{"id":"https://openalex.org/W1990933340","doi":"https://doi.org/10.1109/3dic.2009.5306592","title":"Modelling of Through Silicon Via RF performance and impact on signal transmission in 3D integrated circuits","display_name":"Modelling of Through Silicon Via RF performance and impact on signal transmission in 3D integrated circuits","publication_year":2009,"publication_date":"2009-09-01","ids":{"openalex":"https://openalex.org/W1990933340","doi":"https://doi.org/10.1109/3dic.2009.5306592","mag":"1990933340"},"language":"en","primary_location":{"id":"doi:10.1109/3dic.2009.5306592","is_oa":false,"landing_page_url":"https://doi.org/10.1109/3dic.2009.5306592","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2009 IEEE International Conference on 3D System Integration","raw_type":"proceedings-article"},"type":"preprint","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5013682091","display_name":"L. Cadix","orcid":null},"institutions":[{"id":"https://openalex.org/I4210104693","display_name":"STMicroelectronics (France)","ror":"https://ror.org/01c74sd89","country_code":"FR","type":"company","lineage":["https://openalex.org/I131827901","https://openalex.org/I4210104693"]},{"id":"https://openalex.org/I4210139715","display_name":"Institut de Micro\u00e9lectronique, Electromagn\u00e9tisme et Photonique","ror":"https://ror.org/03taa9n66","country_code":"FR","type":"facility","lineage":["https://openalex.org/I106785703","https://openalex.org/I1294671590","https://openalex.org/I4210095849","https://openalex.org/I4210139715","https://openalex.org/I70900168","https://openalex.org/I899635006"]},{"id":"https://openalex.org/I70900168","display_name":"Universit\u00e9 Savoie Mont Blanc","ror":"https://ror.org/04gqg1a07","country_code":"FR","type":"education","lineage":["https://openalex.org/I70900168"]}],"countries":["FR"],"is_corresponding":true,"raw_author_name":"Lionel Cadix","raw_affiliation_strings":["IMEP-LAHC, Universit\u00e9 de Savoie, Le Bourget du Lac Cedex, France","STMicroelectronics, Crolles Cedex, France"],"affiliations":[{"raw_affiliation_string":"IMEP-LAHC, Universit\u00e9 de Savoie, Le Bourget du Lac Cedex, France","institution_ids":["https://openalex.org/I70900168","https://openalex.org/I4210139715"]},{"raw_affiliation_string":"STMicroelectronics, Crolles Cedex, France","institution_ids":["https://openalex.org/I4210104693"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5109958272","display_name":"A. Farcy","orcid":null},"institutions":[{"id":"https://openalex.org/I4210104693","display_name":"STMicroelectronics (France)","ror":"https://ror.org/01c74sd89","country_code":"FR","type":"company","lineage":["https://openalex.org/I131827901","https://openalex.org/I4210104693"]}],"countries":["FR"],"is_corresponding":false,"raw_author_name":"Alexis Farcy","raw_affiliation_strings":["STMicroelectronics, Crolles Cedex, France"],"affiliations":[{"raw_affiliation_string":"STMicroelectronics, Crolles Cedex, France","institution_ids":["https://openalex.org/I4210104693"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5008916352","display_name":"C. Bermond","orcid":"https://orcid.org/0000-0003-1472-9081"},"institutions":[{"id":"https://openalex.org/I4210139715","display_name":"Institut de Micro\u00e9lectronique, Electromagn\u00e9tisme et Photonique","ror":"https://ror.org/03taa9n66","country_code":"FR","type":"facility","lineage":["https://openalex.org/I106785703","https://openalex.org/I1294671590","https://openalex.org/I4210095849","https://openalex.org/I4210139715","https://openalex.org/I70900168","https://openalex.org/I899635006"]},{"id":"https://openalex.org/I70900168","display_name":"Universit\u00e9 Savoie Mont Blanc","ror":"https://ror.org/04gqg1a07","country_code":"FR","type":"education","lineage":["https://openalex.org/I70900168"]}],"countries":["FR"],"is_corresponding":false,"raw_author_name":"Cedric Bermond","raw_affiliation_strings":["IMEP-LAHC, Universit\u00e9 de Savoie, Le Bourget du Lac Cedex, France"],"affiliations":[{"raw_affiliation_string":"IMEP-LAHC, Universit\u00e9 de Savoie, Le Bourget du Lac Cedex, France","institution_ids":["https://openalex.org/I70900168","https://openalex.org/I4210139715"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5071621943","display_name":"C. Fuchs","orcid":null},"institutions":[{"id":"https://openalex.org/I2738703131","display_name":"Commissariat \u00e0 l'\u00c9nergie Atomique et aux \u00c9nergies Alternatives","ror":"https://ror.org/00jjx8s55","country_code":"FR","type":"government","lineage":["https://openalex.org/I2738703131"]},{"id":"https://openalex.org/I3020098449","display_name":"CEA Grenoble","ror":"https://ror.org/02mg6n827","country_code":"FR","type":"government","lineage":["https://openalex.org/I2738703131","https://openalex.org/I3020098449"]},{"id":"https://openalex.org/I4210150049","display_name":"Laboratoire d'\u00c9lectronique des Technologies de l'Information","ror":"https://ror.org/04mf0wv34","country_code":"FR","type":"government","lineage":["https://openalex.org/I2738703131","https://openalex.org/I2738703131","https://openalex.org/I4210117989","https://openalex.org/I4210150049"]}],"countries":["FR"],"is_corresponding":false,"raw_author_name":"Christine Fuchs","raw_affiliation_strings":["CEA-L\u00e9ti, Grenoble Cedex 9, France"],"affiliations":[{"raw_affiliation_string":"CEA-L\u00e9ti, Grenoble Cedex 9, France","institution_ids":["https://openalex.org/I4210150049","https://openalex.org/I3020098449","https://openalex.org/I2738703131"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5108282276","display_name":"Patrick Leduc","orcid":null},"institutions":[{"id":"https://openalex.org/I2738703131","display_name":"Commissariat \u00e0 l'\u00c9nergie Atomique et aux \u00c9nergies Alternatives","ror":"https://ror.org/00jjx8s55","country_code":"FR","type":"government","lineage":["https://openalex.org/I2738703131"]},{"id":"https://openalex.org/I3020098449","display_name":"CEA Grenoble","ror":"https://ror.org/02mg6n827","country_code":"FR","type":"government","lineage":["https://openalex.org/I2738703131","https://openalex.org/I3020098449"]},{"id":"https://openalex.org/I4210150049","display_name":"Laboratoire d'\u00c9lectronique des Technologies de l'Information","ror":"https://ror.org/04mf0wv34","country_code":"FR","type":"government","lineage":["https://openalex.org/I2738703131","https://openalex.org/I2738703131","https://openalex.org/I4210117989","https://openalex.org/I4210150049"]}],"countries":["FR"],"is_corresponding":false,"raw_author_name":"Patrick Leduc","raw_affiliation_strings":["CEA-L\u00e9ti, Grenoble Cedex 9, France"],"affiliations":[{"raw_affiliation_string":"CEA-L\u00e9ti, Grenoble Cedex 9, France","institution_ids":["https://openalex.org/I4210150049","https://openalex.org/I3020098449","https://openalex.org/I2738703131"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5048645051","display_name":"Maxime Rousseau","orcid":null},"institutions":[{"id":"https://openalex.org/I4210104693","display_name":"STMicroelectronics (France)","ror":"https://ror.org/01c74sd89","country_code":"FR","type":"company","lineage":["https://openalex.org/I131827901","https://openalex.org/I4210104693"]}],"countries":["FR"],"is_corresponding":false,"raw_author_name":"Maxime Rousseau","raw_affiliation_strings":["STMicroelectronics, Crolles Cedex, France"],"affiliations":[{"raw_affiliation_string":"STMicroelectronics, Crolles Cedex, France","institution_ids":["https://openalex.org/I4210104693"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5025019764","display_name":"M. Assous","orcid":null},"institutions":[{"id":"https://openalex.org/I2738703131","display_name":"Commissariat \u00e0 l'\u00c9nergie Atomique et aux \u00c9nergies Alternatives","ror":"https://ror.org/00jjx8s55","country_code":"FR","type":"government","lineage":["https://openalex.org/I2738703131"]},{"id":"https://openalex.org/I3020098449","display_name":"CEA Grenoble","ror":"https://ror.org/02mg6n827","country_code":"FR","type":"government","lineage":["https://openalex.org/I2738703131","https://openalex.org/I3020098449"]},{"id":"https://openalex.org/I4210150049","display_name":"Laboratoire d'\u00c9lectronique des Technologies de l'Information","ror":"https://ror.org/04mf0wv34","country_code":"FR","type":"government","lineage":["https://openalex.org/I2738703131","https://openalex.org/I2738703131","https://openalex.org/I4210117989","https://openalex.org/I4210150049"]}],"countries":["FR"],"is_corresponding":false,"raw_author_name":"Myriam Assous","raw_affiliation_strings":["CEA-L\u00e9ti, Grenoble Cedex 9, France"],"affiliations":[{"raw_affiliation_string":"CEA-L\u00e9ti, Grenoble Cedex 9, France","institution_ids":["https://openalex.org/I4210150049","https://openalex.org/I3020098449","https://openalex.org/I2738703131"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5079482442","display_name":"Alexandre Valentian","orcid":"https://orcid.org/0000-0002-4319-6563"},"institutions":[{"id":"https://openalex.org/I2738703131","display_name":"Commissariat \u00e0 l'\u00c9nergie Atomique et aux \u00c9nergies Alternatives","ror":"https://ror.org/00jjx8s55","country_code":"FR","type":"government","lineage":["https://openalex.org/I2738703131"]},{"id":"https://openalex.org/I3020098449","display_name":"CEA Grenoble","ror":"https://ror.org/02mg6n827","country_code":"FR","type":"government","lineage":["https://openalex.org/I2738703131","https://openalex.org/I3020098449"]},{"id":"https://openalex.org/I4210150049","display_name":"Laboratoire d'\u00c9lectronique des Technologies de l'Information","ror":"https://ror.org/04mf0wv34","country_code":"FR","type":"government","lineage":["https://openalex.org/I2738703131","https://openalex.org/I2738703131","https://openalex.org/I4210117989","https://openalex.org/I4210150049"]}],"countries":["FR"],"is_corresponding":false,"raw_author_name":"Alexandre Valentian","raw_affiliation_strings":["CEA-L\u00e9ti, Grenoble Cedex 9, France"],"affiliations":[{"raw_affiliation_string":"CEA-L\u00e9ti, Grenoble Cedex 9, France","institution_ids":["https://openalex.org/I4210150049","https://openalex.org/I3020098449","https://openalex.org/I2738703131"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5032664108","display_name":"J. Roullard","orcid":null},"institutions":[{"id":"https://openalex.org/I4210139715","display_name":"Institut de Micro\u00e9lectronique, Electromagn\u00e9tisme et Photonique","ror":"https://ror.org/03taa9n66","country_code":"FR","type":"facility","lineage":["https://openalex.org/I106785703","https://openalex.org/I1294671590","https://openalex.org/I4210095849","https://openalex.org/I4210139715","https://openalex.org/I70900168","https://openalex.org/I899635006"]},{"id":"https://openalex.org/I70900168","display_name":"Universit\u00e9 Savoie Mont Blanc","ror":"https://ror.org/04gqg1a07","country_code":"FR","type":"education","lineage":["https://openalex.org/I70900168"]}],"countries":["FR"],"is_corresponding":false,"raw_author_name":"Julie Roullard","raw_affiliation_strings":["IMEP-LAHC, Universit\u00e9 de Savoie, Le Bourget du Lac Cedex, France"],"affiliations":[{"raw_affiliation_string":"IMEP-LAHC, Universit\u00e9 de Savoie, Le Bourget du Lac Cedex, France","institution_ids":["https://openalex.org/I70900168","https://openalex.org/I4210139715"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5031860410","display_name":"E. Eid","orcid":"https://orcid.org/0000-0002-5995-5990"},"institutions":[{"id":"https://openalex.org/I4210139715","display_name":"Institut de Micro\u00e9lectronique, Electromagn\u00e9tisme et Photonique","ror":"https://ror.org/03taa9n66","country_code":"FR","type":"facility","lineage":["https://openalex.org/I106785703","https://openalex.org/I1294671590","https://openalex.org/I4210095849","https://openalex.org/I4210139715","https://openalex.org/I70900168","https://openalex.org/I899635006"]},{"id":"https://openalex.org/I70900168","display_name":"Universit\u00e9 Savoie Mont Blanc","ror":"https://ror.org/04gqg1a07","country_code":"FR","type":"education","lineage":["https://openalex.org/I70900168"]}],"countries":["FR"],"is_corresponding":false,"raw_author_name":"Elie Eid","raw_affiliation_strings":["IMEP-LAHC, Universit\u00e9 de Savoie, Le Bourget du Lac Cedex, France"],"affiliations":[{"raw_affiliation_string":"IMEP-LAHC, Universit\u00e9 de Savoie, Le Bourget du Lac Cedex, France","institution_ids":["https://openalex.org/I70900168","https://openalex.org/I4210139715"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5026484482","display_name":"N. Sillon","orcid":null},"institutions":[{"id":"https://openalex.org/I2738703131","display_name":"Commissariat \u00e0 l'\u00c9nergie Atomique et aux \u00c9nergies Alternatives","ror":"https://ror.org/00jjx8s55","country_code":"FR","type":"government","lineage":["https://openalex.org/I2738703131"]},{"id":"https://openalex.org/I3020098449","display_name":"CEA Grenoble","ror":"https://ror.org/02mg6n827","country_code":"FR","type":"government","lineage":["https://openalex.org/I2738703131","https://openalex.org/I3020098449"]},{"id":"https://openalex.org/I4210150049","display_name":"Laboratoire d'\u00c9lectronique des Technologies de l'Information","ror":"https://ror.org/04mf0wv34","country_code":"FR","type":"government","lineage":["https://openalex.org/I2738703131","https://openalex.org/I2738703131","https://openalex.org/I4210117989","https://openalex.org/I4210150049"]}],"countries":["FR"],"is_corresponding":false,"raw_author_name":"Nicolas Sillon","raw_affiliation_strings":["CEA-L\u00e9ti, Grenoble Cedex 9, France"],"affiliations":[{"raw_affiliation_string":"CEA-L\u00e9ti, Grenoble Cedex 9, France","institution_ids":["https://openalex.org/I4210150049","https://openalex.org/I3020098449","https://openalex.org/I2738703131"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5103353389","display_name":"Bernard Fl\u00e9chet","orcid":null},"institutions":[{"id":"https://openalex.org/I4210139715","display_name":"Institut de Micro\u00e9lectronique, Electromagn\u00e9tisme et Photonique","ror":"https://ror.org/03taa9n66","country_code":"FR","type":"facility","lineage":["https://openalex.org/I106785703","https://openalex.org/I1294671590","https://openalex.org/I4210095849","https://openalex.org/I4210139715","https://openalex.org/I70900168","https://openalex.org/I899635006"]},{"id":"https://openalex.org/I70900168","display_name":"Universit\u00e9 Savoie Mont Blanc","ror":"https://ror.org/04gqg1a07","country_code":"FR","type":"education","lineage":["https://openalex.org/I70900168"]}],"countries":["FR"],"is_corresponding":false,"raw_author_name":"Bernard Flechet","raw_affiliation_strings":["IMEP-LAHC, Universit\u00e9 de Savoie, Le Bourget du Lac Cedex, France"],"affiliations":[{"raw_affiliation_string":"IMEP-LAHC, Universit\u00e9 de Savoie, Le Bourget du Lac Cedex, France","institution_ids":["https://openalex.org/I70900168","https://openalex.org/I4210139715"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5023180655","display_name":"P. Ancey","orcid":null},"institutions":[{"id":"https://openalex.org/I4210104693","display_name":"STMicroelectronics (France)","ror":"https://ror.org/01c74sd89","country_code":"FR","type":"company","lineage":["https://openalex.org/I131827901","https://openalex.org/I4210104693"]}],"countries":["FR"],"is_corresponding":false,"raw_author_name":"Pascal Ancey","raw_affiliation_strings":["STMicroelectronics, Crolles Cedex, France"],"affiliations":[{"raw_affiliation_string":"STMicroelectronics, Crolles Cedex, France","institution_ids":["https://openalex.org/I4210104693"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":13,"corresponding_author_ids":["https://openalex.org/A5013682091"],"corresponding_institution_ids":["https://openalex.org/I4210104693","https://openalex.org/I4210139715","https://openalex.org/I70900168"],"apc_list":null,"apc_paid":null,"fwci":6.7059,"has_fulltext":false,"cited_by_count":43,"citation_normalized_percentile":{"value":0.96956951,"is_in_top_1_percent":false,"is_in_top_10_percent":true},"cited_by_percentile_year":{"min":89,"max":99},"biblio":{"volume":null,"issue":null,"first_page":"1","last_page":"7"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.9965999722480774,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10783","display_name":"Additive Manufacturing and 3D Printing Technologies","score":0.9944000244140625,"subfield":{"id":"https://openalex.org/subfields/2203","display_name":"Automotive Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/spice","display_name":"Spice","score":0.7263553142547607},{"id":"https://openalex.org/keywords/through-silicon-via","display_name":"Through-silicon via","score":0.7063665390014648},{"id":"https://openalex.org/keywords/interconnection","display_name":"Interconnection","score":0.680186927318573},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.6026216745376587},{"id":"https://openalex.org/keywords/capacitance","display_name":"Capacitance","score":0.6022907495498657},{"id":"https://openalex.org/keywords/inductance","display_name":"Inductance","score":0.5845285058021545},{"id":"https://openalex.org/keywords/equivalent-circuit","display_name":"Equivalent circuit","score":0.5531116724014282},{"id":"https://openalex.org/keywords/parametric-statistics","display_name":"Parametric statistics","score":0.5408440828323364},{"id":"https://openalex.org/keywords/parasitic-capacitance","display_name":"Parasitic capacitance","score":0.5357052683830261},{"id":"https://openalex.org/keywords/signal-integrity","display_name":"Signal integrity","score":0.5052440762519836},{"id":"https://openalex.org/keywords/parasitic-extraction","display_name":"Parasitic extraction","score":0.49484533071517944},{"id":"https://openalex.org/keywords/electronic-component","display_name":"Electronic component","score":0.4881654381752014},{"id":"https://openalex.org/keywords/integrated-circuit","display_name":"Integrated circuit","score":0.4611824154853821},{"id":"https://openalex.org/keywords/radio-frequency","display_name":"Radio frequency","score":0.45022034645080566},{"id":"https://openalex.org/keywords/electronic-circuit","display_name":"Electronic circuit","score":0.42768287658691406},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.4181216061115265},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.3920801877975464},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.3663594722747803},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.3128046691417694},{"id":"https://openalex.org/keywords/silicon","display_name":"Silicon","score":0.31175169348716736},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.22818005084991455},{"id":"https://openalex.org/keywords/telecommunications","display_name":"Telecommunications","score":0.10892438888549805}],"concepts":[{"id":"https://openalex.org/C2780077345","wikidata":"https://www.wikidata.org/wiki/Q16891888","display_name":"Spice","level":2,"score":0.7263553142547607},{"id":"https://openalex.org/C45632049","wikidata":"https://www.wikidata.org/wiki/Q1578120","display_name":"Through-silicon via","level":3,"score":0.7063665390014648},{"id":"https://openalex.org/C123745756","wikidata":"https://www.wikidata.org/wiki/Q1665949","display_name":"Interconnection","level":2,"score":0.680186927318573},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.6026216745376587},{"id":"https://openalex.org/C30066665","wikidata":"https://www.wikidata.org/wiki/Q164399","display_name":"Capacitance","level":3,"score":0.6022907495498657},{"id":"https://openalex.org/C29210110","wikidata":"https://www.wikidata.org/wiki/Q177897","display_name":"Inductance","level":3,"score":0.5845285058021545},{"id":"https://openalex.org/C23572009","wikidata":"https://www.wikidata.org/wiki/Q964981","display_name":"Equivalent circuit","level":3,"score":0.5531116724014282},{"id":"https://openalex.org/C117251300","wikidata":"https://www.wikidata.org/wiki/Q1849855","display_name":"Parametric statistics","level":2,"score":0.5408440828323364},{"id":"https://openalex.org/C154318817","wikidata":"https://www.wikidata.org/wiki/Q2157249","display_name":"Parasitic capacitance","level":4,"score":0.5357052683830261},{"id":"https://openalex.org/C44938667","wikidata":"https://www.wikidata.org/wiki/Q4503810","display_name":"Signal integrity","level":3,"score":0.5052440762519836},{"id":"https://openalex.org/C159818811","wikidata":"https://www.wikidata.org/wiki/Q7135947","display_name":"Parasitic extraction","level":2,"score":0.49484533071517944},{"id":"https://openalex.org/C81060104","wikidata":"https://www.wikidata.org/wiki/Q11653","display_name":"Electronic component","level":2,"score":0.4881654381752014},{"id":"https://openalex.org/C530198007","wikidata":"https://www.wikidata.org/wiki/Q80831","display_name":"Integrated circuit","level":2,"score":0.4611824154853821},{"id":"https://openalex.org/C74064498","wikidata":"https://www.wikidata.org/wiki/Q3396184","display_name":"Radio frequency","level":2,"score":0.45022034645080566},{"id":"https://openalex.org/C134146338","wikidata":"https://www.wikidata.org/wiki/Q1815901","display_name":"Electronic circuit","level":2,"score":0.42768287658691406},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.4181216061115265},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.3920801877975464},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.3663594722747803},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.3128046691417694},{"id":"https://openalex.org/C544956773","wikidata":"https://www.wikidata.org/wiki/Q670","display_name":"Silicon","level":2,"score":0.31175169348716736},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.22818005084991455},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.10892438888549805},{"id":"https://openalex.org/C17525397","wikidata":"https://www.wikidata.org/wiki/Q176140","display_name":"Electrode","level":2,"score":0.0},{"id":"https://openalex.org/C147789679","wikidata":"https://www.wikidata.org/wiki/Q11372","display_name":"Physical chemistry","level":1,"score":0.0},{"id":"https://openalex.org/C165801399","wikidata":"https://www.wikidata.org/wiki/Q25428","display_name":"Voltage","level":2,"score":0.0},{"id":"https://openalex.org/C33923547","wikidata":"https://www.wikidata.org/wiki/Q395","display_name":"Mathematics","level":0,"score":0.0},{"id":"https://openalex.org/C105795698","wikidata":"https://www.wikidata.org/wiki/Q12483","display_name":"Statistics","level":1,"score":0.0},{"id":"https://openalex.org/C185592680","wikidata":"https://www.wikidata.org/wiki/Q2329","display_name":"Chemistry","level":0,"score":0.0}],"mesh":[],"locations_count":2,"locations":[{"id":"doi:10.1109/3dic.2009.5306592","is_oa":false,"landing_page_url":"https://doi.org/10.1109/3dic.2009.5306592","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2009 IEEE International Conference on 3D System Integration","raw_type":"proceedings-article"},{"id":"pmh:oai:HAL:hal-00602867v1","is_oa":false,"landing_page_url":"https://hal.science/hal-00602867","pdf_url":null,"source":{"id":"https://openalex.org/S4306402512","display_name":"HAL (Le Centre pour la Communication Scientifique Directe)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":"https://openalex.org/I1294671590","host_organization_name":"Centre National de la Recherche Scientifique","host_organization_lineage":["https://openalex.org/I1294671590"],"host_organization_lineage_names":[],"type":"repository"},"license":null,"license_id":null,"version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"Modelling of Through Silicon Via RF Performance and Impact on Signal Transmission in 3D Integrated Circuits, Sep 2009, San Francisco, United States","raw_type":"Conference papers"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":4,"referenced_works":["https://openalex.org/W2015046293","https://openalex.org/W2023264348","https://openalex.org/W2144149750","https://openalex.org/W2167452399"],"related_works":["https://openalex.org/W63447294","https://openalex.org/W1973000679","https://openalex.org/W2068547800","https://openalex.org/W2114312831","https://openalex.org/W4256385015","https://openalex.org/W3215101624","https://openalex.org/W2142764951","https://openalex.org/W2019635822","https://openalex.org/W2106005208","https://openalex.org/W3082795214"],"abstract_inverted_index":{"Through":[0],"silicon":[1],"via":[2],"(TSV)":[3],"is":[4,69],"considered":[5],"today":[6],"as":[7],"the":[8,96,107],"third":[9],"dimension":[10],"interconnect":[11],"opening":[12],"new":[13],"perspectives":[14],"in":[15],"term":[16],"of":[17,36,44,64,109],"3D":[18,29],"integration.":[19],"Design,":[20],"material":[21],"and":[22,32,51,60,77,91],"process":[23],"recommendations":[24],"are":[25],"required":[26],"to":[27,83,95],"achieve":[28],"stacked":[30],"dies":[31],"evaluate":[33],"electrical":[34],"performance":[35],"such":[37],"chips.":[38],"As":[39],"a":[40,57],"consequence,":[41],"equivalent":[42],"models":[43],"this":[45,55],"incontrovertible":[46],"key":[47],"component":[48],"become":[49],"more":[50,52],"mandatory.":[53],"In":[54],"paper,":[56],"full":[58,101],"parametric":[59],"frequency":[61],"dependent":[62],"model":[63,81],"high":[65],"aspect":[66],"ratio":[67],"TSV":[68,85,110],"proposed":[70],"based":[71],"on":[72,112],"both":[73],"electromagnetic":[74],"(EM)":[75],"simulations":[76],"RF":[78],"measurements.":[79],"This":[80],"enables":[82],"extract":[84],"resistance,":[86],"self":[87],"inductance,":[88],"oxide":[89],"capacitance":[90],"parasitic":[92],"elements":[93],"due":[94],"finite":[97],"substrate":[98],"resistivity.":[99],"Its":[100],"compatibility":[102],"with":[103],"SPICE":[104],"solvers":[105],"allows":[106],"investigation":[108],"impact":[111],"circuit":[113],"performance.":[114]},"counts_by_year":[{"year":2026,"cited_by_count":1},{"year":2020,"cited_by_count":1},{"year":2019,"cited_by_count":1},{"year":2018,"cited_by_count":1},{"year":2016,"cited_by_count":4},{"year":2015,"cited_by_count":4},{"year":2014,"cited_by_count":4},{"year":2013,"cited_by_count":5},{"year":2012,"cited_by_count":6}],"updated_date":"2026-04-05T17:49:38.594831","created_date":"2025-10-10T00:00:00"}