{"id":"https://openalex.org/W2116358629","doi":"https://doi.org/10.1109/3dic.2009.5306533","title":"Low Cost of Ownership scalable copper Direct Bond Interconnect 3D IC technology for three dimensional integrated circuit applications","display_name":"Low Cost of Ownership scalable copper Direct Bond Interconnect 3D IC technology for three dimensional integrated circuit applications","publication_year":2009,"publication_date":"2009-09-01","ids":{"openalex":"https://openalex.org/W2116358629","doi":"https://doi.org/10.1109/3dic.2009.5306533","mag":"2116358629"},"language":"en","primary_location":{"id":"doi:10.1109/3dic.2009.5306533","is_oa":false,"landing_page_url":"https://doi.org/10.1109/3dic.2009.5306533","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2009 IEEE International Conference on 3D System Integration","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5016363737","display_name":"P.M. Enquist","orcid":"https://orcid.org/0000-0001-6542-331X"},"institutions":[{"id":"https://openalex.org/I174947986","display_name":"Flex (United States)","ror":"https://ror.org/03q7jt003","country_code":"US","type":"company","lineage":["https://openalex.org/I174947986"]}],"countries":["US"],"is_corresponding":true,"raw_author_name":"P. Enquist","raw_affiliation_strings":["Ziptronix, Inc., Morrisville, NC, USA","Ziptronix, Inc., Morrisville, NC, 27560, USA"],"affiliations":[{"raw_affiliation_string":"Ziptronix, Inc., Morrisville, NC, USA","institution_ids":["https://openalex.org/I174947986"]},{"raw_affiliation_string":"Ziptronix, Inc., Morrisville, NC, 27560, USA","institution_ids":["https://openalex.org/I174947986"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5016092488","display_name":"G. G. Fountain","orcid":null},"institutions":[{"id":"https://openalex.org/I174947986","display_name":"Flex (United States)","ror":"https://ror.org/03q7jt003","country_code":"US","type":"company","lineage":["https://openalex.org/I174947986"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"G. Fountain","raw_affiliation_strings":["Ziptronix, Inc., Morrisville, NC, USA","Ziptronix, Inc., Morrisville, NC, 27560, USA"],"affiliations":[{"raw_affiliation_string":"Ziptronix, Inc., Morrisville, NC, USA","institution_ids":["https://openalex.org/I174947986"]},{"raw_affiliation_string":"Ziptronix, Inc., Morrisville, NC, 27560, USA","institution_ids":["https://openalex.org/I174947986"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5012880948","display_name":"Carl Petteway","orcid":null},"institutions":[{"id":"https://openalex.org/I174947986","display_name":"Flex (United States)","ror":"https://ror.org/03q7jt003","country_code":"US","type":"company","lineage":["https://openalex.org/I174947986"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"C. Petteway","raw_affiliation_strings":["Ziptronix, Inc., Morrisville, NC, USA","Ziptronix, Inc., Morrisville, NC, 27560, USA"],"affiliations":[{"raw_affiliation_string":"Ziptronix, Inc., Morrisville, NC, USA","institution_ids":["https://openalex.org/I174947986"]},{"raw_affiliation_string":"Ziptronix, Inc., Morrisville, NC, 27560, USA","institution_ids":["https://openalex.org/I174947986"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5072128068","display_name":"Allen Hollingsworth","orcid":null},"institutions":[{"id":"https://openalex.org/I174947986","display_name":"Flex (United States)","ror":"https://ror.org/03q7jt003","country_code":"US","type":"company","lineage":["https://openalex.org/I174947986"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"A. Hollingsworth","raw_affiliation_strings":["Ziptronix, Inc., Morrisville, NC, USA","Ziptronix, Inc., Morrisville, NC, 27560, USA"],"affiliations":[{"raw_affiliation_string":"Ziptronix, Inc., Morrisville, NC, USA","institution_ids":["https://openalex.org/I174947986"]},{"raw_affiliation_string":"Ziptronix, Inc., Morrisville, NC, 27560, USA","institution_ids":["https://openalex.org/I174947986"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5008474750","display_name":"H. Grady","orcid":null},"institutions":[{"id":"https://openalex.org/I174947986","display_name":"Flex (United States)","ror":"https://ror.org/03q7jt003","country_code":"US","type":"company","lineage":["https://openalex.org/I174947986"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"H. Grady","raw_affiliation_strings":["Ziptronix, Inc., Morrisville, NC, USA","Ziptronix, Inc., Morrisville, NC, 27560, USA"],"affiliations":[{"raw_affiliation_string":"Ziptronix, Inc., Morrisville, NC, USA","institution_ids":["https://openalex.org/I174947986"]},{"raw_affiliation_string":"Ziptronix, Inc., Morrisville, NC, 27560, USA","institution_ids":["https://openalex.org/I174947986"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":5,"corresponding_author_ids":["https://openalex.org/A5016363737"],"corresponding_institution_ids":["https://openalex.org/I174947986"],"apc_list":null,"apc_paid":null,"fwci":5.6824,"has_fulltext":false,"cited_by_count":121,"citation_normalized_percentile":{"value":0.96252812,"is_in_top_1_percent":false,"is_in_top_10_percent":true},"cited_by_percentile_year":{"min":97,"max":99},"biblio":{"volume":null,"issue":null,"first_page":"1","last_page":"6"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.9991000294685364,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11661","display_name":"Copper Interconnects and Reliability","score":0.9987999796867371,"subfield":{"id":"https://openalex.org/subfields/2504","display_name":"Electronic, Optical and Magnetic Materials"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/interconnection","display_name":"Interconnection","score":0.7744755744934082},{"id":"https://openalex.org/keywords/copper","display_name":"Copper","score":0.6382449269294739},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.5754279494285583},{"id":"https://openalex.org/keywords/copper-interconnect","display_name":"Copper interconnect","score":0.5586099028587341},{"id":"https://openalex.org/keywords/scalability","display_name":"Scalability","score":0.5538788437843323},{"id":"https://openalex.org/keywords/integrated-circuit","display_name":"Integrated circuit","score":0.5122663378715515},{"id":"https://openalex.org/keywords/temperature-cycling","display_name":"Temperature cycling","score":0.49151143431663513},{"id":"https://openalex.org/keywords/leverage","display_name":"Leverage (statistics)","score":0.4575258195400238},{"id":"https://openalex.org/keywords/three-dimensional-integrated-circuit","display_name":"Three-dimensional integrated circuit","score":0.45624274015426636},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.4293123185634613},{"id":"https://openalex.org/keywords/integrated-circuit-packaging","display_name":"Integrated circuit packaging","score":0.4173007011413574},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.34475576877593994},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.33115798234939575},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.2973659336566925},{"id":"https://openalex.org/keywords/thermal","display_name":"Thermal","score":0.26347166299819946},{"id":"https://openalex.org/keywords/metallurgy","display_name":"Metallurgy","score":0.19508305191993713},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.15919911861419678},{"id":"https://openalex.org/keywords/telecommunications","display_name":"Telecommunications","score":0.15906351804733276},{"id":"https://openalex.org/keywords/physics","display_name":"Physics","score":0.10321086645126343},{"id":"https://openalex.org/keywords/operating-system","display_name":"Operating system","score":0.08585286140441895}],"concepts":[{"id":"https://openalex.org/C123745756","wikidata":"https://www.wikidata.org/wiki/Q1665949","display_name":"Interconnection","level":2,"score":0.7744755744934082},{"id":"https://openalex.org/C544778455","wikidata":"https://www.wikidata.org/wiki/Q753","display_name":"Copper","level":2,"score":0.6382449269294739},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.5754279494285583},{"id":"https://openalex.org/C116372231","wikidata":"https://www.wikidata.org/wiki/Q605757","display_name":"Copper interconnect","level":3,"score":0.5586099028587341},{"id":"https://openalex.org/C48044578","wikidata":"https://www.wikidata.org/wiki/Q727490","display_name":"Scalability","level":2,"score":0.5538788437843323},{"id":"https://openalex.org/C530198007","wikidata":"https://www.wikidata.org/wiki/Q80831","display_name":"Integrated circuit","level":2,"score":0.5122663378715515},{"id":"https://openalex.org/C177564732","wikidata":"https://www.wikidata.org/wiki/Q7698333","display_name":"Temperature cycling","level":3,"score":0.49151143431663513},{"id":"https://openalex.org/C153083717","wikidata":"https://www.wikidata.org/wiki/Q6535263","display_name":"Leverage (statistics)","level":2,"score":0.4575258195400238},{"id":"https://openalex.org/C59088047","wikidata":"https://www.wikidata.org/wiki/Q229370","display_name":"Three-dimensional integrated circuit","level":3,"score":0.45624274015426636},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.4293123185634613},{"id":"https://openalex.org/C186260285","wikidata":"https://www.wikidata.org/wiki/Q759494","display_name":"Integrated circuit packaging","level":3,"score":0.4173007011413574},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.34475576877593994},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.33115798234939575},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.2973659336566925},{"id":"https://openalex.org/C204530211","wikidata":"https://www.wikidata.org/wiki/Q752823","display_name":"Thermal","level":2,"score":0.26347166299819946},{"id":"https://openalex.org/C191897082","wikidata":"https://www.wikidata.org/wiki/Q11467","display_name":"Metallurgy","level":1,"score":0.19508305191993713},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.15919911861419678},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.15906351804733276},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.10321086645126343},{"id":"https://openalex.org/C111919701","wikidata":"https://www.wikidata.org/wiki/Q9135","display_name":"Operating system","level":1,"score":0.08585286140441895},{"id":"https://openalex.org/C119857082","wikidata":"https://www.wikidata.org/wiki/Q2539","display_name":"Machine learning","level":1,"score":0.0},{"id":"https://openalex.org/C153294291","wikidata":"https://www.wikidata.org/wiki/Q25261","display_name":"Meteorology","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/3dic.2009.5306533","is_oa":false,"landing_page_url":"https://doi.org/10.1109/3dic.2009.5306533","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2009 IEEE International Conference on 3D System Integration","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"id":"https://metadata.un.org/sdg/9","score":0.49000000953674316,"display_name":"Industry, innovation and infrastructure"}],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":11,"referenced_works":["https://openalex.org/W1607239214","https://openalex.org/W1824726199","https://openalex.org/W1969756138","https://openalex.org/W2097099362","https://openalex.org/W2119805473","https://openalex.org/W2166549182","https://openalex.org/W2243794525","https://openalex.org/W2300182875","https://openalex.org/W2318904844","https://openalex.org/W2332436071","https://openalex.org/W4233340483"],"related_works":["https://openalex.org/W2357275884","https://openalex.org/W2016970881","https://openalex.org/W3034596539","https://openalex.org/W2055834021","https://openalex.org/W2282800425","https://openalex.org/W2626423140","https://openalex.org/W2011617384","https://openalex.org/W2767940321","https://openalex.org/W2766363448","https://openalex.org/W2116358629"],"abstract_inverted_index":{"This":[0],"paper":[1],"presents":[2],"preliminary":[3],"results":[4,114],"of":[5,49],"a":[6,56,61,74,109],"copper-based":[7],"direct":[8],"bond":[9,28],"interconnect":[10],"(DBIreg)":[11],"3D":[12,36,51,69],"integration":[13],"process":[14],"that":[15,118],"has":[16],"been":[17],"developed":[18],"to":[19,30],"leverage":[20],"foundry":[21,40],"standard":[22],"copper":[23,52,70],"dual":[24],"damascene":[25],"and":[26,65,81,90,108,122],"Ziptronix":[27],"technology":[29],"achieve":[31],"scalable,":[32],"very":[33],"low":[34],"Cost-of-Ownership,":[35],"interconnects":[37],"with":[38,60,73],"minimum":[39],"adoption":[41],"barrier.":[42],"Results":[43],"achieved":[44,83],"include":[45,115],"100%":[46],"operable":[47],"arrays":[48],"72,500":[50],"DBIreg":[53,71,78,106],"interconnections":[54,72],"on":[55],"25":[57],"micron":[58,67,103],"pitch":[59,68],"125degC":[62],"thermal":[63,76],"budget":[64],"10":[66],"350degC":[75],"budget.":[77],"contact":[79],"resistance":[80],"resistivity":[82],"are":[84],"<":[85,91],"50":[86],"mOhm":[87],"/":[88],"connection":[89],"0.45":[92],"Ohm-um":[93],"<sup":[94],"xmlns:mml=\"http://www.w3.org/1998/Math/MathML\"":[95],"xmlns:xlink=\"http://www.w3.org/1999/xlink\">2</sup>":[96],",":[97],"respectively,":[98],"using":[99],"three":[100],"or":[101],"four":[102],"diameter":[104],"Cu":[105],"plugs":[107],"TiW":[110],"barrier":[111],"layer.":[112],"Reliability":[113],"bare":[116],"die":[117],"pass":[119],"temperature":[120],"cycling":[121],"HAST":[123],"JEDEC":[124],"tests.":[125]},"counts_by_year":[{"year":2025,"cited_by_count":6},{"year":2024,"cited_by_count":7},{"year":2023,"cited_by_count":8},{"year":2022,"cited_by_count":10},{"year":2021,"cited_by_count":9},{"year":2020,"cited_by_count":5},{"year":2019,"cited_by_count":8},{"year":2018,"cited_by_count":12},{"year":2017,"cited_by_count":9},{"year":2016,"cited_by_count":5},{"year":2015,"cited_by_count":6},{"year":2014,"cited_by_count":12},{"year":2013,"cited_by_count":5},{"year":2012,"cited_by_count":11}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}