{"id":"https://openalex.org/W2121603629","doi":"https://doi.org/10.1109/3dic.2009.5306574","title":"3D interconnects for dense die stack packages","display_name":"3D interconnects for dense die stack packages","publication_year":2009,"publication_date":"2009-09-01","ids":{"openalex":"https://openalex.org/W2121603629","doi":"https://doi.org/10.1109/3dic.2009.5306574","mag":"2121603629"},"language":"en","primary_location":{"id":"doi:10.1109/3dic.2009.5306574","is_oa":false,"landing_page_url":"https://doi.org/10.1109/3dic.2009.5306574","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2009 IEEE International Conference on 3D System Integration","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5008634447","display_name":"Laura Mirkarimi","orcid":null},"institutions":[{"id":"https://openalex.org/I4210127493","display_name":"Xperi (United States)","ror":"https://ror.org/03jn2ja08","country_code":"US","type":"company","lineage":["https://openalex.org/I4210127493"]},{"id":"https://openalex.org/I139025015","display_name":"Pioneer (United States)","ror":"https://ror.org/05jke7315","country_code":"US","type":"company","lineage":["https://openalex.org/I139025015","https://openalex.org/I4210104019"]}],"countries":["US"],"is_corresponding":true,"raw_author_name":"L. Mirkarimi","raw_affiliation_strings":["Tessera Technologies, Inc., San Jose, CA, USA","Ambios Technology, Inc., 100 Pioneer St., Ste A, Santa Cruz, CA 95060, 877-429-4200, USA"],"affiliations":[{"raw_affiliation_string":"Tessera Technologies, Inc., San Jose, CA, USA","institution_ids":["https://openalex.org/I4210127493"]},{"raw_affiliation_string":"Ambios Technology, Inc., 100 Pioneer St., Ste A, Santa Cruz, CA 95060, 877-429-4200, USA","institution_ids":["https://openalex.org/I139025015"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5057196663","display_name":"Michael Huynh","orcid":null},"institutions":[{"id":"https://openalex.org/I139025015","display_name":"Pioneer (United States)","ror":"https://ror.org/05jke7315","country_code":"US","type":"company","lineage":["https://openalex.org/I139025015","https://openalex.org/I4210104019"]},{"id":"https://openalex.org/I4210127493","display_name":"Xperi (United States)","ror":"https://ror.org/03jn2ja08","country_code":"US","type":"company","lineage":["https://openalex.org/I4210127493"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"M. Huynh","raw_affiliation_strings":["Tessera Technologies, Inc., San Jose, CA, USA","Ambios Technology, Inc., 100 Pioneer St., Ste A, Santa Cruz, CA 95060, 877-429-4200, USA"],"affiliations":[{"raw_affiliation_string":"Tessera Technologies, Inc., San Jose, CA, USA","institution_ids":["https://openalex.org/I4210127493"]},{"raw_affiliation_string":"Ambios Technology, Inc., 100 Pioneer St., Ste A, Santa Cruz, CA 95060, 877-429-4200, USA","institution_ids":["https://openalex.org/I139025015"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5019356068","display_name":"P. V. Savalia","orcid":null},"institutions":[{"id":"https://openalex.org/I139025015","display_name":"Pioneer (United States)","ror":"https://ror.org/05jke7315","country_code":"US","type":"company","lineage":["https://openalex.org/I139025015","https://openalex.org/I4210104019"]},{"id":"https://openalex.org/I4210127493","display_name":"Xperi (United States)","ror":"https://ror.org/03jn2ja08","country_code":"US","type":"company","lineage":["https://openalex.org/I4210127493"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"P. Savalia","raw_affiliation_strings":["Tessera Technologies, Inc., San Jose, CA, USA","Ambios Technology, Inc., 100 Pioneer St., Ste A, Santa Cruz, CA 95060, 877-429-4200, USA"],"affiliations":[{"raw_affiliation_string":"Tessera Technologies, Inc., San Jose, CA, USA","institution_ids":["https://openalex.org/I4210127493"]},{"raw_affiliation_string":"Ambios Technology, Inc., 100 Pioneer St., Ste A, Santa Cruz, CA 95060, 877-429-4200, USA","institution_ids":["https://openalex.org/I139025015"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5082822326","display_name":"Vage Oganesian","orcid":null},"institutions":[{"id":"https://openalex.org/I4210127493","display_name":"Xperi (United States)","ror":"https://ror.org/03jn2ja08","country_code":"US","type":"company","lineage":["https://openalex.org/I4210127493"]},{"id":"https://openalex.org/I139025015","display_name":"Pioneer (United States)","ror":"https://ror.org/05jke7315","country_code":"US","type":"company","lineage":["https://openalex.org/I139025015","https://openalex.org/I4210104019"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"V. Oganesian","raw_affiliation_strings":["Tessera Technologies, Inc., San Jose, CA, USA","Ambios Technology, Inc., 100 Pioneer St., Ste A, Santa Cruz, CA 95060, 877-429-4200, USA"],"affiliations":[{"raw_affiliation_string":"Tessera Technologies, Inc., San Jose, CA, USA","institution_ids":["https://openalex.org/I4210127493"]},{"raw_affiliation_string":"Ambios Technology, Inc., 100 Pioneer St., Ste A, Santa Cruz, CA 95060, 877-429-4200, USA","institution_ids":["https://openalex.org/I139025015"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":4,"corresponding_author_ids":["https://openalex.org/A5008634447"],"corresponding_institution_ids":["https://openalex.org/I139025015","https://openalex.org/I4210127493"],"apc_list":null,"apc_paid":null,"fwci":0.5982,"has_fulltext":false,"cited_by_count":3,"citation_normalized_percentile":{"value":0.72385925,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":94},"biblio":{"volume":null,"issue":null,"first_page":"1","last_page":"5"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.9915000200271606,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.9915000200271606,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10783","display_name":"Additive Manufacturing and 3D Printing Technologies","score":0.9771000146865845,"subfield":{"id":"https://openalex.org/subfields/2203","display_name":"Automotive Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11159","display_name":"Manufacturing Process and Optimization","score":0.9419999718666077,"subfield":{"id":"https://openalex.org/subfields/2209","display_name":"Industrial and Manufacturing Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/stack","display_name":"Stack (abstract data type)","score":0.8009381294250488},{"id":"https://openalex.org/keywords/die","display_name":"Die (integrated circuit)","score":0.7554645538330078},{"id":"https://openalex.org/keywords/interconnection","display_name":"Interconnection","score":0.7132012844085693},{"id":"https://openalex.org/keywords/wafer","display_name":"Wafer","score":0.5802322030067444},{"id":"https://openalex.org/keywords/integrated-circuit-packaging","display_name":"Integrated circuit packaging","score":0.5745379328727722},{"id":"https://openalex.org/keywords/chip-scale-package","display_name":"Chip-scale package","score":0.5179232954978943},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.4789476990699768},{"id":"https://openalex.org/keywords/electronic-packaging","display_name":"Electronic packaging","score":0.4530196189880371},{"id":"https://openalex.org/keywords/package-design","display_name":"Package design","score":0.44065189361572266},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.39415860176086426},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.3814733624458313},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.24022015929222107},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.22168537974357605},{"id":"https://openalex.org/keywords/engineering-drawing","display_name":"Engineering drawing","score":0.21722093224525452},{"id":"https://openalex.org/keywords/integrated-circuit","display_name":"Integrated circuit","score":0.19735726714134216},{"id":"https://openalex.org/keywords/operating-system","display_name":"Operating system","score":0.10912832617759705},{"id":"https://openalex.org/keywords/telecommunications","display_name":"Telecommunications","score":0.06954917311668396}],"concepts":[{"id":"https://openalex.org/C9395851","wikidata":"https://www.wikidata.org/wiki/Q177929","display_name":"Stack (abstract data type)","level":2,"score":0.8009381294250488},{"id":"https://openalex.org/C111106434","wikidata":"https://www.wikidata.org/wiki/Q1072430","display_name":"Die (integrated circuit)","level":2,"score":0.7554645538330078},{"id":"https://openalex.org/C123745756","wikidata":"https://www.wikidata.org/wiki/Q1665949","display_name":"Interconnection","level":2,"score":0.7132012844085693},{"id":"https://openalex.org/C160671074","wikidata":"https://www.wikidata.org/wiki/Q267131","display_name":"Wafer","level":2,"score":0.5802322030067444},{"id":"https://openalex.org/C186260285","wikidata":"https://www.wikidata.org/wiki/Q759494","display_name":"Integrated circuit packaging","level":3,"score":0.5745379328727722},{"id":"https://openalex.org/C126233035","wikidata":"https://www.wikidata.org/wiki/Q5101572","display_name":"Chip-scale package","level":3,"score":0.5179232954978943},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.4789476990699768},{"id":"https://openalex.org/C69567186","wikidata":"https://www.wikidata.org/wiki/Q5358403","display_name":"Electronic packaging","level":2,"score":0.4530196189880371},{"id":"https://openalex.org/C3020349426","wikidata":"https://www.wikidata.org/wiki/Q207822","display_name":"Package design","level":2,"score":0.44065189361572266},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.39415860176086426},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.3814733624458313},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.24022015929222107},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.22168537974357605},{"id":"https://openalex.org/C199639397","wikidata":"https://www.wikidata.org/wiki/Q1788588","display_name":"Engineering drawing","level":1,"score":0.21722093224525452},{"id":"https://openalex.org/C530198007","wikidata":"https://www.wikidata.org/wiki/Q80831","display_name":"Integrated circuit","level":2,"score":0.19735726714134216},{"id":"https://openalex.org/C111919701","wikidata":"https://www.wikidata.org/wiki/Q9135","display_name":"Operating system","level":1,"score":0.10912832617759705},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.06954917311668396}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/3dic.2009.5306574","is_oa":false,"landing_page_url":"https://doi.org/10.1109/3dic.2009.5306574","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2009 IEEE International Conference on 3D System Integration","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":2,"referenced_works":["https://openalex.org/W2013161279","https://openalex.org/W2161333118"],"related_works":["https://openalex.org/W2946810098","https://openalex.org/W2394177261","https://openalex.org/W2106037810","https://openalex.org/W2120440041","https://openalex.org/W3023480993","https://openalex.org/W3045368716","https://openalex.org/W1839681081","https://openalex.org/W1913364280","https://openalex.org/W1932203561","https://openalex.org/W2109054457"],"abstract_inverted_index":{"A":[0],"unique":[1],"3D":[2],"interconnect":[3],"fabricated":[4],"using":[5],"a":[6,17],"wafer":[7],"level":[8],"stack":[9],"package":[10,18,20],"technology":[11],"is":[12,21],"presented.":[13],"The":[14],"prototype":[15],"module,":[16],"in":[19],"described":[22],"and":[23],"the":[24],"environmental":[25],"stress":[26],"testing":[27],"results":[28],"are":[29],"discussed.":[30]},"counts_by_year":[{"year":2013,"cited_by_count":1},{"year":2012,"cited_by_count":1}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}