{"id":"https://openalex.org/W1677625238","doi":"https://doi.org/10.1023/a:1008151424166","title":"Extracting Behavioral Data from Physical Descriptions of MEMS for Simulation","display_name":"Extracting Behavioral Data from Physical Descriptions of MEMS for Simulation","publication_year":1999,"publication_date":"1999-09-01","ids":{"openalex":"https://openalex.org/W1677625238","doi":"https://doi.org/10.1023/a:1008151424166","mag":"1677625238"},"language":"en","primary_location":{"id":"doi:10.1023/a:1008151424166","is_oa":false,"landing_page_url":"https://doi.org/10.1023/a:1008151424166","pdf_url":null,"source":{"id":"https://openalex.org/S4210233059","display_name":"The Journal of VLSI Signal Processing Systems for Signal Image and Video Technology","issn_l":"0922-5773","issn":["0922-5773","1573-109X"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319900","host_organization_name":"Springer Science+Business Media","host_organization_lineage":["https://openalex.org/P4310319900","https://openalex.org/P4310319965"],"host_organization_lineage_names":["Springer Science+Business Media","Springer Nature"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Journal of VLSI signal processing systems for signal, image and video technology","raw_type":"journal-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5108109051","display_name":"Dennis Gibson","orcid":null},"institutions":[{"id":"https://openalex.org/I63135867","display_name":"University of Cincinnati","ror":"https://ror.org/01e3m7079","country_code":"US","type":"education","lineage":["https://openalex.org/I63135867"]}],"countries":["US"],"is_corresponding":true,"raw_author_name":"Dennis Gibson","raw_affiliation_strings":["ECECS Department, University of Cincinnati, Cincinnati, OH, 45221","ECECS Department, University of Cincinnati, Cincinnati,  OH 45221"],"affiliations":[{"raw_affiliation_string":"ECECS Department, University of Cincinnati, Cincinnati, OH, 45221","institution_ids":["https://openalex.org/I63135867"]},{"raw_affiliation_string":"ECECS Department, University of Cincinnati, Cincinnati,  OH 45221","institution_ids":["https://openalex.org/I63135867"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5110492453","display_name":"Carla Purdy","orcid":null},"institutions":[{"id":"https://openalex.org/I63135867","display_name":"University of Cincinnati","ror":"https://ror.org/01e3m7079","country_code":"US","type":"education","lineage":["https://openalex.org/I63135867"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Carla Purdy","raw_affiliation_strings":["ECECS Department, University of Cincinnati, 7723 Joseph St., Cincinnati, OH, 45231","ECECS Department, University of Cincinnati, 7723 Joseph St.,  Cincinnati, OH 45231"],"affiliations":[{"raw_affiliation_string":"ECECS Department, University of Cincinnati, 7723 Joseph St., Cincinnati, OH, 45231","institution_ids":["https://openalex.org/I63135867"]},{"raw_affiliation_string":"ECECS Department, University of Cincinnati, 7723 Joseph St.,  Cincinnati, OH 45231","institution_ids":["https://openalex.org/I63135867"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":2,"corresponding_author_ids":["https://openalex.org/A5108109051"],"corresponding_institution_ids":["https://openalex.org/I63135867"],"apc_list":null,"apc_paid":null,"fwci":0.4662,"has_fulltext":false,"cited_by_count":3,"citation_normalized_percentile":{"value":0.62765957,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":null,"biblio":{"volume":"22","issue":"2","first_page":"135","last_page":"146"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10369","display_name":"Advanced MEMS and NEMS Technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10369","display_name":"Advanced MEMS and NEMS Technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10299","display_name":"Photonic and Optical Devices","score":0.9990000128746033,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11301","display_name":"Advanced Surface Polishing Techniques","score":0.9945999979972839,"subfield":{"id":"https://openalex.org/subfields/2204","display_name":"Biomedical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/microelectromechanical-systems","display_name":"Microelectromechanical systems","score":0.7815282344818115},{"id":"https://openalex.org/keywords/cantilever","display_name":"Cantilever","score":0.6860759854316711},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.6691773533821106},{"id":"https://openalex.org/keywords/very-large-scale-integration","display_name":"Very-large-scale integration","score":0.5758291482925415},{"id":"https://openalex.org/keywords/process","display_name":"Process (computing)","score":0.5596715211868286},{"id":"https://openalex.org/keywords/fabrication","display_name":"Fabrication","score":0.4385083317756653},{"id":"https://openalex.org/keywords/engineering-drawing","display_name":"Engineering drawing","score":0.3996883034706116},{"id":"https://openalex.org/keywords/systems-engineering","display_name":"Systems engineering","score":0.3445882201194763},{"id":"https://openalex.org/keywords/embedded-system","display_name":"Embedded system","score":0.2659878730773926},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.1946660578250885},{"id":"https://openalex.org/keywords/programming-language","display_name":"Programming language","score":0.12622720003128052},{"id":"https://openalex.org/keywords/aerospace-engineering","display_name":"Aerospace engineering","score":0.10626095533370972},{"id":"https://openalex.org/keywords/nanotechnology","display_name":"Nanotechnology","score":0.10263937711715698},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.08360737562179565}],"concepts":[{"id":"https://openalex.org/C37977207","wikidata":"https://www.wikidata.org/wiki/Q175561","display_name":"Microelectromechanical systems","level":2,"score":0.7815282344818115},{"id":"https://openalex.org/C141354745","wikidata":"https://www.wikidata.org/wiki/Q17227","display_name":"Cantilever","level":2,"score":0.6860759854316711},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.6691773533821106},{"id":"https://openalex.org/C14580979","wikidata":"https://www.wikidata.org/wiki/Q876049","display_name":"Very-large-scale integration","level":2,"score":0.5758291482925415},{"id":"https://openalex.org/C98045186","wikidata":"https://www.wikidata.org/wiki/Q205663","display_name":"Process (computing)","level":2,"score":0.5596715211868286},{"id":"https://openalex.org/C136525101","wikidata":"https://www.wikidata.org/wiki/Q5428139","display_name":"Fabrication","level":3,"score":0.4385083317756653},{"id":"https://openalex.org/C199639397","wikidata":"https://www.wikidata.org/wiki/Q1788588","display_name":"Engineering drawing","level":1,"score":0.3996883034706116},{"id":"https://openalex.org/C201995342","wikidata":"https://www.wikidata.org/wiki/Q682496","display_name":"Systems engineering","level":1,"score":0.3445882201194763},{"id":"https://openalex.org/C149635348","wikidata":"https://www.wikidata.org/wiki/Q193040","display_name":"Embedded system","level":1,"score":0.2659878730773926},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.1946660578250885},{"id":"https://openalex.org/C199360897","wikidata":"https://www.wikidata.org/wiki/Q9143","display_name":"Programming language","level":1,"score":0.12622720003128052},{"id":"https://openalex.org/C146978453","wikidata":"https://www.wikidata.org/wiki/Q3798668","display_name":"Aerospace engineering","level":1,"score":0.10626095533370972},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.10263937711715698},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.08360737562179565},{"id":"https://openalex.org/C71924100","wikidata":"https://www.wikidata.org/wiki/Q11190","display_name":"Medicine","level":0,"score":0.0},{"id":"https://openalex.org/C204787440","wikidata":"https://www.wikidata.org/wiki/Q188504","display_name":"Alternative medicine","level":2,"score":0.0},{"id":"https://openalex.org/C142724271","wikidata":"https://www.wikidata.org/wiki/Q7208","display_name":"Pathology","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1023/a:1008151424166","is_oa":false,"landing_page_url":"https://doi.org/10.1023/a:1008151424166","pdf_url":null,"source":{"id":"https://openalex.org/S4210233059","display_name":"The Journal of VLSI Signal Processing Systems for Signal Image and Video Technology","issn_l":"0922-5773","issn":["0922-5773","1573-109X"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319900","host_organization_name":"Springer Science+Business Media","host_organization_lineage":["https://openalex.org/P4310319900","https://openalex.org/P4310319965"],"host_organization_lineage_names":["Springer Science+Business Media","Springer Nature"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Journal of VLSI signal processing systems for signal, image and video technology","raw_type":"journal-article"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":10,"referenced_works":["https://openalex.org/W1518577295","https://openalex.org/W1586602118","https://openalex.org/W1612551514","https://openalex.org/W1666015432","https://openalex.org/W2049819040","https://openalex.org/W2062484728","https://openalex.org/W2083446361","https://openalex.org/W2108750784","https://openalex.org/W2137178805","https://openalex.org/W2982723241"],"related_works":["https://openalex.org/W2107125189","https://openalex.org/W2760996480","https://openalex.org/W2303727101","https://openalex.org/W2368223165","https://openalex.org/W2357307510","https://openalex.org/W2104720263","https://openalex.org/W1966104931","https://openalex.org/W2048171849","https://openalex.org/W1582916970","https://openalex.org/W2085527795"],"abstract_inverted_index":null,"counts_by_year":[],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2016-06-24T00:00:00"}