{"id":"https://openalex.org/W1996169234","doi":"https://doi.org/10.1109/3dic.2009.5306548","title":"Development of wafer thinning and dicing technology for thin wafer","display_name":"Development of wafer thinning and dicing technology for thin wafer","publication_year":2009,"publication_date":"2009-09-01","ids":{"openalex":"https://openalex.org/W1996169234","doi":"https://doi.org/10.1109/3dic.2009.5306548","mag":"1996169234"},"language":"en","primary_location":{"id":"doi:10.1109/3dic.2009.5306548","is_oa":false,"landing_page_url":"https://doi.org/10.1109/3dic.2009.5306548","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2009 IEEE International Conference on 3D System Integration","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5058985786","display_name":"Chuichi Miyazaki","orcid":null},"institutions":[{"id":"https://openalex.org/I75636454","display_name":"Renesas Electronics (United States)","ror":"https://ror.org/014775w70","country_code":"US","type":"company","lineage":["https://openalex.org/I4210153176","https://openalex.org/I75636454"]},{"id":"https://openalex.org/I4210127336","display_name":"Association of Super-Advanced Electronics","ror":"https://ror.org/0292ym357","country_code":"JP","type":"other","lineage":["https://openalex.org/I4210127336"]}],"countries":["JP","US"],"is_corresponding":true,"raw_author_name":"Chuichi Miyazaki","raw_affiliation_strings":["Association of Super-Advanced Electronics Technology (ASET), Renesas Technology Corporation, Kodaira, Tokyo, Japan","Association of Super-Advanced Electronics Technology (ASET), Renesas Technology Corp., 20-1, Josuihon-cho 5-chome, Kodaira-shi, Tokyo 187-8588, Japan"],"affiliations":[{"raw_affiliation_string":"Association of Super-Advanced Electronics Technology (ASET), Renesas Technology Corporation, Kodaira, Tokyo, Japan","institution_ids":["https://openalex.org/I4210127336"]},{"raw_affiliation_string":"Association of Super-Advanced Electronics Technology (ASET), Renesas Technology Corp., 20-1, Josuihon-cho 5-chome, Kodaira-shi, Tokyo 187-8588, Japan","institution_ids":["https://openalex.org/I75636454"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5009930574","display_name":"H. Shimamoto","orcid":"https://orcid.org/0000-0002-4594-0261"},"institutions":[{"id":"https://openalex.org/I4210127336","display_name":"Association of Super-Advanced Electronics","ror":"https://ror.org/0292ym357","country_code":"JP","type":"other","lineage":["https://openalex.org/I4210127336"]},{"id":"https://openalex.org/I75636454","display_name":"Renesas Electronics (United States)","ror":"https://ror.org/014775w70","country_code":"US","type":"company","lineage":["https://openalex.org/I4210153176","https://openalex.org/I75636454"]}],"countries":["JP","US"],"is_corresponding":false,"raw_author_name":"Haruo Shimamoto","raw_affiliation_strings":["Association of Super-Advanced Electronics Technology (ASET), Renesas Technology Corporation, Kodaira, Tokyo, Japan","Association of Super-Advanced Electronics Technology (ASET), Renesas Technology Corp., 20-1, Josuihon-cho 5-chome, Kodaira-shi, Tokyo 187-8588, Japan"],"affiliations":[{"raw_affiliation_string":"Association of Super-Advanced Electronics Technology (ASET), Renesas Technology Corporation, Kodaira, Tokyo, Japan","institution_ids":["https://openalex.org/I4210127336"]},{"raw_affiliation_string":"Association of Super-Advanced Electronics Technology (ASET), Renesas Technology Corp., 20-1, Josuihon-cho 5-chome, Kodaira-shi, Tokyo 187-8588, Japan","institution_ids":["https://openalex.org/I75636454"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5024874736","display_name":"Toshihide Uematsu","orcid":null},"institutions":[{"id":"https://openalex.org/I75636454","display_name":"Renesas Electronics (United States)","ror":"https://ror.org/014775w70","country_code":"US","type":"company","lineage":["https://openalex.org/I4210153176","https://openalex.org/I75636454"]},{"id":"https://openalex.org/I4210127336","display_name":"Association of Super-Advanced Electronics","ror":"https://ror.org/0292ym357","country_code":"JP","type":"other","lineage":["https://openalex.org/I4210127336"]}],"countries":["JP","US"],"is_corresponding":false,"raw_author_name":"Toshihide Uematsu","raw_affiliation_strings":["Association of Super-Advanced Electronics Technology (ASET), Renesas Technology Corporation, Kodaira, Tokyo, Japan","Association of Super-Advanced Electronics Technology (ASET), Renesas Technology Corp., 20-1, Josuihon-cho 5-chome, Kodaira-shi, Tokyo 187-8588, Japan"],"affiliations":[{"raw_affiliation_string":"Association of Super-Advanced Electronics Technology (ASET), Renesas Technology Corporation, Kodaira, Tokyo, Japan","institution_ids":["https://openalex.org/I4210127336"]},{"raw_affiliation_string":"Association of Super-Advanced Electronics Technology (ASET), Renesas Technology Corp., 20-1, Josuihon-cho 5-chome, Kodaira-shi, Tokyo 187-8588, Japan","institution_ids":["https://openalex.org/I75636454"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5019146200","display_name":"Yoshiyuki Abe","orcid":"https://orcid.org/0000-0002-6756-7525"},"institutions":[{"id":"https://openalex.org/I4210127336","display_name":"Association of Super-Advanced Electronics","ror":"https://ror.org/0292ym357","country_code":"JP","type":"other","lineage":["https://openalex.org/I4210127336"]},{"id":"https://openalex.org/I75636454","display_name":"Renesas Electronics (United States)","ror":"https://ror.org/014775w70","country_code":"US","type":"company","lineage":["https://openalex.org/I4210153176","https://openalex.org/I75636454"]}],"countries":["JP","US"],"is_corresponding":false,"raw_author_name":"Yoshiyuki Abe","raw_affiliation_strings":["Association of Super-Advanced Electronics Technology (ASET), Renesas Technology Corporation, Kodaira, Tokyo, Japan","Association of Super-Advanced Electronics Technology (ASET), Renesas Technology Corp., 20-1, Josuihon-cho 5-chome, Kodaira-shi, Tokyo 187-8588, Japan"],"affiliations":[{"raw_affiliation_string":"Association of Super-Advanced Electronics Technology (ASET), Renesas Technology Corporation, Kodaira, Tokyo, Japan","institution_ids":["https://openalex.org/I4210127336"]},{"raw_affiliation_string":"Association of Super-Advanced Electronics Technology (ASET), Renesas Technology Corp., 20-1, Josuihon-cho 5-chome, Kodaira-shi, Tokyo 187-8588, Japan","institution_ids":["https://openalex.org/I75636454"]}]}],"institutions":[],"countries_distinct_count":2,"institutions_distinct_count":4,"corresponding_author_ids":["https://openalex.org/A5058985786"],"corresponding_institution_ids":["https://openalex.org/I4210127336","https://openalex.org/I75636454"],"apc_list":null,"apc_paid":null,"fwci":1.415,"has_fulltext":false,"cited_by_count":19,"citation_normalized_percentile":{"value":0.80313956,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":97},"biblio":{"volume":null,"issue":null,"first_page":"1","last_page":"4"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11301","display_name":"Advanced Surface Polishing Techniques","score":0.9452000260353088,"subfield":{"id":"https://openalex.org/subfields/2204","display_name":"Biomedical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11301","display_name":"Advanced Surface Polishing Techniques","score":0.9452000260353088,"subfield":{"id":"https://openalex.org/subfields/2204","display_name":"Biomedical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.9404000043869019,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/wafer-dicing","display_name":"Wafer dicing","score":0.9944534301757812},{"id":"https://openalex.org/keywords/wafer","display_name":"Wafer","score":0.8689930438995361},{"id":"https://openalex.org/keywords/grinding","display_name":"Grinding","score":0.7803351879119873},{"id":"https://openalex.org/keywords/die-preparation","display_name":"Die preparation","score":0.7705814838409424},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.7049577236175537},{"id":"https://openalex.org/keywords/wafer-backgrinding","display_name":"Wafer backgrinding","score":0.6140247583389282},{"id":"https://openalex.org/keywords/adhesive","display_name":"Adhesive","score":0.5509176254272461},{"id":"https://openalex.org/keywords/composite-material","display_name":"Composite material","score":0.4959481656551361},{"id":"https://openalex.org/keywords/breakage","display_name":"Breakage","score":0.46830594539642334},{"id":"https://openalex.org/keywords/wafer-testing","display_name":"Wafer testing","score":0.45962584018707275},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.18295851349830627}],"concepts":[{"id":"https://openalex.org/C165013422","wikidata":"https://www.wikidata.org/wiki/Q4388382","display_name":"Wafer dicing","level":3,"score":0.9944534301757812},{"id":"https://openalex.org/C160671074","wikidata":"https://www.wikidata.org/wiki/Q267131","display_name":"Wafer","level":2,"score":0.8689930438995361},{"id":"https://openalex.org/C2777571299","wikidata":"https://www.wikidata.org/wiki/Q3680646","display_name":"Grinding","level":2,"score":0.7803351879119873},{"id":"https://openalex.org/C126355924","wikidata":"https://www.wikidata.org/wiki/Q5274495","display_name":"Die preparation","level":4,"score":0.7705814838409424},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.7049577236175537},{"id":"https://openalex.org/C8002213","wikidata":"https://www.wikidata.org/wiki/Q7959420","display_name":"Wafer backgrinding","level":4,"score":0.6140247583389282},{"id":"https://openalex.org/C68928338","wikidata":"https://www.wikidata.org/wiki/Q131790","display_name":"Adhesive","level":3,"score":0.5509176254272461},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.4959481656551361},{"id":"https://openalex.org/C2779015675","wikidata":"https://www.wikidata.org/wiki/Q92796261","display_name":"Breakage","level":2,"score":0.46830594539642334},{"id":"https://openalex.org/C44445679","wikidata":"https://www.wikidata.org/wiki/Q2538844","display_name":"Wafer testing","level":3,"score":0.45962584018707275},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.18295851349830627},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/3dic.2009.5306548","is_oa":false,"landing_page_url":"https://doi.org/10.1109/3dic.2009.5306548","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2009 IEEE International Conference on 3D System Integration","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"id":"https://metadata.un.org/sdg/8","display_name":"Decent work and economic growth","score":0.5400000214576721}],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":1,"referenced_works":["https://openalex.org/W2946365928"],"related_works":["https://openalex.org/W2225364252","https://openalex.org/W2168348385","https://openalex.org/W2075893297","https://openalex.org/W2120004137","https://openalex.org/W4241750334","https://openalex.org/W327425532","https://openalex.org/W2091770406","https://openalex.org/W2284582153","https://openalex.org/W1721175952","https://openalex.org/W1597893721"],"abstract_inverted_index":{"Various":[0],"stress":[1],"relief":[2],"and":[3,17,28,42],"dicing":[4,41],"methods":[5],"are":[6,22],"evaluated":[7],"for":[8,26,38,57],"10":[9],"to":[10,48,62],"30":[11],"mum":[12],"wafer":[13,31],"thickness.":[14],"DP(Dry":[15],"Polish)":[16],"CMG":[18],"(Chemical":[19],"Mechanical":[20],"Grinding)":[21,46],"the":[23,39,49,64],"best":[24],"solution":[25],"productivity":[27],"quality":[29],"in":[30,53],"thinning.":[32],"Highest":[33],"die":[34],"strength":[35,67],"is":[36,60],"achieved":[37],"blade":[40],"DBG":[43],"(Dicing":[44],"Before":[45],"due":[47],"decreased":[50],"backside":[51],"chipping":[52],"thin":[54],"wafer.":[55],"As":[56],"DBG,":[58],"it":[59],"necessary":[61],"improve":[63],"resin":[65],"adhesive":[66],"of":[68],"H-WSS":[69],"(Hard":[70],"Wafer":[71],"Support":[72],"System).":[73]},"counts_by_year":[{"year":2025,"cited_by_count":1},{"year":2021,"cited_by_count":1},{"year":2020,"cited_by_count":1},{"year":2018,"cited_by_count":1},{"year":2017,"cited_by_count":2},{"year":2016,"cited_by_count":1},{"year":2015,"cited_by_count":3},{"year":2014,"cited_by_count":2},{"year":2013,"cited_by_count":1},{"year":2012,"cited_by_count":3}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}