{"id":"https://openalex.org/W2101466724","doi":"https://doi.org/10.1109/3dic.2009.5306564","title":"3D integration technology for 3D stacked retinal chip","display_name":"3D integration technology for 3D stacked retinal chip","publication_year":2009,"publication_date":"2009-09-01","ids":{"openalex":"https://openalex.org/W2101466724","doi":"https://doi.org/10.1109/3dic.2009.5306564","mag":"2101466724"},"language":"en","primary_location":{"id":"doi:10.1109/3dic.2009.5306564","is_oa":false,"landing_page_url":"https://doi.org/10.1109/3dic.2009.5306564","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2009 IEEE International Conference on 3D System Integration","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5113620845","display_name":"Yoshiyuki Kaiho","orcid":null},"institutions":[{"id":"https://openalex.org/I201537933","display_name":"Tohoku University","ror":"https://ror.org/01dq60k83","country_code":"JP","type":"education","lineage":["https://openalex.org/I201537933"]}],"countries":["JP"],"is_corresponding":true,"raw_author_name":"Y. Kaiho","raw_affiliation_strings":["Department of Bioengineering and Engineering, Department of Biomedical Engineering, University of Tohoku, Sendai, Japan","Department of Biomedical Engineering, Tohoku University, Sendai, 980-8579, Japan"],"affiliations":[{"raw_affiliation_string":"Department of Bioengineering and Engineering, Department of Biomedical Engineering, University of Tohoku, Sendai, Japan","institution_ids":["https://openalex.org/I201537933"]},{"raw_affiliation_string":"Department of Biomedical Engineering, Tohoku University, Sendai, 980-8579, Japan","institution_ids":["https://openalex.org/I201537933"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5077071636","display_name":"Yuki Ohara","orcid":"https://orcid.org/0000-0002-1294-256X"},"institutions":[{"id":"https://openalex.org/I201537933","display_name":"Tohoku University","ror":"https://ror.org/01dq60k83","country_code":"JP","type":"education","lineage":["https://openalex.org/I201537933"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"Y. Ohara","raw_affiliation_strings":["Department of Bioengineering and Engineering, Department of Biomedical Engineering, University of Tohoku, Sendai, Japan","Department of Bioengineering and Robotics,Tohoku University,Sendai 980-8579,Japan)"],"affiliations":[{"raw_affiliation_string":"Department of Bioengineering and Engineering, Department of Biomedical Engineering, University of Tohoku, Sendai, Japan","institution_ids":["https://openalex.org/I201537933"]},{"raw_affiliation_string":"Department of Bioengineering and Robotics,Tohoku University,Sendai 980-8579,Japan)","institution_ids":["https://openalex.org/I201537933"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5114258858","display_name":"H. Takeshita","orcid":null},"institutions":[{"id":"https://openalex.org/I201537933","display_name":"Tohoku University","ror":"https://ror.org/01dq60k83","country_code":"JP","type":"education","lineage":["https://openalex.org/I201537933"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"H. Takeshita","raw_affiliation_strings":["Department of Bioengineering and Engineering, Department of Biomedical Engineering, University of Tohoku, Sendai, Japan","Department of Biomedical Engineering, Tohoku University, Sendai, 980-8579, Japan"],"affiliations":[{"raw_affiliation_string":"Department of Bioengineering and Engineering, Department of Biomedical Engineering, University of Tohoku, Sendai, Japan","institution_ids":["https://openalex.org/I201537933"]},{"raw_affiliation_string":"Department of Biomedical Engineering, Tohoku University, Sendai, 980-8579, Japan","institution_ids":["https://openalex.org/I201537933"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5038764407","display_name":"K. Kiyoyama","orcid":null},"institutions":[{"id":"https://openalex.org/I201537933","display_name":"Tohoku University","ror":"https://ror.org/01dq60k83","country_code":"JP","type":"education","lineage":["https://openalex.org/I201537933"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"K. Kiyoyama","raw_affiliation_strings":["Department of Bioengineering and Engineering, Department of Biomedical Engineering, University of Tohoku, Sendai, Japan","Department of Bioengineering and Robotics,Tohoku University,Sendai 980-8579,Japan)"],"affiliations":[{"raw_affiliation_string":"Department of Bioengineering and Engineering, Department of Biomedical Engineering, University of Tohoku, Sendai, Japan","institution_ids":["https://openalex.org/I201537933"]},{"raw_affiliation_string":"Department of Bioengineering and Robotics,Tohoku University,Sendai 980-8579,Japan)","institution_ids":["https://openalex.org/I201537933"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5018052057","display_name":"Kyung-Woo Lee","orcid":"https://orcid.org/0000-0002-3533-7979"},"institutions":[{"id":"https://openalex.org/I201537933","display_name":"Tohoku University","ror":"https://ror.org/01dq60k83","country_code":"JP","type":"education","lineage":["https://openalex.org/I201537933"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"K-W Lee","raw_affiliation_strings":["Department of Bioengineering and Engineering, Department of Biomedical Engineering, University of Tohoku, Sendai, Japan","Department of Bioengineering and Robotics,Tohoku University,Sendai 980-8579,Japan)"],"affiliations":[{"raw_affiliation_string":"Department of Bioengineering and Engineering, Department of Biomedical Engineering, University of Tohoku, Sendai, Japan","institution_ids":["https://openalex.org/I201537933"]},{"raw_affiliation_string":"Department of Bioengineering and Robotics,Tohoku University,Sendai 980-8579,Japan)","institution_ids":["https://openalex.org/I201537933"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5006295728","display_name":"Tetsu Tanaka","orcid":"https://orcid.org/0000-0001-7414-315X"},"institutions":[{"id":"https://openalex.org/I201537933","display_name":"Tohoku University","ror":"https://ror.org/01dq60k83","country_code":"JP","type":"education","lineage":["https://openalex.org/I201537933"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"T. Tanaka","raw_affiliation_strings":["Department of Bioengineering and Engineering, Department of Biomedical Engineering, University of Tohoku, Sendai, Japan","Department of Biomedical Engineering, Tohoku University, Sendai, 980-8579, Japan"],"affiliations":[{"raw_affiliation_string":"Department of Bioengineering and Engineering, Department of Biomedical Engineering, University of Tohoku, Sendai, Japan","institution_ids":["https://openalex.org/I201537933"]},{"raw_affiliation_string":"Department of Biomedical Engineering, Tohoku University, Sendai, 980-8579, Japan","institution_ids":["https://openalex.org/I201537933"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5059487693","display_name":"Mitsumasa Koyanagi","orcid":"https://orcid.org/0000-0003-4726-4217"},"institutions":[{"id":"https://openalex.org/I201537933","display_name":"Tohoku University","ror":"https://ror.org/01dq60k83","country_code":"JP","type":"education","lineage":["https://openalex.org/I201537933"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"M. Koyanagi","raw_affiliation_strings":["Department of Bioengineering and Engineering, Department of Biomedical Engineering, University of Tohoku, Sendai, Japan","Department of Bioengineering and Robotics,Tohoku University,Sendai 980-8579,Japan)"],"affiliations":[{"raw_affiliation_string":"Department of Bioengineering and Engineering, Department of Biomedical Engineering, University of Tohoku, Sendai, Japan","institution_ids":["https://openalex.org/I201537933"]},{"raw_affiliation_string":"Department of Bioengineering and Robotics,Tohoku University,Sendai 980-8579,Japan)","institution_ids":["https://openalex.org/I201537933"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":7,"corresponding_author_ids":["https://openalex.org/A5113620845"],"corresponding_institution_ids":["https://openalex.org/I201537933"],"apc_list":null,"apc_paid":null,"fwci":1.0856,"has_fulltext":false,"cited_by_count":20,"citation_normalized_percentile":{"value":0.72786374,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":96},"biblio":{"volume":null,"issue":null,"first_page":"1","last_page":"4"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11601","display_name":"Neuroscience and Neural Engineering","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2804","display_name":"Cellular and Molecular Neuroscience"},"field":{"id":"https://openalex.org/fields/28","display_name":"Neuroscience"},"domain":{"id":"https://openalex.org/domains/1","display_name":"Life Sciences"}},"topics":[{"id":"https://openalex.org/T11601","display_name":"Neuroscience and Neural Engineering","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2804","display_name":"Cellular and Molecular Neuroscience"},"field":{"id":"https://openalex.org/fields/28","display_name":"Neuroscience"},"domain":{"id":"https://openalex.org/domains/1","display_name":"Life Sciences"}},{"id":"https://openalex.org/T10502","display_name":"Advanced Memory and Neural Computing","score":0.9986000061035156,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12236","display_name":"Photoreceptor and optogenetics research","score":0.989300012588501,"subfield":{"id":"https://openalex.org/subfields/2804","display_name":"Cellular and Molecular Neuroscience"},"field":{"id":"https://openalex.org/fields/28","display_name":"Neuroscience"},"domain":{"id":"https://openalex.org/domains/1","display_name":"Life Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/retinal-prosthesis","display_name":"Retinal Prosthesis","score":0.7285706400871277},{"id":"https://openalex.org/keywords/chip","display_name":"Chip","score":0.6462552547454834},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.5772193670272827},{"id":"https://openalex.org/keywords/printed-circuit-board","display_name":"Printed circuit board","score":0.5019474029541016},{"id":"https://openalex.org/keywords/flip-chip","display_name":"Flip chip","score":0.46050378680229187},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.4577031135559082},{"id":"https://openalex.org/keywords/photodetector","display_name":"Photodetector","score":0.4458011984825134},{"id":"https://openalex.org/keywords/3d-printed","display_name":"3d printed","score":0.43665793538093567},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.3574742078781128},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.3242732286453247},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.22739294171333313},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.20311817526817322},{"id":"https://openalex.org/keywords/optics","display_name":"Optics","score":0.143510103225708},{"id":"https://openalex.org/keywords/biomedical-engineering","display_name":"Biomedical engineering","score":0.14161533117294312},{"id":"https://openalex.org/keywords/retina","display_name":"Retina","score":0.1330251395702362},{"id":"https://openalex.org/keywords/telecommunications","display_name":"Telecommunications","score":0.1189335286617279},{"id":"https://openalex.org/keywords/nanotechnology","display_name":"Nanotechnology","score":0.10165953636169434}],"concepts":[{"id":"https://openalex.org/C2908752955","wikidata":"https://www.wikidata.org/wiki/Q540043","display_name":"Retinal Prosthesis","level":3,"score":0.7285706400871277},{"id":"https://openalex.org/C165005293","wikidata":"https://www.wikidata.org/wiki/Q1074500","display_name":"Chip","level":2,"score":0.6462552547454834},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.5772193670272827},{"id":"https://openalex.org/C120793396","wikidata":"https://www.wikidata.org/wiki/Q173350","display_name":"Printed circuit board","level":2,"score":0.5019474029541016},{"id":"https://openalex.org/C79072407","wikidata":"https://www.wikidata.org/wiki/Q432439","display_name":"Flip chip","level":4,"score":0.46050378680229187},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.4577031135559082},{"id":"https://openalex.org/C23125352","wikidata":"https://www.wikidata.org/wiki/Q210765","display_name":"Photodetector","level":2,"score":0.4458011984825134},{"id":"https://openalex.org/C3019308078","wikidata":"https://www.wikidata.org/wiki/Q229367","display_name":"3d printed","level":2,"score":0.43665793538093567},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.3574742078781128},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.3242732286453247},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.22739294171333313},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.20311817526817322},{"id":"https://openalex.org/C120665830","wikidata":"https://www.wikidata.org/wiki/Q14620","display_name":"Optics","level":1,"score":0.143510103225708},{"id":"https://openalex.org/C136229726","wikidata":"https://www.wikidata.org/wiki/Q327092","display_name":"Biomedical engineering","level":1,"score":0.14161533117294312},{"id":"https://openalex.org/C2777093970","wikidata":"https://www.wikidata.org/wiki/Q169342","display_name":"Retina","level":2,"score":0.1330251395702362},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.1189335286617279},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.10165953636169434},{"id":"https://openalex.org/C68928338","wikidata":"https://www.wikidata.org/wiki/Q131790","display_name":"Adhesive","level":3,"score":0.0},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.0},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/3dic.2009.5306564","is_oa":false,"landing_page_url":"https://doi.org/10.1109/3dic.2009.5306564","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2009 IEEE International Conference on 3D System Integration","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"score":0.4099999964237213,"display_name":"Industry, innovation and infrastructure","id":"https://metadata.un.org/sdg/9"}],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":7,"referenced_works":["https://openalex.org/W1489019719","https://openalex.org/W1549310396","https://openalex.org/W2026659547","https://openalex.org/W2027962259","https://openalex.org/W2135120979","https://openalex.org/W6629390284","https://openalex.org/W6632807297"],"related_works":["https://openalex.org/W2350159546","https://openalex.org/W2915158639","https://openalex.org/W1530391261","https://openalex.org/W4211121654","https://openalex.org/W2532422067","https://openalex.org/W2115932404","https://openalex.org/W4232272518","https://openalex.org/W2261056475","https://openalex.org/W2158483827","https://openalex.org/W2391741149"],"abstract_inverted_index":{"To":[0],"recover":[1],"visual":[2],"sensation":[3],"of":[4,27,65,80,108],"blind":[5],"patients,":[6],"we":[7,49],"have":[8],"proposed":[9],"a":[10],"novel":[11],"three":[12],"dimensionally":[13],"(3D)":[14],"stacked":[15,38,57],"retinal":[16,58],"prosthesis":[17,59,83,86],"chip":[18,87],"in":[19],"which":[20],"several":[21,51],"LSI":[22],"chips":[23],"such":[24],"as":[25],"consisting":[26],"photodetector,":[28],"signal":[29],"processing":[30],"circuit":[31],"and":[32,39,69],"stimulus":[33],"current":[34],"generator":[35],"are":[36],"vertically":[37],"electrically":[40],"connected":[41],"using":[42],"3D":[43,56,109],"integration":[44,110],"technology.":[45,111],"In":[46],"this":[47],"work,":[48],"developed":[50],"key":[52],"process":[53],"for":[54,104],"realizing":[55],"chip.":[60,84],"Fine":[61],"sized":[62],"Cu":[63,92],"TSV":[64],"10":[66],"mum":[67,71],"width":[68],"30":[70],"depth":[72],"was":[73,94],"successfully":[74],"formed":[75],"from":[76],"the":[77,81,89,106],"back":[78,90],"side":[79,91],"thinned":[82],"The":[85],"with":[88],"TSVs":[93],"flip-chip":[95],"bonded":[96],"to":[97],"Si":[98],"substrate/flexible":[99],"substrate":[100],"through":[101],"Cu/Sn":[102],"micro-bumps":[103],"evaluating":[105],"feasibility":[107]},"counts_by_year":[{"year":2025,"cited_by_count":2},{"year":2023,"cited_by_count":1},{"year":2022,"cited_by_count":2},{"year":2021,"cited_by_count":1},{"year":2017,"cited_by_count":1},{"year":2015,"cited_by_count":2},{"year":2014,"cited_by_count":2},{"year":2012,"cited_by_count":1}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}