{"id":"https://openalex.org/W1996386712","doi":"https://doi.org/10.1080/09511920050117883","title":"A CAD/ CAM system for vector-based layered manufacturing systems","display_name":"A CAD/ CAM system for vector-based layered manufacturing systems","publication_year":2000,"publication_date":"2000-01-01","ids":{"openalex":"https://openalex.org/W1996386712","doi":"https://doi.org/10.1080/09511920050117883","mag":"1996386712"},"language":"en","primary_location":{"id":"doi:10.1080/09511920050117883","is_oa":false,"landing_page_url":"https://doi.org/10.1080/09511920050117883","pdf_url":null,"source":{"id":"https://openalex.org/S57062392","display_name":"International Journal of Computer Integrated Manufacturing","issn_l":"0951-192X","issn":["0951-192X","1362-3052"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310320547","host_organization_name":"Taylor & Francis","host_organization_lineage":["https://openalex.org/P4310320547"],"host_organization_lineage_names":["Taylor & Francis"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"International Journal of Computer Integrated Manufacturing","raw_type":"journal-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5038853037","display_name":"Ajay Joneja","orcid":"https://orcid.org/0000-0002-6797-1253"},"institutions":[{"id":"https://openalex.org/I200769079","display_name":"Hong Kong University of Science and Technology","ror":"https://ror.org/00q4vv597","country_code":"HK","type":"education","lineage":["https://openalex.org/I200769079"]},{"id":"https://openalex.org/I889458895","display_name":"University of Hong Kong","ror":"https://ror.org/02zhqgq86","country_code":"HK","type":"education","lineage":["https://openalex.org/I889458895"]}],"countries":["HK"],"is_corresponding":false,"raw_author_name":"Ajay Joneja","raw_affiliation_strings":["Department of IEEM , Hong Kong University of Science and Technology , Clear Water Bay, Kowloon, Hong Kong, PR China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of IEEM , Hong Kong University of Science and Technology , Clear Water Bay, Kowloon, Hong Kong, PR China","institution_ids":["https://openalex.org/I200769079","https://openalex.org/I889458895"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5007780595","display_name":"King-Wah Pang","orcid":"https://orcid.org/0000-0002-0909-6753"},"institutions":[{"id":"https://openalex.org/I200769079","display_name":"Hong Kong University of Science and Technology","ror":"https://ror.org/00q4vv597","country_code":"HK","type":"education","lineage":["https://openalex.org/I200769079"]},{"id":"https://openalex.org/I889458895","display_name":"University of Hong Kong","ror":"https://ror.org/02zhqgq86","country_code":"HK","type":"education","lineage":["https://openalex.org/I889458895"]}],"countries":["HK"],"is_corresponding":false,"raw_author_name":"Anthony Pang","raw_affiliation_strings":["Department of IEEM , Hong Kong University of Science and Technology , Clear Water Bay, Kowloon, Hong Kong, PR China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of IEEM , Hong Kong University of Science and Technology , Clear Water Bay, Kowloon, Hong Kong, PR China","institution_ids":["https://openalex.org/I200769079","https://openalex.org/I889458895"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5053676318","display_name":"D.C.C. Lam","orcid":"https://orcid.org/0000-0002-4688-1435"},"institutions":[{"id":"https://openalex.org/I200769079","display_name":"Hong Kong University of Science and Technology","ror":"https://ror.org/00q4vv597","country_code":"HK","type":"education","lineage":["https://openalex.org/I200769079"]}],"countries":["HK"],"is_corresponding":false,"raw_author_name":"David Lam","raw_affiliation_strings":["Department of Mechanical Engineering , Hong Kong University of Science and Technology , Clear Water Bay, Kowloon, Hong Kong, PR China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Mechanical Engineering , Hong Kong University of Science and Technology , Clear Water Bay, Kowloon, Hong Kong, PR China","institution_ids":["https://openalex.org/I200769079"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5102731113","display_name":"Matthew M. F. Yuen","orcid":"https://orcid.org/0000-0002-6773-328X"},"institutions":[{"id":"https://openalex.org/I200769079","display_name":"Hong Kong University of Science and Technology","ror":"https://ror.org/00q4vv597","country_code":"HK","type":"education","lineage":["https://openalex.org/I200769079"]}],"countries":["HK"],"is_corresponding":false,"raw_author_name":"Matthew Yuen","raw_affiliation_strings":["Department of Mechanical Engineering , Hong Kong University of Science and Technology , Clear Water Bay, Kowloon, Hong Kong, PR China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Mechanical Engineering , Hong Kong University of Science and Technology , Clear Water Bay, Kowloon, Hong Kong, PR China","institution_ids":["https://openalex.org/I200769079"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":2,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":0.0,"has_fulltext":false,"cited_by_count":4,"citation_normalized_percentile":{"value":0.33613969,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":94},"biblio":{"volume":"13","issue":"5","first_page":"388","last_page":"400"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10783","display_name":"Additive Manufacturing and 3D Printing Technologies","score":0.9973000288009644,"subfield":{"id":"https://openalex.org/subfields/2203","display_name":"Automotive Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10783","display_name":"Additive Manufacturing and 3D Printing Technologies","score":0.9973000288009644,"subfield":{"id":"https://openalex.org/subfields/2203","display_name":"Automotive Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11159","display_name":"Manufacturing Process and Optimization","score":0.9973000288009644,"subfield":{"id":"https://openalex.org/subfields/2209","display_name":"Industrial and Manufacturing Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11814","display_name":"Advanced Manufacturing and Logistics Optimization","score":0.9782999753952026,"subfield":{"id":"https://openalex.org/subfields/2209","display_name":"Industrial and Manufacturing Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/process","display_name":"Process (computing)","score":0.6057213544845581},{"id":"https://openalex.org/keywords/cad","display_name":"CAD","score":0.6023816466331482},{"id":"https://openalex.org/keywords/genetic-algorithm","display_name":"Genetic algorithm","score":0.5803457498550415},{"id":"https://openalex.org/keywords/path","display_name":"Path (computing)","score":0.5335351228713989},{"id":"https://openalex.org/keywords/layer","display_name":"Layer (electronics)","score":0.5253331661224365},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.5136127471923828},{"id":"https://openalex.org/keywords/motion-planning","display_name":"Motion planning","score":0.5122496485710144},{"id":"https://openalex.org/keywords/object","display_name":"Object (grammar)","score":0.44946154952049255},{"id":"https://openalex.org/keywords/computer-integrated-manufacturing","display_name":"Computer-integrated manufacturing","score":0.4370858669281006},{"id":"https://openalex.org/keywords/engineering-drawing","display_name":"Engineering drawing","score":0.426669180393219},{"id":"https://openalex.org/keywords/distributed-computing","display_name":"Distributed computing","score":0.4053262174129486},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.36196649074554443},{"id":"https://openalex.org/keywords/industrial-engineering","display_name":"Industrial engineering","score":0.3317306637763977},{"id":"https://openalex.org/keywords/systems-engineering","display_name":"Systems engineering","score":0.3042241334915161},{"id":"https://openalex.org/keywords/artificial-intelligence","display_name":"Artificial intelligence","score":0.12555813789367676}],"concepts":[{"id":"https://openalex.org/C98045186","wikidata":"https://www.wikidata.org/wiki/Q205663","display_name":"Process (computing)","level":2,"score":0.6057213544845581},{"id":"https://openalex.org/C194789388","wikidata":"https://www.wikidata.org/wiki/Q17855283","display_name":"CAD","level":2,"score":0.6023816466331482},{"id":"https://openalex.org/C8880873","wikidata":"https://www.wikidata.org/wiki/Q187787","display_name":"Genetic algorithm","level":2,"score":0.5803457498550415},{"id":"https://openalex.org/C2777735758","wikidata":"https://www.wikidata.org/wiki/Q817765","display_name":"Path (computing)","level":2,"score":0.5335351228713989},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.5253331661224365},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.5136127471923828},{"id":"https://openalex.org/C81074085","wikidata":"https://www.wikidata.org/wiki/Q366872","display_name":"Motion planning","level":3,"score":0.5122496485710144},{"id":"https://openalex.org/C2781238097","wikidata":"https://www.wikidata.org/wiki/Q175026","display_name":"Object (grammar)","level":2,"score":0.44946154952049255},{"id":"https://openalex.org/C53688548","wikidata":"https://www.wikidata.org/wiki/Q1122190","display_name":"Computer-integrated manufacturing","level":2,"score":0.4370858669281006},{"id":"https://openalex.org/C199639397","wikidata":"https://www.wikidata.org/wiki/Q1788588","display_name":"Engineering drawing","level":1,"score":0.426669180393219},{"id":"https://openalex.org/C120314980","wikidata":"https://www.wikidata.org/wiki/Q180634","display_name":"Distributed computing","level":1,"score":0.4053262174129486},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.36196649074554443},{"id":"https://openalex.org/C13736549","wikidata":"https://www.wikidata.org/wiki/Q4489420","display_name":"Industrial engineering","level":1,"score":0.3317306637763977},{"id":"https://openalex.org/C201995342","wikidata":"https://www.wikidata.org/wiki/Q682496","display_name":"Systems engineering","level":1,"score":0.3042241334915161},{"id":"https://openalex.org/C154945302","wikidata":"https://www.wikidata.org/wiki/Q11660","display_name":"Artificial intelligence","level":1,"score":0.12555813789367676},{"id":"https://openalex.org/C178790620","wikidata":"https://www.wikidata.org/wiki/Q11351","display_name":"Organic chemistry","level":1,"score":0.0},{"id":"https://openalex.org/C185592680","wikidata":"https://www.wikidata.org/wiki/Q2329","display_name":"Chemistry","level":0,"score":0.0},{"id":"https://openalex.org/C119857082","wikidata":"https://www.wikidata.org/wiki/Q2539","display_name":"Machine learning","level":1,"score":0.0},{"id":"https://openalex.org/C199360897","wikidata":"https://www.wikidata.org/wiki/Q9143","display_name":"Programming language","level":1,"score":0.0},{"id":"https://openalex.org/C111919701","wikidata":"https://www.wikidata.org/wiki/Q9135","display_name":"Operating system","level":1,"score":0.0},{"id":"https://openalex.org/C90509273","wikidata":"https://www.wikidata.org/wiki/Q11012","display_name":"Robot","level":2,"score":0.0}],"mesh":[],"locations_count":2,"locations":[{"id":"doi:10.1080/09511920050117883","is_oa":false,"landing_page_url":"https://doi.org/10.1080/09511920050117883","pdf_url":null,"source":{"id":"https://openalex.org/S57062392","display_name":"International Journal of Computer Integrated Manufacturing","issn_l":"0951-192X","issn":["0951-192X","1362-3052"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310320547","host_organization_name":"Taylor & Francis","host_organization_lineage":["https://openalex.org/P4310320547"],"host_organization_lineage_names":["Taylor & Francis"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"International Journal of Computer Integrated Manufacturing","raw_type":"journal-article"},{"id":"pmh:oai:repository.hkust.edu.hk:1783.1-29758","is_oa":false,"landing_page_url":"http://repository.hkust.edu.hk/ir/Record/1783.1-29758","pdf_url":null,"source":{"id":"https://openalex.org/S4306401796","display_name":"Rare & Special e-Zone (The Hong Kong University of Science and Technology)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":"https://openalex.org/I200769079","host_organization_name":"Hong Kong University of Science and Technology","host_organization_lineage":["https://openalex.org/I200769079"],"host_organization_lineage_names":[],"type":"repository"},"license":null,"license_id":null,"version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":null,"raw_type":"Article"}],"best_oa_location":null,"sustainable_development_goals":[{"id":"https://metadata.un.org/sdg/9","score":0.5099999904632568,"display_name":"Industry, innovation and infrastructure"}],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":0,"referenced_works":[],"related_works":["https://openalex.org/W637098845","https://openalex.org/W2410116073","https://openalex.org/W3044972437","https://openalex.org/W2275866607","https://openalex.org/W1908932129","https://openalex.org/W2587289131","https://openalex.org/W2061657315","https://openalex.org/W2365000768","https://openalex.org/W3144042555","https://openalex.org/W2153702122"],"abstract_inverted_index":{"We":[0],"have":[1],"developed":[2],"a":[3,81],"framework":[4,15],"for":[5,8,43,53,70],"process":[6,30],"planning":[7,54,72],"vector-based":[9],"layered":[10],"manufacturing":[11,46],"(LM)":[12],"technologies.":[13],"The":[14,35,78],"proposes":[16],"the":[17,56,75,89,99,102],"use":[18,79],"of":[19,80,98,101],"computational":[20],"geometry":[21],"and":[22,32],"optimization":[23,66,73],"tools":[24],"at":[25,55,74],"two":[26],"levels":[27],"to":[28,87],"reduce":[29,88],"time":[31,91],"material":[33],"wastage.":[34],"proposed":[36],"architecture":[37],"is":[38,68,85],"tested":[39],"by":[40],"an":[41],"implementation":[42,100],"laminated":[44],"object":[45],"(LOM)":[47],"systems.":[48],"Geometric":[49],"techniques":[50],"are":[51,106],"used":[52,69],"3D":[57],"part":[58],"level.":[59,77],"A":[60],"genetic":[61],"algorithm":[62],"(GA)":[63],"based":[64],"path":[65,71],"technique":[67],"layer":[76],"direct":[82],"slice":[83],"format":[84],"shown":[86],"system":[90],"as":[92,94],"well":[93],"storage":[95],"requirements.":[96],"Results":[97],"open-architecture":[103],"LOM":[104],"planner":[105],"presented.":[107]},"counts_by_year":[{"year":2021,"cited_by_count":1},{"year":2019,"cited_by_count":1},{"year":2018,"cited_by_count":1}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}