{"id":"https://openalex.org/W2099709017","doi":"https://doi.org/10.1109/3dic.2009.5306524","title":"Development of a new self-assembled die bonder to three-dimensionally stack known good dies in batch","display_name":"Development of a new self-assembled die bonder to three-dimensionally stack known good dies in batch","publication_year":2009,"publication_date":"2009-09-01","ids":{"openalex":"https://openalex.org/W2099709017","doi":"https://doi.org/10.1109/3dic.2009.5306524","mag":"2099709017"},"language":"en","primary_location":{"id":"doi:10.1109/3dic.2009.5306524","is_oa":false,"landing_page_url":"https://doi.org/10.1109/3dic.2009.5306524","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2009 IEEE International Conference on 3D System Integration","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5041535044","display_name":"Takafumi Fukushima","orcid":"https://orcid.org/0000-0003-2303-8178"},"institutions":[{"id":"https://openalex.org/I201537933","display_name":"Tohoku University","ror":"https://ror.org/01dq60k83","country_code":"JP","type":"education","lineage":["https://openalex.org/I201537933"]}],"countries":["JP"],"is_corresponding":true,"raw_author_name":"Takafumi Fukushima","raw_affiliation_strings":["Department of Bioengineering and Robotics, Graduate School of Engineering, University of Tohoku, Sendai, Japan","Department of Bioengineering and Robotics , Graduate School of Engineering, Tohoku University , 6-6-01, Aza-Aoba, Aramaki, Aoba-ku, Sendai, 980-8579, Japan"],"affiliations":[{"raw_affiliation_string":"Department of Bioengineering and Robotics, Graduate School of Engineering, University of Tohoku, Sendai, Japan","institution_ids":["https://openalex.org/I201537933"]},{"raw_affiliation_string":"Department of Bioengineering and Robotics , Graduate School of Engineering, Tohoku University , 6-6-01, Aza-Aoba, Aramaki, Aoba-ku, Sendai, 980-8579, Japan","institution_ids":["https://openalex.org/I201537933"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5004346138","display_name":"Eiji Iwata","orcid":"https://orcid.org/0000-0002-4010-8062"},"institutions":[{"id":"https://openalex.org/I201537933","display_name":"Tohoku University","ror":"https://ror.org/01dq60k83","country_code":"JP","type":"education","lineage":["https://openalex.org/I201537933"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"Eiji Iwata","raw_affiliation_strings":["Department of Bioengineering and Robotics, Graduate School of Engineering, University of Tohoku, Sendai, Japan","Department of Bioengineering and Robotics , Graduate School of Engineering, Tohoku University , 6-6-01, Aza-Aoba, Aramaki, Aoba-ku, Sendai, 980-8579, Japan"],"affiliations":[{"raw_affiliation_string":"Department of Bioengineering and Robotics, Graduate School of Engineering, University of Tohoku, Sendai, Japan","institution_ids":["https://openalex.org/I201537933"]},{"raw_affiliation_string":"Department of Bioengineering and Robotics , Graduate School of Engineering, Tohoku University , 6-6-01, Aza-Aoba, Aramaki, Aoba-ku, Sendai, 980-8579, Japan","institution_ids":["https://openalex.org/I201537933"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5006295728","display_name":"Tetsu Tanaka","orcid":"https://orcid.org/0000-0001-7414-315X"},"institutions":[{"id":"https://openalex.org/I201537933","display_name":"Tohoku University","ror":"https://ror.org/01dq60k83","country_code":"JP","type":"education","lineage":["https://openalex.org/I201537933"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"Tetsu Tanaka","raw_affiliation_strings":["Department of Bioengineering and Robotics, Graduate School of Engineering, University of Tohoku, Sendai, Japan","Department of Bioengineering and Robotics , Graduate School of Engineering, Tohoku University , 6-6-01, Aza-Aoba, Aramaki, Aoba-ku, Sendai, 980-8579, Japan"],"affiliations":[{"raw_affiliation_string":"Department of Bioengineering and Robotics, Graduate School of Engineering, University of Tohoku, Sendai, Japan","institution_ids":["https://openalex.org/I201537933"]},{"raw_affiliation_string":"Department of Bioengineering and Robotics , Graduate School of Engineering, Tohoku University , 6-6-01, Aza-Aoba, Aramaki, Aoba-ku, Sendai, 980-8579, Japan","institution_ids":["https://openalex.org/I201537933"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5059487693","display_name":"Mitsumasa Koyanagi","orcid":"https://orcid.org/0000-0003-4726-4217"},"institutions":[{"id":"https://openalex.org/I201537933","display_name":"Tohoku University","ror":"https://ror.org/01dq60k83","country_code":"JP","type":"education","lineage":["https://openalex.org/I201537933"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"Mitsumasa Koyanagi","raw_affiliation_strings":["Department of Bioengineering and Robotics, Graduate School of Engineering, University of Tohoku, Sendai, Japan","Department of Bioengineering and Robotics , Graduate School of Engineering, Tohoku University , 6-6-01, Aza-Aoba, Aramaki, Aoba-ku, Sendai, 980-8579, Japan"],"affiliations":[{"raw_affiliation_string":"Department of Bioengineering and Robotics, Graduate School of Engineering, University of Tohoku, Sendai, Japan","institution_ids":["https://openalex.org/I201537933"]},{"raw_affiliation_string":"Department of Bioengineering and Robotics , Graduate School of Engineering, Tohoku University , 6-6-01, Aza-Aoba, Aramaki, Aoba-ku, Sendai, 980-8579, Japan","institution_ids":["https://openalex.org/I201537933"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":4,"corresponding_author_ids":["https://openalex.org/A5041535044"],"corresponding_institution_ids":["https://openalex.org/I201537933"],"apc_list":null,"apc_paid":null,"fwci":0.0,"has_fulltext":false,"cited_by_count":0,"citation_normalized_percentile":{"value":0.12503744,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":null,"biblio":{"volume":null,"issue":null,"first_page":"1","last_page":"4"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12224","display_name":"Nanofabrication and Lithography Techniques","score":0.998199999332428,"subfield":{"id":"https://openalex.org/subfields/2204","display_name":"Biomedical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10783","display_name":"Additive Manufacturing and 3D Printing Technologies","score":0.9968000054359436,"subfield":{"id":"https://openalex.org/subfields/2203","display_name":"Automotive Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/die","display_name":"Die (integrated circuit)","score":0.8197354078292847},{"id":"https://openalex.org/keywords/stack","display_name":"Stack (abstract data type)","score":0.7157793641090393},{"id":"https://openalex.org/keywords/wafer","display_name":"Wafer","score":0.6741563081741333},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.6705642342567444},{"id":"https://openalex.org/keywords/surface-tension","display_name":"Surface tension","score":0.6500504016876221},{"id":"https://openalex.org/keywords/evaporation","display_name":"Evaporation","score":0.5167893171310425},{"id":"https://openalex.org/keywords/printed-circuit-board","display_name":"Printed circuit board","score":0.49262315034866333},{"id":"https://openalex.org/keywords/wafer-bonding","display_name":"Wafer bonding","score":0.4468730390071869},{"id":"https://openalex.org/keywords/self-assembly","display_name":"Self-assembly","score":0.4250609576702118},{"id":"https://openalex.org/keywords/wire-bonding","display_name":"Wire bonding","score":0.41404253244400024},{"id":"https://openalex.org/keywords/thermocompression-bonding","display_name":"Thermocompression bonding","score":0.4109656512737274},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.39197197556495667},{"id":"https://openalex.org/keywords/layer","display_name":"Layer (electronics)","score":0.3544573187828064},{"id":"https://openalex.org/keywords/nanotechnology","display_name":"Nanotechnology","score":0.3110390603542328},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.21355411410331726},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.14581075310707092},{"id":"https://openalex.org/keywords/chip","display_name":"Chip","score":0.13807180523872375},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.13462239503860474},{"id":"https://openalex.org/keywords/telecommunications","display_name":"Telecommunications","score":0.07004222273826599}],"concepts":[{"id":"https://openalex.org/C111106434","wikidata":"https://www.wikidata.org/wiki/Q1072430","display_name":"Die (integrated circuit)","level":2,"score":0.8197354078292847},{"id":"https://openalex.org/C9395851","wikidata":"https://www.wikidata.org/wiki/Q177929","display_name":"Stack (abstract data type)","level":2,"score":0.7157793641090393},{"id":"https://openalex.org/C160671074","wikidata":"https://www.wikidata.org/wiki/Q267131","display_name":"Wafer","level":2,"score":0.6741563081741333},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.6705642342567444},{"id":"https://openalex.org/C8892853","wikidata":"https://www.wikidata.org/wiki/Q170749","display_name":"Surface tension","level":2,"score":0.6500504016876221},{"id":"https://openalex.org/C61441594","wikidata":"https://www.wikidata.org/wiki/Q132814","display_name":"Evaporation","level":2,"score":0.5167893171310425},{"id":"https://openalex.org/C120793396","wikidata":"https://www.wikidata.org/wiki/Q173350","display_name":"Printed circuit board","level":2,"score":0.49262315034866333},{"id":"https://openalex.org/C2779133538","wikidata":"https://www.wikidata.org/wiki/Q677010","display_name":"Wafer bonding","level":3,"score":0.4468730390071869},{"id":"https://openalex.org/C26856880","wikidata":"https://www.wikidata.org/wiki/Q910150","display_name":"Self-assembly","level":2,"score":0.4250609576702118},{"id":"https://openalex.org/C140269135","wikidata":"https://www.wikidata.org/wiki/Q750783","display_name":"Wire bonding","level":3,"score":0.41404253244400024},{"id":"https://openalex.org/C201845621","wikidata":"https://www.wikidata.org/wiki/Q1111341","display_name":"Thermocompression bonding","level":3,"score":0.4109656512737274},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.39197197556495667},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.3544573187828064},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.3110390603542328},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.21355411410331726},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.14581075310707092},{"id":"https://openalex.org/C165005293","wikidata":"https://www.wikidata.org/wiki/Q1074500","display_name":"Chip","level":2,"score":0.13807180523872375},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.13462239503860474},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.07004222273826599},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.0},{"id":"https://openalex.org/C62520636","wikidata":"https://www.wikidata.org/wiki/Q944","display_name":"Quantum mechanics","level":1,"score":0.0},{"id":"https://openalex.org/C199360897","wikidata":"https://www.wikidata.org/wiki/Q9143","display_name":"Programming language","level":1,"score":0.0},{"id":"https://openalex.org/C97355855","wikidata":"https://www.wikidata.org/wiki/Q11473","display_name":"Thermodynamics","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/3dic.2009.5306524","is_oa":false,"landing_page_url":"https://doi.org/10.1109/3dic.2009.5306524","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2009 IEEE International Conference on 3D System Integration","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":13,"referenced_works":["https://openalex.org/W1513426357","https://openalex.org/W1971966678","https://openalex.org/W1979601109","https://openalex.org/W2009195513","https://openalex.org/W2016077759","https://openalex.org/W2031579205","https://openalex.org/W2125551870","https://openalex.org/W2151613126","https://openalex.org/W2537189011","https://openalex.org/W2538857334","https://openalex.org/W2541409995","https://openalex.org/W3144169286","https://openalex.org/W6630649143"],"related_works":["https://openalex.org/W2020728344","https://openalex.org/W2625018053","https://openalex.org/W4289175612","https://openalex.org/W2529717111","https://openalex.org/W2000494592","https://openalex.org/W1580942132","https://openalex.org/W2090223096","https://openalex.org/W1990895528","https://openalex.org/W2952830176","https://openalex.org/W4249684911"],"abstract_inverted_index":{"We":[0],"developed":[1],"a":[2,15],"new":[3,102],"self-assembled":[4,23,103],"die":[5,104],"bonder":[6],"to":[7,37,57,72,96],"produce":[8],"three-dimensionally":[9],"integrated":[10],"circuit":[11],"(3D":[12],"IC)":[13],"using":[14],"multichip-to-wafer":[16],"bonding":[17,44,59,98],"method":[18],"in":[19,100],"batch.":[20],"In":[21],"the":[22,58,62,78,90,97,101],"multichip":[24],"bonder,":[25],"large":[26],"number":[27],"of":[28],"known":[29],"good":[30],"dies":[31],"(KGDs)":[32],"can":[33,54,93],"be":[34,55,73,94],"simultaneously":[35],"transferred":[36],"an":[38],"LSI":[39],"wafer":[40],"on":[41],"which":[42],"hydrophilic":[43],"areas":[45,60,99],"with":[46],"liquid":[47,63,88],"droplets":[48],"are":[49],"prepared.":[50],"The":[51,66],"many":[52,91],"KGD":[53],"aligned":[56],"by":[61],"surface":[64],"tension.":[65],"average":[67],"alignment":[68,80],"accuracy":[69],"was":[70,82],"found":[71],"approximately":[74],"400":[75],"nm":[76],"and":[77],"total":[79],"time":[81],"less":[83],"than":[84],"0.1":[85],"sec.":[86],"After":[87],"evaporation,":[89],"KGDs":[92],"bonded":[95],"bonder.":[105]},"counts_by_year":[],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}