","wikidata":"https://www.wikidata.org/wiki/Q5280309","display_name":"Direct bonding","level":3,"score":0.5562569499015808},{"id":"https://openalex.org/C157764524","wikidata":"https://www.wikidata.org/wiki/Q1383412","display_name":"Throughput","level":3,"score":0.5158440470695496},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.4558185636997223},{"id":"https://openalex.org/C8892853","wikidata":"https://www.wikidata.org/wiki/Q170749","display_name":"Surface tension","level":2,"score":0.4389176666736603},{"id":"https://openalex.org/C2778638305","wikidata":"https://www.wikidata.org/wiki/Q7406100","display_name":"Wafer-scale integration","level":3,"score":0.4157508313655853},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.37172579765319824},{"id":"https://openalex.org/C530198007","wikidata":"https://www.wikidata.org/wiki/Q80831","display_name":"Integrated circuit","level":2,"score":0.3090895116329193},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.278445303440094},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.06631141901016235},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.0},{"id":"https://openalex.org/C62520636","wikidata":"https://www.wikidata.org/wiki/Q944","display_name":"Quantum mechanics","level":1,"score":0.0},{"id":"https://openalex.org/C555944384","wikidata":"https://www.wikidata.org/wiki/Q249","display_name":"Wireless","level":2,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/3dic.2010.5751436","is_oa":false,"landing_page_url":"https://doi.org/10.1109/3dic.2010.5751436","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2010 IEEE International 3D Systems Integration Conference (3DIC)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"id":"https://metadata.un.org/sdg/7","score":0.47999998927116394,"display_name":"Affordable and clean energy"}],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":11,"referenced_works":["https://openalex.org/W1971966678","https://openalex.org/W2009195513","https://openalex.org/W2031579205","https://openalex.org/W2033720272","https://openalex.org/W2045821110","https://openalex.org/W2125551870","https://openalex.org/W2136056669","https://openalex.org/W2142901152","https://openalex.org/W2151613126","https://openalex.org/W2170217728","https://openalex.org/W2541409995"],"related_works":["https://openalex.org/W2016970881","https://openalex.org/W2582960117","https://openalex.org/W2539461396","https://openalex.org/W1534423317","https://openalex.org/W2333804548","https://openalex.org/W2006563554","https://openalex.org/W1990828594","https://openalex.org/W2090223096","https://openalex.org/W2053597733","https://openalex.org/W3093641485"],"abstract_inverted_index":{"Chip-to-wafer":[0],"bonding":[1,103],"is":[2,31,65],"a":[3,39],"promising":[4],"technology":[5],"for":[6],"3D":[7,22,42],"integration":[8,23,43],"due":[9],"to":[10,104],"high":[11],"production":[12,25],"yield":[13],"using":[14,44],"known":[15],"good":[16],"dies":[17],"(KGDs).":[18],"However,":[19],"conventional":[20],"chip-to-wafer":[21,41],"lowers":[24],"throughput":[26],"because":[27],"pick-and-place":[28],"chip":[29,102],"assembly":[30],"employed.":[32],"To":[33],"overcome":[34],"the":[35,83],"problem,":[36],"we":[37,70,81,96],"proposed":[38],"new":[40],"self-assembly":[45,92],"by":[46],"which":[47],"many":[48],"KGDs":[49],"can":[50],"be":[51],"simultaneously,":[52],"rapidly,":[53],"and":[54,57],"precisely":[55],"aligned":[56],"tightly":[58],"bonded":[59],"on":[60,88,99],"wafers.":[61],"The":[62],"driving":[63],"force":[64],"liquid":[66],"surface":[67],"tension.":[68],"Here,":[69],"used":[71],"an":[72],"aqueous":[73],"solution":[74],"including":[75],"dilute":[76],"HF.":[77],"In":[78,94],"this":[79],"paper,":[80],"discuss":[82],"dependence":[84],"of":[85],"alignment":[86],"accuracy":[87],"several":[89],"parameters":[90],"in":[91],"conditions.":[93],"addition,":[95],"describe":[97],"mechanism":[98],"HF-assisted":[100],"direct":[101],"wafers":[105],"without":[106],"thermal":[107],"compression.":[108]},"counts_by_year":[{"year":2025,"cited_by_count":1},{"year":2024,"cited_by_count":2},{"year":2022,"cited_by_count":2},{"year":2021,"cited_by_count":1},{"year":2019,"cited_by_count":1},{"year":2016,"cited_by_count":1},{"year":2015,"cited_by_count":1},{"year":2014,"cited_by_count":2},{"year":2013,"cited_by_count":2},{"year":2012,"cited_by_count":3}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}