{"id":"https://openalex.org/W2153957768","doi":"https://doi.org/10.1109/3dic.2009.5306536","title":"Wafer Thickness Sensor (WTS) for etch depth measurement of TSV","display_name":"Wafer Thickness Sensor (WTS) for etch depth measurement of TSV","publication_year":2009,"publication_date":"2009-09-01","ids":{"openalex":"https://openalex.org/W2153957768","doi":"https://doi.org/10.1109/3dic.2009.5306536","mag":"2153957768"},"language":"en","primary_location":{"id":"doi:10.1109/3dic.2009.5306536","is_oa":false,"landing_page_url":"https://doi.org/10.1109/3dic.2009.5306536","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2009 IEEE International Conference on 3D System Integration","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5071121429","display_name":"David Marx","orcid":null},"institutions":[{"id":"https://openalex.org/I912377674","display_name":"Newbury College","ror":"https://ror.org/01g4a4162","country_code":"US","type":"education","lineage":["https://openalex.org/I912377674"]}],"countries":["US"],"is_corresponding":true,"raw_author_name":"David Marx","raw_affiliation_strings":["Tamar Technology, Inc., Newbury Park, CA, USA"],"affiliations":[{"raw_affiliation_string":"Tamar Technology, Inc., Newbury Park, CA, USA","institution_ids":["https://openalex.org/I912377674"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5037520794","display_name":"David Grant","orcid":"https://orcid.org/0000-0003-4584-1498"},"institutions":[{"id":"https://openalex.org/I912377674","display_name":"Newbury College","ror":"https://ror.org/01g4a4162","country_code":"US","type":"education","lineage":["https://openalex.org/I912377674"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"David Grant","raw_affiliation_strings":["Tamar Technology, Inc., Newbury Park, CA, USA"],"affiliations":[{"raw_affiliation_string":"Tamar Technology, Inc., Newbury Park, CA, USA","institution_ids":["https://openalex.org/I912377674"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5038381702","display_name":"Russ Dudley","orcid":null},"institutions":[{"id":"https://openalex.org/I912377674","display_name":"Newbury College","ror":"https://ror.org/01g4a4162","country_code":"US","type":"education","lineage":["https://openalex.org/I912377674"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Russ Dudley","raw_affiliation_strings":["Tamar Technology, Inc., Newbury Park, CA, USA"],"affiliations":[{"raw_affiliation_string":"Tamar Technology, Inc., Newbury Park, CA, USA","institution_ids":["https://openalex.org/I912377674"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5017291432","display_name":"Andy Rudack","orcid":null},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Andy Rudack","raw_affiliation_strings":["IETR, SEMATECH, Albany, NY, USA"],"affiliations":[{"raw_affiliation_string":"IETR, SEMATECH, Albany, NY, USA","institution_ids":[]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5029203965","display_name":"W. H. Teh","orcid":"https://orcid.org/0000-0003-2935-1886"},"institutions":[{"id":"https://openalex.org/I1343180700","display_name":"Intel (United States)","ror":"https://ror.org/01ek73717","country_code":"US","type":"company","lineage":["https://openalex.org/I1343180700"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"W. H. Teh","raw_affiliation_strings":["IETR, SEMATECH, Albany, NY, USA","Technology and Manufacturing Group, Intel Corporation, Hillsboro, OR, USA"],"affiliations":[{"raw_affiliation_string":"IETR, SEMATECH, Albany, NY, USA","institution_ids":[]},{"raw_affiliation_string":"Technology and Manufacturing Group, Intel Corporation, Hillsboro, OR, USA","institution_ids":["https://openalex.org/I1343180700"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":5,"corresponding_author_ids":["https://openalex.org/A5071121429"],"corresponding_institution_ids":["https://openalex.org/I912377674"],"apc_list":null,"apc_paid":null,"fwci":1.1963,"has_fulltext":false,"cited_by_count":16,"citation_normalized_percentile":{"value":0.81637496,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":97},"biblio":{"volume":null,"issue":null,"first_page":"1","last_page":"5"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.9998000264167786,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.9998000264167786,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11338","display_name":"Advancements in Photolithography Techniques","score":0.9991999864578247,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T14117","display_name":"Integrated Circuits and Semiconductor Failure Analysis","score":0.9984999895095825,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/wafer","display_name":"Wafer","score":0.8543169498443604},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.748113214969635},{"id":"https://openalex.org/keywords/etching","display_name":"Etching (microfabrication)","score":0.6703046560287476},{"id":"https://openalex.org/keywords/through-silicon-via","display_name":"Through-silicon via","score":0.6270200610160828},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.5057823657989502},{"id":"https://openalex.org/keywords/throughput","display_name":"Throughput","score":0.4859517812728882},{"id":"https://openalex.org/keywords/process","display_name":"Process (computing)","score":0.4792482852935791},{"id":"https://openalex.org/keywords/repeatability","display_name":"Repeatability","score":0.4745817184448242},{"id":"https://openalex.org/keywords/metrology","display_name":"Metrology","score":0.4741363227367401},{"id":"https://openalex.org/keywords/volume","display_name":"Volume (thermodynamics)","score":0.45774975419044495},{"id":"https://openalex.org/keywords/aspect-ratio","display_name":"Aspect ratio (aeronautics)","score":0.43377673625946045},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.3459551930427551},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.18512776494026184},{"id":"https://openalex.org/keywords/nanotechnology","display_name":"Nanotechnology","score":0.17095625400543213},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.14247465133666992},{"id":"https://openalex.org/keywords/optics","display_name":"Optics","score":0.1401829719543457}],"concepts":[{"id":"https://openalex.org/C160671074","wikidata":"https://www.wikidata.org/wiki/Q267131","display_name":"Wafer","level":2,"score":0.8543169498443604},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.748113214969635},{"id":"https://openalex.org/C100460472","wikidata":"https://www.wikidata.org/wiki/Q2368605","display_name":"Etching (microfabrication)","level":3,"score":0.6703046560287476},{"id":"https://openalex.org/C45632049","wikidata":"https://www.wikidata.org/wiki/Q1578120","display_name":"Through-silicon via","level":3,"score":0.6270200610160828},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.5057823657989502},{"id":"https://openalex.org/C157764524","wikidata":"https://www.wikidata.org/wiki/Q1383412","display_name":"Throughput","level":3,"score":0.4859517812728882},{"id":"https://openalex.org/C98045186","wikidata":"https://www.wikidata.org/wiki/Q205663","display_name":"Process (computing)","level":2,"score":0.4792482852935791},{"id":"https://openalex.org/C154020017","wikidata":"https://www.wikidata.org/wiki/Q520171","display_name":"Repeatability","level":2,"score":0.4745817184448242},{"id":"https://openalex.org/C195766429","wikidata":"https://www.wikidata.org/wiki/Q394","display_name":"Metrology","level":2,"score":0.4741363227367401},{"id":"https://openalex.org/C20556612","wikidata":"https://www.wikidata.org/wiki/Q4469374","display_name":"Volume (thermodynamics)","level":2,"score":0.45774975419044495},{"id":"https://openalex.org/C82558694","wikidata":"https://www.wikidata.org/wiki/Q1545619","display_name":"Aspect ratio (aeronautics)","level":2,"score":0.43377673625946045},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.3459551930427551},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.18512776494026184},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.17095625400543213},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.14247465133666992},{"id":"https://openalex.org/C120665830","wikidata":"https://www.wikidata.org/wiki/Q14620","display_name":"Optics","level":1,"score":0.1401829719543457},{"id":"https://openalex.org/C111919701","wikidata":"https://www.wikidata.org/wiki/Q9135","display_name":"Operating system","level":1,"score":0.0},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.0},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.0},{"id":"https://openalex.org/C62520636","wikidata":"https://www.wikidata.org/wiki/Q944","display_name":"Quantum mechanics","level":1,"score":0.0},{"id":"https://openalex.org/C555944384","wikidata":"https://www.wikidata.org/wiki/Q249","display_name":"Wireless","level":2,"score":0.0},{"id":"https://openalex.org/C185592680","wikidata":"https://www.wikidata.org/wiki/Q2329","display_name":"Chemistry","level":0,"score":0.0},{"id":"https://openalex.org/C43617362","wikidata":"https://www.wikidata.org/wiki/Q170050","display_name":"Chromatography","level":1,"score":0.0},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/3dic.2009.5306536","is_oa":false,"landing_page_url":"https://doi.org/10.1109/3dic.2009.5306536","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2009 IEEE International Conference on 3D System Integration","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"id":"https://metadata.un.org/sdg/9","score":0.5400000214576721,"display_name":"Industry, innovation and infrastructure"}],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":3,"referenced_works":["https://openalex.org/W2017046529","https://openalex.org/W2109753996","https://openalex.org/W2167750437"],"related_works":["https://openalex.org/W2774752550","https://openalex.org/W4288084846","https://openalex.org/W2893816048","https://openalex.org/W3168747143","https://openalex.org/W2315867670","https://openalex.org/W1968795594","https://openalex.org/W2237675924","https://openalex.org/W2755432716","https://openalex.org/W2001085980","https://openalex.org/W2108593541"],"abstract_inverted_index":{"The":[0,23],"wafer":[1],"thickness":[2],"sensor":[3,9],"(WTS)":[4],"is":[5],"an":[6,100],"optical,":[7],"non-destructive":[8],"that":[10],"directly":[11],"measures":[12],"the":[13,31,48,63,68,71],"etch":[14,128],"depth":[15,29,78],"of":[16,27,33,50,67,73,86,103],"vias,":[17,87,97],"without":[18],"regard":[19],"to":[20],"aspect":[21,101],"ratio.":[22],"high":[24,124],"throughput":[25],"measurements":[26],"via":[28],"after":[30],"etching":[32],"through":[34],"silicon":[35],"vias":[36,98],"(TSV)":[37],"will":[38],"allow":[39],"timely":[40],"feedback":[41],"for":[42,70,83,131],"process":[43,45,51,56,134],"control,":[44],"development,":[46],"and":[47,65,93,105,108,115],"prevention":[49],"excursions":[52],"in":[53],"3D":[54,132],"IC":[55,133],"technology.":[57,135],"In":[58],"this":[59],"paper,":[60],"we":[61],"report":[62],"capabilities":[64],"limitations":[66],"WTS":[69],"measurement":[72,79],"TSV":[74,127],"etched":[75],"depth.":[76],"Etch":[77],"results":[80],"are":[81],"presented":[82],"a":[84,119,123],"variety":[85],"including":[88],"1":[89],"mum,":[90,92],"3":[91],"5":[94],"mum":[95],"diameter":[96],"with":[99,118],"ratio":[102],"28:1,":[104],"both":[106],"isolated":[107],"densely":[109],"packed":[110],"vias.":[111],"Results":[112],"include":[113],"accuracy":[114],"repeatability":[116],"data,":[117],"route":[120],"towards":[121],"providing":[122],"volume":[125],"manufacturing":[126],"metrology":[129],"solution":[130]},"counts_by_year":[{"year":2025,"cited_by_count":1},{"year":2023,"cited_by_count":2},{"year":2019,"cited_by_count":1},{"year":2018,"cited_by_count":1},{"year":2015,"cited_by_count":1},{"year":2014,"cited_by_count":3},{"year":2013,"cited_by_count":3},{"year":2012,"cited_by_count":1}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}