{"id":"https://openalex.org/W1981807803","doi":"https://doi.org/10.1080/09511920903527853","title":"Automated discrete-pin adjustment for reconfigurable moulding machine","display_name":"Automated discrete-pin adjustment for reconfigurable moulding machine","publication_year":2010,"publication_date":"2010-02-19","ids":{"openalex":"https://openalex.org/W1981807803","doi":"https://doi.org/10.1080/09511920903527853","mag":"1981807803"},"language":"en","primary_location":{"id":"doi:10.1080/09511920903527853","is_oa":false,"landing_page_url":"https://doi.org/10.1080/09511920903527853","pdf_url":null,"source":{"id":"https://openalex.org/S57062392","display_name":"International Journal of Computer Integrated Manufacturing","issn_l":"0951-192X","issn":["0951-192X","1362-3052"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310320547","host_organization_name":"Taylor & Francis","host_organization_lineage":["https://openalex.org/P4310320547"],"host_organization_lineage_names":["Taylor & Francis"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"International Journal of Computer Integrated Manufacturing","raw_type":"journal-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":true,"oa_status":"green","oa_url":"https://hal.science/hal-00567236","any_repository_has_fulltext":true},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5089191258","display_name":"Yan Wang","orcid":"https://orcid.org/0000-0002-5188-6695"},"institutions":[{"id":"https://openalex.org/I142263535","display_name":"University of Nottingham","ror":"https://ror.org/01ee9ar58","country_code":"GB","type":"education","lineage":["https://openalex.org/I142263535"]}],"countries":["GB"],"is_corresponding":true,"raw_author_name":"Y. Wang","raw_affiliation_strings":["Faculty of Engineering, Ningbo Campus , University of Nottingham , UK"],"affiliations":[{"raw_affiliation_string":"Faculty of Engineering, Ningbo Campus , University of Nottingham , UK","institution_ids":["https://openalex.org/I142263535"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5100344947","display_name":"Zhenyu Wang","orcid":"https://orcid.org/0000-0002-3085-9954"},"institutions":[{"id":"https://openalex.org/I142263535","display_name":"University of Nottingham","ror":"https://ror.org/01ee9ar58","country_code":"GB","type":"education","lineage":["https://openalex.org/I142263535"]}],"countries":["GB"],"is_corresponding":false,"raw_author_name":"Z. Wang","raw_affiliation_strings":["Faculty of Engineering, Ningbo Campus , University of Nottingham , UK"],"affiliations":[{"raw_affiliation_string":"Faculty of Engineering, Ningbo Campus , University of Nottingham , UK","institution_ids":["https://openalex.org/I142263535"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5087000571","display_name":"Nabil Gindy","orcid":"https://orcid.org/0000-0001-6476-5959"},"institutions":[{"id":"https://openalex.org/I142263535","display_name":"University of Nottingham","ror":"https://ror.org/01ee9ar58","country_code":"GB","type":"education","lineage":["https://openalex.org/I142263535"]}],"countries":["GB"],"is_corresponding":false,"raw_author_name":"N. Gindy","raw_affiliation_strings":["Faculty of Engineering, Ningbo Campus , University of Nottingham , UK"],"affiliations":[{"raw_affiliation_string":"Faculty of Engineering, Ningbo Campus , University of Nottingham , UK","institution_ids":["https://openalex.org/I142263535"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5101688424","display_name":"Rui Tang","orcid":"https://orcid.org/0009-0001-2444-7494"},"institutions":[{"id":"https://openalex.org/I142263535","display_name":"University of Nottingham","ror":"https://ror.org/01ee9ar58","country_code":"GB","type":"education","lineage":["https://openalex.org/I142263535"]}],"countries":["GB"],"is_corresponding":false,"raw_author_name":"R. Tang","raw_affiliation_strings":["School of Mechanical, Materials and Manufacturing Engineering, University of Nottingham , UK","School of Mechanical, Materials and Manufacturing Engineering, University of Nottingham, UK"],"affiliations":[{"raw_affiliation_string":"School of Mechanical, Materials and Manufacturing Engineering, University of Nottingham , UK","institution_ids":["https://openalex.org/I142263535"]},{"raw_affiliation_string":"School of Mechanical, Materials and Manufacturing Engineering, University of Nottingham, UK","institution_ids":["https://openalex.org/I142263535"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5101398926","display_name":"Xiaojun Gu","orcid":"https://orcid.org/0000-0002-1282-6120"},"institutions":[{"id":"https://openalex.org/I142263535","display_name":"University of Nottingham","ror":"https://ror.org/01ee9ar58","country_code":"GB","type":"education","lineage":["https://openalex.org/I142263535"]}],"countries":["GB"],"is_corresponding":false,"raw_author_name":"X.-J. Gu","raw_affiliation_strings":["School of Mechanical, Materials and Manufacturing Engineering, University of Nottingham , UK","School of Mechanical, Materials and Manufacturing Engineering, University of Nottingham, UK"],"affiliations":[{"raw_affiliation_string":"School of Mechanical, Materials and Manufacturing Engineering, University of Nottingham , UK","institution_ids":["https://openalex.org/I142263535"]},{"raw_affiliation_string":"School of Mechanical, Materials and Manufacturing Engineering, University of Nottingham, UK","institution_ids":["https://openalex.org/I142263535"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":5,"corresponding_author_ids":["https://openalex.org/A5089191258"],"corresponding_institution_ids":["https://openalex.org/I142263535"],"apc_list":null,"apc_paid":null,"fwci":0.8227,"has_fulltext":false,"cited_by_count":2,"citation_normalized_percentile":{"value":0.76206404,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":94},"biblio":{"volume":"23","issue":"3","first_page":"229","last_page":"236"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11159","display_name":"Manufacturing Process and Optimization","score":0.9994999766349792,"subfield":{"id":"https://openalex.org/subfields/2209","display_name":"Industrial and Manufacturing Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11159","display_name":"Manufacturing Process and Optimization","score":0.9994999766349792,"subfield":{"id":"https://openalex.org/subfields/2209","display_name":"Industrial and Manufacturing Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11245","display_name":"Advanced Numerical Analysis Techniques","score":0.9977999925613403,"subfield":{"id":"https://openalex.org/subfields/2206","display_name":"Computational Mechanics"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10783","display_name":"Additive Manufacturing and 3D Printing Technologies","score":0.9916999936103821,"subfield":{"id":"https://openalex.org/subfields/2203","display_name":"Automotive Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/discretization","display_name":"Discretization","score":0.7023642063140869},{"id":"https://openalex.org/keywords/component","display_name":"Component (thermodynamics)","score":0.696794331073761},{"id":"https://openalex.org/keywords/software","display_name":"Software","score":0.680915117263794},{"id":"https://openalex.org/keywords/injection-moulding","display_name":"Injection moulding","score":0.643510639667511},{"id":"https://openalex.org/keywords/component-based-software-engineering","display_name":"Component-based software engineering","score":0.4535974860191345},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.4288179874420166},{"id":"https://openalex.org/keywords/software-development","display_name":"Software development","score":0.4161324203014374},{"id":"https://openalex.org/keywords/engineering-drawing","display_name":"Engineering drawing","score":0.3924839496612549},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.3869227170944214},{"id":"https://openalex.org/keywords/mechanical-engineering","display_name":"Mechanical engineering","score":0.3758634924888611},{"id":"https://openalex.org/keywords/embedded-system","display_name":"Embedded system","score":0.35218024253845215},{"id":"https://openalex.org/keywords/operating-system","display_name":"Operating system","score":0.21238481998443604}],"concepts":[{"id":"https://openalex.org/C73000952","wikidata":"https://www.wikidata.org/wiki/Q17007827","display_name":"Discretization","level":2,"score":0.7023642063140869},{"id":"https://openalex.org/C168167062","wikidata":"https://www.wikidata.org/wiki/Q1117970","display_name":"Component (thermodynamics)","level":2,"score":0.696794331073761},{"id":"https://openalex.org/C2777904410","wikidata":"https://www.wikidata.org/wiki/Q7397","display_name":"Software","level":2,"score":0.680915117263794},{"id":"https://openalex.org/C2778993590","wikidata":"https://www.wikidata.org/wiki/Q260606","display_name":"Injection moulding","level":2,"score":0.643510639667511},{"id":"https://openalex.org/C174683762","wikidata":"https://www.wikidata.org/wiki/Q609588","display_name":"Component-based software engineering","level":4,"score":0.4535974860191345},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.4288179874420166},{"id":"https://openalex.org/C529173508","wikidata":"https://www.wikidata.org/wiki/Q638608","display_name":"Software development","level":3,"score":0.4161324203014374},{"id":"https://openalex.org/C199639397","wikidata":"https://www.wikidata.org/wiki/Q1788588","display_name":"Engineering drawing","level":1,"score":0.3924839496612549},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.3869227170944214},{"id":"https://openalex.org/C78519656","wikidata":"https://www.wikidata.org/wiki/Q101333","display_name":"Mechanical engineering","level":1,"score":0.3758634924888611},{"id":"https://openalex.org/C149635348","wikidata":"https://www.wikidata.org/wiki/Q193040","display_name":"Embedded system","level":1,"score":0.35218024253845215},{"id":"https://openalex.org/C111919701","wikidata":"https://www.wikidata.org/wiki/Q9135","display_name":"Operating system","level":1,"score":0.21238481998443604},{"id":"https://openalex.org/C33923547","wikidata":"https://www.wikidata.org/wiki/Q395","display_name":"Mathematics","level":0,"score":0.0},{"id":"https://openalex.org/C97355855","wikidata":"https://www.wikidata.org/wiki/Q11473","display_name":"Thermodynamics","level":1,"score":0.0},{"id":"https://openalex.org/C134306372","wikidata":"https://www.wikidata.org/wiki/Q7754","display_name":"Mathematical analysis","level":1,"score":0.0},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.0}],"mesh":[],"locations_count":3,"locations":[{"id":"doi:10.1080/09511920903527853","is_oa":false,"landing_page_url":"https://doi.org/10.1080/09511920903527853","pdf_url":null,"source":{"id":"https://openalex.org/S57062392","display_name":"International Journal of Computer Integrated Manufacturing","issn_l":"0951-192X","issn":["0951-192X","1362-3052"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310320547","host_organization_name":"Taylor & Francis","host_organization_lineage":["https://openalex.org/P4310320547"],"host_organization_lineage_names":["Taylor & Francis"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"International Journal of Computer Integrated Manufacturing","raw_type":"journal-article"},{"id":"pmh:oai:HAL:hal-00567236v1","is_oa":true,"landing_page_url":"https://hal.science/hal-00567236","pdf_url":null,"source":{"id":"https://openalex.org/S4306402512","display_name":"HAL (Le Centre pour la Communication Scientifique Directe)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":"https://openalex.org/I1294671590","host_organization_name":"Centre National de la Recherche Scientifique","host_organization_lineage":["https://openalex.org/I1294671590"],"host_organization_lineage_names":[],"type":"repository"},"license":"other-oa","license_id":"https://openalex.org/licenses/other-oa","version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"International Journal of Computer Integrated Manufacturing, 2010, 23 (03), pp.229-236. ⟨10.1080/09511920903527853⟩","raw_type":"Journal articles"},{"id":"pmh:oai:tara.tcd.ie:2262/50700","is_oa":false,"landing_page_url":"http://hdl.handle.net/2262/50700","pdf_url":null,"source":{"id":"https://openalex.org/S4306400387","display_name":"Trinity's Access to Research Output (TARA) (Trinity College Dublin)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":"https://openalex.org/I205274468","host_organization_name":"Trinity College Dublin","host_organization_lineage":["https://openalex.org/I205274468"],"host_organization_lineage_names":[],"type":"repository"},"license":null,"license_id":null,"version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"","raw_type":""}],"best_oa_location":{"id":"pmh:oai:HAL:hal-00567236v1","is_oa":true,"landing_page_url":"https://hal.science/hal-00567236","pdf_url":null,"source":{"id":"https://openalex.org/S4306402512","display_name":"HAL (Le Centre pour la Communication Scientifique Directe)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":"https://openalex.org/I1294671590","host_organization_name":"Centre National de la Recherche Scientifique","host_organization_lineage":["https://openalex.org/I1294671590"],"host_organization_lineage_names":[],"type":"repository"},"license":"other-oa","license_id":"https://openalex.org/licenses/other-oa","version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"International Journal of Computer Integrated Manufacturing, 2010, 23 (03), pp.229-236. ⟨10.1080/09511920903527853⟩","raw_type":"Journal articles"},"sustainable_development_goals":[{"display_name":"Industry, innovation and infrastructure","score":0.6100000143051147,"id":"https://metadata.un.org/sdg/9"}],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":8,"referenced_works":["https://openalex.org/W1976099920","https://openalex.org/W2022734279","https://openalex.org/W2022959973","https://openalex.org/W2023894306","https://openalex.org/W2065568462","https://openalex.org/W2089432313","https://openalex.org/W2397301707","https://openalex.org/W3102155376"],"related_works":["https://openalex.org/W2348289213","https://openalex.org/W2018121945","https://openalex.org/W2677345884","https://openalex.org/W1837917562","https://openalex.org/W4235602047","https://openalex.org/W2379062178","https://openalex.org/W2101817543","https://openalex.org/W2365172741","https://openalex.org/W114740100","https://openalex.org/W2128068620"],"abstract_inverted_index":{"To":[0],"stay":[1],"competitive,":[2],"the":[3,25,34,56,62,75,81,84,87],"moulding":[4,18],"industry":[5],"must":[6],"possess":[7],"manufacturing":[8],"systems":[9],"that":[10,60],"are":[11,36],"responsive":[12],"to":[13,38,44,67],"rapid":[14],"market":[15],"changes.":[16],"Reconfigurable":[17],"is":[19,77,89,121],"therefore":[20],"much":[21],"in":[22,32,54],"demand.":[23],"After":[24],"development":[26,59],"of":[27,65,83,117],"a":[28,39,118],"vacuum":[29],"forming":[30,116],"machine,":[31],"which":[33],"pins":[35],"configured":[37],"near-net":[40],"shape":[41,46],"and":[42,80,105,110,113],"machined":[43],"final":[45],"with":[47],"minimal":[48],"material":[49],"removal,":[50],"this":[51,73],"paper":[52],"discusses":[53],"detail":[55],"support":[57],"software":[58,88,93],"enables":[61],"automatic":[63],"adjustment":[64],"discrete-pins":[66],"represent":[68],"different":[69],"component":[70,99],"geometry.":[71],"In":[72],"paper,":[74],"methodology":[76],"first":[78],"explained,":[79],"implementation":[82],"system":[85,94],"within":[86],"then":[90],"demonstrated.":[91],"The":[92],"includes":[95],"three":[96],"parts:":[97],"(1)":[98],"discretisation,":[100],"(2)":[101],"discrete-pin":[102],"construction,":[103],"adjustment,":[104],"G":[106],"code":[107],"generation":[108],"(SCAG)":[109],"(3)":[111],"display":[112],"verification.":[114],"Vacuum":[115],"car":[119],"model":[120],"used":[122],"as":[123],"case":[124],"study.":[125]},"counts_by_year":[{"year":2019,"cited_by_count":1},{"year":2012,"cited_by_count":1}],"updated_date":"2026-03-20T23:20:44.827607","created_date":"2016-06-24T00:00:00"}