{"id":"https://openalex.org/W1993400043","doi":"https://doi.org/10.1109/3dic.2009.5306559","title":"Die stacking using 3D-wafer level packaging copper/polymer through-si via technology and Cu/Sn interconnect bumping","display_name":"Die stacking using 3D-wafer level packaging copper/polymer through-si via technology and Cu/Sn interconnect bumping","publication_year":2009,"publication_date":"2009-09-01","ids":{"openalex":"https://openalex.org/W1993400043","doi":"https://doi.org/10.1109/3dic.2009.5306559","mag":"1993400043"},"language":"en","primary_location":{"id":"doi:10.1109/3dic.2009.5306559","is_oa":false,"landing_page_url":"https://doi.org/10.1109/3dic.2009.5306559","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2009 IEEE International Conference on 3D System Integration","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5048147021","display_name":"Yann Civale","orcid":null},"institutions":[{"id":"https://openalex.org/I4210114974","display_name":"IMEC","ror":"https://ror.org/02kcbn207","country_code":"BE","type":"nonprofit","lineage":["https://openalex.org/I4210114974"]}],"countries":["BE"],"is_corresponding":true,"raw_author_name":"Y. Civale","raw_affiliation_strings":["IMEC, Leuven, Belgium","IMEC, Kapeldreef 75, 3001 Leuven Belgium,"],"affiliations":[{"raw_affiliation_string":"IMEC, Leuven, Belgium","institution_ids":["https://openalex.org/I4210114974"]},{"raw_affiliation_string":"IMEC, Kapeldreef 75, 3001 Leuven Belgium,","institution_ids":["https://openalex.org/I4210114974"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5110160498","display_name":"Deniz Sabuncuoglu Tezcan","orcid":null},"institutions":[{"id":"https://openalex.org/I4210114974","display_name":"IMEC","ror":"https://ror.org/02kcbn207","country_code":"BE","type":"nonprofit","lineage":["https://openalex.org/I4210114974"]}],"countries":["BE"],"is_corresponding":false,"raw_author_name":"D. Sabuncuoglu Tezcan","raw_affiliation_strings":["IMEC, Leuven, Belgium","IMEC, Kapeldreef 75, 3001 Leuven Belgium,"],"affiliations":[{"raw_affiliation_string":"IMEC, Leuven, Belgium","institution_ids":["https://openalex.org/I4210114974"]},{"raw_affiliation_string":"IMEC, Kapeldreef 75, 3001 Leuven Belgium,","institution_ids":["https://openalex.org/I4210114974"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5085322922","display_name":"Harold Philipsen","orcid":"https://orcid.org/0000-0002-5029-1104"},"institutions":[{"id":"https://openalex.org/I4210114974","display_name":"IMEC","ror":"https://ror.org/02kcbn207","country_code":"BE","type":"nonprofit","lineage":["https://openalex.org/I4210114974"]}],"countries":["BE"],"is_corresponding":false,"raw_author_name":"H.G.G. Philipsen","raw_affiliation_strings":["IMEC, Leuven, Belgium","IMEC, Kapeldreef 75, 3001 Leuven Belgium,"],"affiliations":[{"raw_affiliation_string":"IMEC, Leuven, Belgium","institution_ids":["https://openalex.org/I4210114974"]},{"raw_affiliation_string":"IMEC, Kapeldreef 75, 3001 Leuven Belgium,","institution_ids":["https://openalex.org/I4210114974"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5057759792","display_name":"Patrick Jaenen","orcid":null},"institutions":[{"id":"https://openalex.org/I4210114974","display_name":"IMEC","ror":"https://ror.org/02kcbn207","country_code":"BE","type":"nonprofit","lineage":["https://openalex.org/I4210114974"]}],"countries":["BE"],"is_corresponding":false,"raw_author_name":"P. Jaenen","raw_affiliation_strings":["IMEC, Leuven, Belgium","IMEC, Kapeldreef 75, 3001 Leuven Belgium,"],"affiliations":[{"raw_affiliation_string":"IMEC, Leuven, Belgium","institution_ids":["https://openalex.org/I4210114974"]},{"raw_affiliation_string":"IMEC, Kapeldreef 75, 3001 Leuven Belgium,","institution_ids":["https://openalex.org/I4210114974"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5108409372","display_name":"Rahul Agarwal","orcid":"https://orcid.org/0009-0002-9963-3889"},"institutions":[{"id":"https://openalex.org/I4210114974","display_name":"IMEC","ror":"https://ror.org/02kcbn207","country_code":"BE","type":"nonprofit","lineage":["https://openalex.org/I4210114974"]}],"countries":["BE"],"is_corresponding":false,"raw_author_name":"R. Agarwal","raw_affiliation_strings":["IMEC, Leuven, Belgium","IMEC, Kapeldreef 75, 3001 Leuven Belgium,"],"affiliations":[{"raw_affiliation_string":"IMEC, Leuven, Belgium","institution_ids":["https://openalex.org/I4210114974"]},{"raw_affiliation_string":"IMEC, Kapeldreef 75, 3001 Leuven Belgium,","institution_ids":["https://openalex.org/I4210114974"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5102801389","display_name":"Fabrice Duval","orcid":"https://orcid.org/0000-0001-7652-6402"},"institutions":[{"id":"https://openalex.org/I4210114974","display_name":"IMEC","ror":"https://ror.org/02kcbn207","country_code":"BE","type":"nonprofit","lineage":["https://openalex.org/I4210114974"]}],"countries":["BE"],"is_corresponding":false,"raw_author_name":"F. Duval","raw_affiliation_strings":["IMEC, Leuven, Belgium","IMEC, Kapeldreef 75, 3001 Leuven Belgium,"],"affiliations":[{"raw_affiliation_string":"IMEC, Leuven, Belgium","institution_ids":["https://openalex.org/I4210114974"]},{"raw_affiliation_string":"IMEC, Kapeldreef 75, 3001 Leuven Belgium,","institution_ids":["https://openalex.org/I4210114974"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5083011814","display_name":"Philippe Soussan","orcid":"https://orcid.org/0000-0002-1347-6978"},"institutions":[{"id":"https://openalex.org/I4210114974","display_name":"IMEC","ror":"https://ror.org/02kcbn207","country_code":"BE","type":"nonprofit","lineage":["https://openalex.org/I4210114974"]}],"countries":["BE"],"is_corresponding":false,"raw_author_name":"P. Soussan","raw_affiliation_strings":["IMEC, Leuven, Belgium","IMEC, Kapeldreef 75, 3001 Leuven Belgium,"],"affiliations":[{"raw_affiliation_string":"IMEC, Leuven, Belgium","institution_ids":["https://openalex.org/I4210114974"]},{"raw_affiliation_string":"IMEC, Kapeldreef 75, 3001 Leuven Belgium,","institution_ids":["https://openalex.org/I4210114974"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5016839480","display_name":"Youssef Travaly","orcid":null},"institutions":[{"id":"https://openalex.org/I4210114974","display_name":"IMEC","ror":"https://ror.org/02kcbn207","country_code":"BE","type":"nonprofit","lineage":["https://openalex.org/I4210114974"]}],"countries":["BE"],"is_corresponding":false,"raw_author_name":"Y. Travaly","raw_affiliation_strings":["IMEC, Leuven, Belgium","IMEC, Kapeldreef 75, 3001 Leuven Belgium,"],"affiliations":[{"raw_affiliation_string":"IMEC, Leuven, Belgium","institution_ids":["https://openalex.org/I4210114974"]},{"raw_affiliation_string":"IMEC, Kapeldreef 75, 3001 Leuven Belgium,","institution_ids":["https://openalex.org/I4210114974"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5051712390","display_name":"Eric Beyne","orcid":"https://orcid.org/0000-0002-3096-050X"},"institutions":[{"id":"https://openalex.org/I4210114974","display_name":"IMEC","ror":"https://ror.org/02kcbn207","country_code":"BE","type":"nonprofit","lineage":["https://openalex.org/I4210114974"]}],"countries":["BE"],"is_corresponding":false,"raw_author_name":"E. Beyne","raw_affiliation_strings":["IMEC, Leuven, Belgium","IMEC, Kapeldreef 75, 3001 Leuven Belgium,"],"affiliations":[{"raw_affiliation_string":"IMEC, Leuven, Belgium","institution_ids":["https://openalex.org/I4210114974"]},{"raw_affiliation_string":"IMEC, Kapeldreef 75, 3001 Leuven Belgium,","institution_ids":["https://openalex.org/I4210114974"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":9,"corresponding_author_ids":["https://openalex.org/A5048147021"],"corresponding_institution_ids":["https://openalex.org/I4210114974"],"apc_list":null,"apc_paid":null,"fwci":4.4861,"has_fulltext":false,"cited_by_count":27,"citation_normalized_percentile":{"value":0.94430903,"is_in_top_1_percent":false,"is_in_top_10_percent":true},"cited_by_percentile_year":{"min":90,"max":99},"biblio":{"volume":null,"issue":null,"first_page":"1","last_page":"4"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.9973999857902527,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10783","display_name":"Additive Manufacturing and 3D Printing Technologies","score":0.9944999814033508,"subfield":{"id":"https://openalex.org/subfields/2203","display_name":"Automotive Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/bumping","display_name":"Bumping","score":0.926105260848999},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.8310755491256714},{"id":"https://openalex.org/keywords/wafer","display_name":"Wafer","score":0.7157566547393799},{"id":"https://openalex.org/keywords/through-silicon-via","display_name":"Through-silicon via","score":0.658201277256012},{"id":"https://openalex.org/keywords/stacking","display_name":"Stacking","score":0.5948728322982788},{"id":"https://openalex.org/keywords/wafer-level-packaging","display_name":"Wafer-level packaging","score":0.5915188789367676},{"id":"https://openalex.org/keywords/interconnection","display_name":"Interconnection","score":0.5566591620445251},{"id":"https://openalex.org/keywords/stack","display_name":"Stack (abstract data type)","score":0.5499765276908875},{"id":"https://openalex.org/keywords/copper","display_name":"Copper","score":0.508522629737854},{"id":"https://openalex.org/keywords/polymer","display_name":"Polymer","score":0.49999117851257324},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.49749425053596497},{"id":"https://openalex.org/keywords/die","display_name":"Die (integrated circuit)","score":0.4775474965572357},{"id":"https://openalex.org/keywords/deep-reactive-ion-etching","display_name":"Deep reactive-ion etching","score":0.44633376598358154},{"id":"https://openalex.org/keywords/copper-interconnect","display_name":"Copper interconnect","score":0.42979300022125244},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.3907630145549774},{"id":"https://openalex.org/keywords/etching","display_name":"Etching (microfabrication)","score":0.36948150396347046},{"id":"https://openalex.org/keywords/composite-material","display_name":"Composite material","score":0.35903072357177734},{"id":"https://openalex.org/keywords/dielectric","display_name":"Dielectric","score":0.32332146167755127},{"id":"https://openalex.org/keywords/layer","display_name":"Layer (electronics)","score":0.2171953022480011},{"id":"https://openalex.org/keywords/metallurgy","display_name":"Metallurgy","score":0.20543953776359558},{"id":"https://openalex.org/keywords/mechanical-engineering","display_name":"Mechanical engineering","score":0.10298600792884827},{"id":"https://openalex.org/keywords/nanotechnology","display_name":"Nanotechnology","score":0.10203847289085388},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.0642290711402893},{"id":"https://openalex.org/keywords/reactive-ion-etching","display_name":"Reactive-ion etching","score":0.061386436223983765},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.05910384654998779}],"concepts":[{"id":"https://openalex.org/C2776512755","wikidata":"https://www.wikidata.org/wiki/Q632543","display_name":"Bumping","level":2,"score":0.926105260848999},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.8310755491256714},{"id":"https://openalex.org/C160671074","wikidata":"https://www.wikidata.org/wiki/Q267131","display_name":"Wafer","level":2,"score":0.7157566547393799},{"id":"https://openalex.org/C45632049","wikidata":"https://www.wikidata.org/wiki/Q1578120","display_name":"Through-silicon via","level":3,"score":0.658201277256012},{"id":"https://openalex.org/C33347731","wikidata":"https://www.wikidata.org/wiki/Q285210","display_name":"Stacking","level":2,"score":0.5948728322982788},{"id":"https://openalex.org/C2780288131","wikidata":"https://www.wikidata.org/wiki/Q4017648","display_name":"Wafer-level packaging","level":3,"score":0.5915188789367676},{"id":"https://openalex.org/C123745756","wikidata":"https://www.wikidata.org/wiki/Q1665949","display_name":"Interconnection","level":2,"score":0.5566591620445251},{"id":"https://openalex.org/C9395851","wikidata":"https://www.wikidata.org/wiki/Q177929","display_name":"Stack (abstract data type)","level":2,"score":0.5499765276908875},{"id":"https://openalex.org/C544778455","wikidata":"https://www.wikidata.org/wiki/Q753","display_name":"Copper","level":2,"score":0.508522629737854},{"id":"https://openalex.org/C521977710","wikidata":"https://www.wikidata.org/wiki/Q81163","display_name":"Polymer","level":2,"score":0.49999117851257324},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.49749425053596497},{"id":"https://openalex.org/C111106434","wikidata":"https://www.wikidata.org/wiki/Q1072430","display_name":"Die (integrated circuit)","level":2,"score":0.4775474965572357},{"id":"https://openalex.org/C124634506","wikidata":"https://www.wikidata.org/wiki/Q486936","display_name":"Deep reactive-ion etching","level":5,"score":0.44633376598358154},{"id":"https://openalex.org/C116372231","wikidata":"https://www.wikidata.org/wiki/Q605757","display_name":"Copper interconnect","level":3,"score":0.42979300022125244},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.3907630145549774},{"id":"https://openalex.org/C100460472","wikidata":"https://www.wikidata.org/wiki/Q2368605","display_name":"Etching (microfabrication)","level":3,"score":0.36948150396347046},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.35903072357177734},{"id":"https://openalex.org/C133386390","wikidata":"https://www.wikidata.org/wiki/Q184996","display_name":"Dielectric","level":2,"score":0.32332146167755127},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.2171953022480011},{"id":"https://openalex.org/C191897082","wikidata":"https://www.wikidata.org/wiki/Q11467","display_name":"Metallurgy","level":1,"score":0.20543953776359558},{"id":"https://openalex.org/C78519656","wikidata":"https://www.wikidata.org/wiki/Q101333","display_name":"Mechanical engineering","level":1,"score":0.10298600792884827},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.10203847289085388},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.0642290711402893},{"id":"https://openalex.org/C130472188","wikidata":"https://www.wikidata.org/wiki/Q1640159","display_name":"Reactive-ion etching","level":4,"score":0.061386436223983765},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.05910384654998779},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.0},{"id":"https://openalex.org/C46141821","wikidata":"https://www.wikidata.org/wiki/Q209402","display_name":"Nuclear magnetic resonance","level":1,"score":0.0},{"id":"https://openalex.org/C199360897","wikidata":"https://www.wikidata.org/wiki/Q9143","display_name":"Programming language","level":1,"score":0.0},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/3dic.2009.5306559","is_oa":false,"landing_page_url":"https://doi.org/10.1109/3dic.2009.5306559","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2009 IEEE International Conference on 3D System Integration","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"score":0.4300000071525574,"id":"https://metadata.un.org/sdg/7","display_name":"Affordable and clean energy"}],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":8,"referenced_works":["https://openalex.org/W2034975188","https://openalex.org/W2035692976","https://openalex.org/W2057259846","https://openalex.org/W2100541740","https://openalex.org/W2154133941","https://openalex.org/W2315569794","https://openalex.org/W2538968752","https://openalex.org/W4285719527"],"related_works":["https://openalex.org/W2035020980","https://openalex.org/W4390098483","https://openalex.org/W2808659170","https://openalex.org/W2026226429","https://openalex.org/W2213778680","https://openalex.org/W2169300790","https://openalex.org/W2514629641","https://openalex.org/W2256021398","https://openalex.org/W2385943769","https://openalex.org/W1993400043"],"abstract_inverted_index":{"In":[0],"this":[1],"study,":[2],"we":[3],"report":[4],"on":[5,23],"the":[6,9,37,51,87],"processing":[7],"and":[8,41,59,68,77,108],"electrical":[10],"characterization":[11],"of":[12,86],"a":[13,18,45,78,82,109],"3D-WLP":[14],"TSV":[15,38,49,67,88,112],"flow,":[16],"using":[17],"polymer-isolated,":[19],"Cu-filled":[20],"TSV,":[21,94,107],"realized":[22],"thinned":[24,60],"wafers":[25,53],"bonded":[26,55],"to":[27,56,62],"temporary":[28,57],"carriers.":[29],"A":[30],"Cu/Sn":[31],"microbump":[32,69],"structure":[33,89],"is":[34],"integrated":[35],"in":[36],"process":[39,70],"flow":[40],"used":[42],"for":[43],"realizing":[44],"two-die":[46],"stack.":[47],"Before":[48],"processing,":[50],"Si":[52],"are":[54],"carriers":[58],"down":[61],"50":[63,104],"mum.":[64],"The":[65,84],"actual":[66],"uses":[71],"3":[72],"masks,":[73],"two":[74],"Si-DRIE":[75],"steps":[76],"polymer":[79,98],"liner":[80],"as":[81],"dielectric.":[83],"dimensions":[85],"are:":[90],"35":[91],"mum":[92,96,101,105,111],"Oslash":[93,102],"5":[95],"thick":[97],"liner,":[99],"25":[100],"Cu,":[103],"deep":[106],"60":[110],"pitch.":[113]},"counts_by_year":[{"year":2019,"cited_by_count":1},{"year":2018,"cited_by_count":1},{"year":2016,"cited_by_count":4},{"year":2015,"cited_by_count":2},{"year":2014,"cited_by_count":2},{"year":2013,"cited_by_count":2},{"year":2012,"cited_by_count":6}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}