{"id":"https://openalex.org/W2084444710","doi":"https://doi.org/10.1108/ir-09-2012-414","title":"Improving wafer handling performance in semiconductor manufacturing","display_name":"Improving wafer handling performance in semiconductor manufacturing","publication_year":2013,"publication_date":"2013-08-14","ids":{"openalex":"https://openalex.org/W2084444710","doi":"https://doi.org/10.1108/ir-09-2012-414","mag":"2084444710"},"language":"en","primary_location":{"id":"doi:10.1108/ir-09-2012-414","is_oa":false,"landing_page_url":"https://doi.org/10.1108/ir-09-2012-414","pdf_url":null,"source":{"id":"https://openalex.org/S166948985","display_name":"Industrial Robot the international journal of robotics research and application","issn_l":"0143-991X","issn":["0143-991X","1758-5791"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319811","host_organization_name":"Emerald Publishing Limited","host_organization_lineage":["https://openalex.org/P4310319811"],"host_organization_lineage_names":["Emerald Publishing Limited"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Industrial Robot: An International Journal","raw_type":"journal-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5101688278","display_name":"Heping Chen","orcid":"https://orcid.org/0000-0002-1045-8977"},"institutions":[{"id":"https://openalex.org/I13511017","display_name":"Texas State University","ror":"https://ror.org/05h9q1g27","country_code":"US","type":"education","lineage":["https://openalex.org/I13511017"]}],"countries":["US"],"is_corresponding":true,"raw_author_name":"Heping Chen","raw_affiliation_strings":["Ingram School of Engineering, Texas State University, San Marcos, Texas, USA"],"affiliations":[{"raw_affiliation_string":"Ingram School of Engineering, Texas State University, San Marcos, Texas, USA","institution_ids":["https://openalex.org/I13511017"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5101454916","display_name":"Hongtai Cheng","orcid":"https://orcid.org/0000-0001-7579-5803"},"institutions":[{"id":"https://openalex.org/I13511017","display_name":"Texas State University","ror":"https://ror.org/05h9q1g27","country_code":"US","type":"education","lineage":["https://openalex.org/I13511017"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Hongtai Cheng","raw_affiliation_strings":["Ingram School of Engineering, Texas State University, San Marcos, Texas, USA"],"affiliations":[{"raw_affiliation_string":"Ingram School of Engineering, Texas State University, San Marcos, Texas, USA","institution_ids":["https://openalex.org/I13511017"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5108535875","display_name":"B. W. Mooring","orcid":null},"institutions":[{"id":"https://openalex.org/I4210139090","display_name":"Lam Research (United States)","ror":"https://ror.org/04gecbm52","country_code":"US","type":"company","lineage":["https://openalex.org/I4210139090"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Ben Mooring","raw_affiliation_strings":["Lam Research Corporation, Austin, Texas, USA"],"affiliations":[{"raw_affiliation_string":"Lam Research Corporation, Austin, Texas, USA","institution_ids":["https://openalex.org/I4210139090"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":3,"corresponding_author_ids":["https://openalex.org/A5101688278"],"corresponding_institution_ids":["https://openalex.org/I13511017"],"apc_list":null,"apc_paid":null,"fwci":0.0,"has_fulltext":false,"cited_by_count":1,"citation_normalized_percentile":{"value":0.13260069,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":93},"biblio":{"volume":"40","issue":"5","first_page":"425","last_page":"432"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11301","display_name":"Advanced Surface Polishing Techniques","score":0.9998000264167786,"subfield":{"id":"https://openalex.org/subfields/2204","display_name":"Biomedical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11301","display_name":"Advanced Surface Polishing Techniques","score":0.9998000264167786,"subfield":{"id":"https://openalex.org/subfields/2204","display_name":"Biomedical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12111","display_name":"Industrial Vision Systems and Defect Detection","score":0.9986000061035156,"subfield":{"id":"https://openalex.org/subfields/2209","display_name":"Industrial and Manufacturing Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11338","display_name":"Advancements in Photolithography Techniques","score":0.9930999875068665,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/wafer","display_name":"Wafer","score":0.8887720108032227},{"id":"https://openalex.org/keywords/semiconductor-device-fabrication","display_name":"Semiconductor device fabrication","score":0.6953778266906738},{"id":"https://openalex.org/keywords/electronics","display_name":"Electronics","score":0.5790587067604065},{"id":"https://openalex.org/keywords/robotics","display_name":"Robotics","score":0.5228034257888794},{"id":"https://openalex.org/keywords/robot","display_name":"Robot","score":0.5129715800285339},{"id":"https://openalex.org/keywords/process","display_name":"Process (computing)","score":0.5013914108276367},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.49924612045288086},{"id":"https://openalex.org/keywords/transfer","display_name":"Transfer (computing)","score":0.4496293365955353},{"id":"https://openalex.org/keywords/wafer-fabrication","display_name":"Wafer fabrication","score":0.4490419924259186},{"id":"https://openalex.org/keywords/wafer-backgrinding","display_name":"Wafer backgrinding","score":0.41822534799575806},{"id":"https://openalex.org/keywords/manufacturing-engineering","display_name":"Manufacturing engineering","score":0.41267162561416626},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.39185744524002075},{"id":"https://openalex.org/keywords/mechanical-engineering","display_name":"Mechanical engineering","score":0.3651031255722046},{"id":"https://openalex.org/keywords/reliability-engineering","display_name":"Reliability engineering","score":0.3215561509132385},{"id":"https://openalex.org/keywords/artificial-intelligence","display_name":"Artificial intelligence","score":0.2799736261367798},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.21159812808036804},{"id":"https://openalex.org/keywords/wafer-dicing","display_name":"Wafer dicing","score":0.08843675255775452}],"concepts":[{"id":"https://openalex.org/C160671074","wikidata":"https://www.wikidata.org/wiki/Q267131","display_name":"Wafer","level":2,"score":0.8887720108032227},{"id":"https://openalex.org/C66018809","wikidata":"https://www.wikidata.org/wiki/Q1570432","display_name":"Semiconductor device fabrication","level":3,"score":0.6953778266906738},{"id":"https://openalex.org/C138331895","wikidata":"https://www.wikidata.org/wiki/Q11650","display_name":"Electronics","level":2,"score":0.5790587067604065},{"id":"https://openalex.org/C34413123","wikidata":"https://www.wikidata.org/wiki/Q170978","display_name":"Robotics","level":3,"score":0.5228034257888794},{"id":"https://openalex.org/C90509273","wikidata":"https://www.wikidata.org/wiki/Q11012","display_name":"Robot","level":2,"score":0.5129715800285339},{"id":"https://openalex.org/C98045186","wikidata":"https://www.wikidata.org/wiki/Q205663","display_name":"Process (computing)","level":2,"score":0.5013914108276367},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.49924612045288086},{"id":"https://openalex.org/C2776175482","wikidata":"https://www.wikidata.org/wiki/Q1195816","display_name":"Transfer (computing)","level":2,"score":0.4496293365955353},{"id":"https://openalex.org/C35750839","wikidata":"https://www.wikidata.org/wiki/Q7959421","display_name":"Wafer fabrication","level":3,"score":0.4490419924259186},{"id":"https://openalex.org/C8002213","wikidata":"https://www.wikidata.org/wiki/Q7959420","display_name":"Wafer backgrinding","level":4,"score":0.41822534799575806},{"id":"https://openalex.org/C117671659","wikidata":"https://www.wikidata.org/wiki/Q11049265","display_name":"Manufacturing engineering","level":1,"score":0.41267162561416626},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.39185744524002075},{"id":"https://openalex.org/C78519656","wikidata":"https://www.wikidata.org/wiki/Q101333","display_name":"Mechanical engineering","level":1,"score":0.3651031255722046},{"id":"https://openalex.org/C200601418","wikidata":"https://www.wikidata.org/wiki/Q2193887","display_name":"Reliability engineering","level":1,"score":0.3215561509132385},{"id":"https://openalex.org/C154945302","wikidata":"https://www.wikidata.org/wiki/Q11660","display_name":"Artificial intelligence","level":1,"score":0.2799736261367798},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.21159812808036804},{"id":"https://openalex.org/C165013422","wikidata":"https://www.wikidata.org/wiki/Q4388382","display_name":"Wafer dicing","level":3,"score":0.08843675255775452},{"id":"https://openalex.org/C173608175","wikidata":"https://www.wikidata.org/wiki/Q232661","display_name":"Parallel computing","level":1,"score":0.0},{"id":"https://openalex.org/C111919701","wikidata":"https://www.wikidata.org/wiki/Q9135","display_name":"Operating system","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1108/ir-09-2012-414","is_oa":false,"landing_page_url":"https://doi.org/10.1108/ir-09-2012-414","pdf_url":null,"source":{"id":"https://openalex.org/S166948985","display_name":"Industrial Robot the international journal of robotics research and application","issn_l":"0143-991X","issn":["0143-991X","1758-5791"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319811","host_organization_name":"Emerald Publishing Limited","host_organization_lineage":["https://openalex.org/P4310319811"],"host_organization_lineage_names":["Emerald Publishing Limited"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Industrial Robot: An International Journal","raw_type":"journal-article"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":17,"referenced_works":["https://openalex.org/W1479738748","https://openalex.org/W1489014479","https://openalex.org/W1567848620","https://openalex.org/W1584037396","https://openalex.org/W1587455953","https://openalex.org/W2016334375","https://openalex.org/W2024778194","https://openalex.org/W2027667273","https://openalex.org/W2034108993","https://openalex.org/W2102745565","https://openalex.org/W2155735496","https://openalex.org/W2170120409","https://openalex.org/W2502105218","https://openalex.org/W2798766995","https://openalex.org/W3143187740","https://openalex.org/W6629185561","https://openalex.org/W6635118135"],"related_works":["https://openalex.org/W2146435486","https://openalex.org/W2170726572","https://openalex.org/W2006086900","https://openalex.org/W1483119123","https://openalex.org/W2377558694","https://openalex.org/W2394172622","https://openalex.org/W1594978932","https://openalex.org/W2083418455","https://openalex.org/W2140718007","https://openalex.org/W952678609"],"abstract_inverted_index":{"Purpose":[0],"\u2013":[1],"The":[2,35,85,124],"electronics":[3],"industries":[4],"are":[5,16,74,88],"relying":[6],"increasingly":[7],"on":[8],"robotics":[9],"for":[10],"their":[11],"production.":[12],"Wafer":[13],"handling":[14,138],"robots":[15],"used":[17],"to":[18,31,54,79,91,95,113,118,130,134],"transfer":[19,32,49],"wafers":[20,33],"between":[21],"wafer":[22,48,82,98,137],"processing":[23],"stations.":[24],"A":[25],"pick\u2010measure\u2010place":[26],"method":[27],"is":[28,38,44,52,129],"typically":[29],"utilized":[30],"accurately.":[34],"measurement":[36,58],"step":[37],"performed":[39],"using":[40,105],"an":[41],"aligner,":[42],"which":[43],"time\u2010consuming.":[45],"To":[46,68],"increase":[47],"efficiency,":[50],"it":[51,62],"desirable":[53],"speed":[55],"up":[56],"the":[57,70,81,93,97,106,120,136],"process":[59],"or":[60],"place":[61,96],"in":[63,140],"parallel":[64],"with":[65],"other":[66],"operations.":[67],"solve":[69],"problem,":[71],"optic":[72],"sensors":[73],"installed":[75],"at":[76],"each":[77],"station":[78,102],"estimate":[80],"eccentricity":[83,86],"on\u2010the\u2010fly.":[84],"values":[87],"then":[89],"applied":[90],"control":[92],"robot":[94],"directly":[99],"onto":[100],"another":[101],"accurately":[103],"without":[104],"aligner.":[107],"However,":[108],"current":[109],"methods":[110],"face":[111],"problems":[112],"achieve":[114],"high":[115],"accuracy":[116],"requirements":[117],"meet":[119],"electronic":[121],"manufacturing":[122],"needs.":[123],"purpose":[125],"of":[126],"this":[127],"paper":[128],"develop":[131],"a":[132],"technique":[133],"improve":[135],"performance":[139],"semiconductor":[141],"manufacturing.":[142]},"counts_by_year":[{"year":2021,"cited_by_count":1}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}