{"id":"https://openalex.org/W2159732133","doi":"https://doi.org/10.1017/s0890060400002171","title":"A parametric design assistant for concurrent engineering","display_name":"A parametric design assistant for concurrent engineering","publication_year":1995,"publication_date":"1995-04-01","ids":{"openalex":"https://openalex.org/W2159732133","doi":"https://doi.org/10.1017/s0890060400002171","mag":"2159732133"},"language":"en","primary_location":{"id":"doi:10.1017/s0890060400002171","is_oa":false,"landing_page_url":"https://doi.org/10.1017/s0890060400002171","pdf_url":null,"source":{"id":"https://openalex.org/S4210193102","display_name":"Artificial intelligence for engineering design analysis and manufacturing","issn_l":"0890-0604","issn":["0890-0604","1469-1760"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310311721","host_organization_name":"Cambridge University Press","host_organization_lineage":["https://openalex.org/P4310311721","https://openalex.org/P4310311702"],"host_organization_lineage_names":["Cambridge University Press","University of Cambridge"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Artificial Intelligence for Engineering Design, Analysis and Manufacturing","raw_type":"journal-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5075215544","display_name":"Daniel Kuokka","orcid":null},"institutions":[{"id":"https://openalex.org/I1324840837","display_name":"Hewlett-Packard (United States)","ror":"https://ror.org/059rn9488","country_code":"US","type":"company","lineage":["https://openalex.org/I1324840837"]}],"countries":["US"],"is_corresponding":true,"raw_author_name":"Daniel Kuokka","raw_affiliation_strings":["Hewlett-Packard Laboratories, 3500 Deer Creek Road, Palo Alto, CA 94304, U.S.A"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Hewlett-Packard Laboratories, 3500 Deer Creek Road, Palo Alto, CA 94304, U.S.A","institution_ids":["https://openalex.org/I1324840837"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5055210161","display_name":"Stanley Jefferson","orcid":null},"institutions":[{"id":"https://openalex.org/I1324840837","display_name":"Hewlett-Packard (United States)","ror":"https://ror.org/059rn9488","country_code":"US","type":"company","lineage":["https://openalex.org/I1324840837"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Stanley Jefferson","raw_affiliation_strings":["Hewlett-Packard Laboratories, 3500 Deer Creek Road, Palo Alto, CA 94304, U.S.A"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Hewlett-Packard Laboratories, 3500 Deer Creek Road, Palo Alto, CA 94304, U.S.A","institution_ids":["https://openalex.org/I1324840837"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5071954106","display_name":"Lee Barford","orcid":"https://orcid.org/0000-0003-0938-914X"},"institutions":[{"id":"https://openalex.org/I1324840837","display_name":"Hewlett-Packard (United States)","ror":"https://ror.org/059rn9488","country_code":"US","type":"company","lineage":["https://openalex.org/I1324840837"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Lee Barford","raw_affiliation_strings":["Hewlett-Packard Laboratories, 3500 Deer Creek Road, Palo Alto, CA 94304, U.S.A"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Hewlett-Packard Laboratories, 3500 Deer Creek Road, Palo Alto, CA 94304, U.S.A","institution_ids":["https://openalex.org/I1324840837"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5065021282","display_name":"Felix Frayman","orcid":null},"institutions":[{"id":"https://openalex.org/I1324840837","display_name":"Hewlett-Packard (United States)","ror":"https://ror.org/059rn9488","country_code":"US","type":"company","lineage":["https://openalex.org/I1324840837"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Felix Frayman","raw_affiliation_strings":["Hewlett-Packard Laboratories, 3500 Deer Creek Road, Palo Alto, CA 94304, U.S.A"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Hewlett-Packard Laboratories, 3500 Deer Creek Road, Palo Alto, CA 94304, U.S.A","institution_ids":["https://openalex.org/I1324840837"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":4,"corresponding_author_ids":["https://openalex.org/A5075215544"],"corresponding_institution_ids":["https://openalex.org/I1324840837"],"apc_list":null,"apc_paid":null,"fwci":2.3567,"has_fulltext":false,"cited_by_count":7,"citation_normalized_percentile":{"value":0.88976378,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":null,"biblio":{"volume":"9","issue":"2","first_page":"135","last_page":"144"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11159","display_name":"Manufacturing Process and Optimization","score":0.9976999759674072,"subfield":{"id":"https://openalex.org/subfields/2209","display_name":"Industrial and Manufacturing Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11159","display_name":"Manufacturing Process and Optimization","score":0.9976999759674072,"subfield":{"id":"https://openalex.org/subfields/2209","display_name":"Industrial and Manufacturing Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10703","display_name":"Business Process Modeling and Analysis","score":0.9900000095367432,"subfield":{"id":"https://openalex.org/subfields/1404","display_name":"Management Information Systems"},"field":{"id":"https://openalex.org/fields/14","display_name":"Business, Management and Accounting"},"domain":{"id":"https://openalex.org/domains/2","display_name":"Social Sciences"}},{"id":"https://openalex.org/T10215","display_name":"Semantic Web and Ontologies","score":0.9865000247955322,"subfield":{"id":"https://openalex.org/subfields/1702","display_name":"Artificial Intelligence"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/design-for-manufacturability","display_name":"Design for manufacturability","score":0.7431017756462097},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.729653537273407},{"id":"https://openalex.org/keywords/parametric-statistics","display_name":"Parametric statistics","score":0.6009423732757568},{"id":"https://openalex.org/keywords/concurrent-engineering","display_name":"Concurrent engineering","score":0.5367544889450073},{"id":"https://openalex.org/keywords/reliability","display_name":"Reliability (semiconductor)","score":0.5362284779548645},{"id":"https://openalex.org/keywords/constraint","display_name":"Constraint (computer-aided design)","score":0.5089032649993896},{"id":"https://openalex.org/keywords/parametric-design","display_name":"Parametric design","score":0.43972504138946533},{"id":"https://openalex.org/keywords/software-engineering","display_name":"Software engineering","score":0.3769541084766388},{"id":"https://openalex.org/keywords/reliability-engineering","display_name":"Reliability engineering","score":0.37368786334991455},{"id":"https://openalex.org/keywords/distributed-computing","display_name":"Distributed computing","score":0.3506552577018738},{"id":"https://openalex.org/keywords/systems-engineering","display_name":"Systems engineering","score":0.3218899369239807},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.1517583727836609}],"concepts":[{"id":"https://openalex.org/C62064638","wikidata":"https://www.wikidata.org/wiki/Q553878","display_name":"Design for manufacturability","level":2,"score":0.7431017756462097},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.729653537273407},{"id":"https://openalex.org/C117251300","wikidata":"https://www.wikidata.org/wiki/Q1849855","display_name":"Parametric statistics","level":2,"score":0.6009423732757568},{"id":"https://openalex.org/C78382760","wikidata":"https://www.wikidata.org/wiki/Q2288649","display_name":"Concurrent engineering","level":3,"score":0.5367544889450073},{"id":"https://openalex.org/C43214815","wikidata":"https://www.wikidata.org/wiki/Q7310987","display_name":"Reliability (semiconductor)","level":3,"score":0.5362284779548645},{"id":"https://openalex.org/C2776036281","wikidata":"https://www.wikidata.org/wiki/Q48769818","display_name":"Constraint (computer-aided design)","level":2,"score":0.5089032649993896},{"id":"https://openalex.org/C2778370241","wikidata":"https://www.wikidata.org/wiki/Q18386598","display_name":"Parametric design","level":3,"score":0.43972504138946533},{"id":"https://openalex.org/C115903868","wikidata":"https://www.wikidata.org/wiki/Q80993","display_name":"Software engineering","level":1,"score":0.3769541084766388},{"id":"https://openalex.org/C200601418","wikidata":"https://www.wikidata.org/wiki/Q2193887","display_name":"Reliability engineering","level":1,"score":0.37368786334991455},{"id":"https://openalex.org/C120314980","wikidata":"https://www.wikidata.org/wiki/Q180634","display_name":"Distributed computing","level":1,"score":0.3506552577018738},{"id":"https://openalex.org/C201995342","wikidata":"https://www.wikidata.org/wiki/Q682496","display_name":"Systems engineering","level":1,"score":0.3218899369239807},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.1517583727836609},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.0},{"id":"https://openalex.org/C21880701","wikidata":"https://www.wikidata.org/wiki/Q2144042","display_name":"Process engineering","level":1,"score":0.0},{"id":"https://openalex.org/C62520636","wikidata":"https://www.wikidata.org/wiki/Q944","display_name":"Quantum mechanics","level":1,"score":0.0},{"id":"https://openalex.org/C105795698","wikidata":"https://www.wikidata.org/wiki/Q12483","display_name":"Statistics","level":1,"score":0.0},{"id":"https://openalex.org/C78519656","wikidata":"https://www.wikidata.org/wiki/Q101333","display_name":"Mechanical engineering","level":1,"score":0.0},{"id":"https://openalex.org/C163258240","wikidata":"https://www.wikidata.org/wiki/Q25342","display_name":"Power (physics)","level":2,"score":0.0},{"id":"https://openalex.org/C33923547","wikidata":"https://www.wikidata.org/wiki/Q395","display_name":"Mathematics","level":0,"score":0.0},{"id":"https://openalex.org/C54725748","wikidata":"https://www.wikidata.org/wiki/Q7247277","display_name":"Process integration","level":2,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1017/s0890060400002171","is_oa":false,"landing_page_url":"https://doi.org/10.1017/s0890060400002171","pdf_url":null,"source":{"id":"https://openalex.org/S4210193102","display_name":"Artificial intelligence for engineering design analysis and manufacturing","issn_l":"0890-0604","issn":["0890-0604","1469-1760"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310311721","host_organization_name":"Cambridge University Press","host_organization_lineage":["https://openalex.org/P4310311721","https://openalex.org/P4310311702"],"host_organization_lineage_names":["Cambridge University Press","University of Cambridge"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Artificial Intelligence for Engineering Design, Analysis and Manufacturing","raw_type":"journal-article"}],"best_oa_location":null,"sustainable_development_goals":[{"score":0.44999998807907104,"id":"https://metadata.un.org/sdg/9","display_name":"Industry, innovation and infrastructure"}],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":10,"referenced_works":["https://openalex.org/W137472212","https://openalex.org/W1514583064","https://openalex.org/W1570696636","https://openalex.org/W1602837481","https://openalex.org/W2168903627","https://openalex.org/W2212036697","https://openalex.org/W2329244424","https://openalex.org/W2489748212","https://openalex.org/W2788164529","https://openalex.org/W2913256821"],"related_works":["https://openalex.org/W4283465125","https://openalex.org/W2354723305","https://openalex.org/W2563719012","https://openalex.org/W2054180169","https://openalex.org/W2505604510","https://openalex.org/W1968058765","https://openalex.org/W1875061627","https://openalex.org/W2884064813","https://openalex.org/W3126633217","https://openalex.org/W2046313895"],"abstract_inverted_index":{"Abstract":[0],"The":[1,23,112],"Explorer":[2,73,89,118],"parametric":[3],"design":[4,84,95],"assistant,":[5],"an":[6,130],"interactive":[7,49],"tool":[8],"that":[9,100],"provides":[10,25,56],"intelligent":[11],"support":[12],"for":[13,29],"searching":[14],"concurrent-engineering":[15],"trade-spaces":[16],"under":[17],"multiple,":[18,31],"conflicting":[19],"objectives,":[20],"is":[21,136],"described.":[22],"system":[24,47,119,135],"a":[26,70,78],"convenient":[27],"means":[28],"specifying":[30],"cross-disciplinary":[32],"constraints":[33],"in":[34,122],"terms":[35],"of":[36,116,132],"tables,":[37],"formulas,":[38],"and":[39,55,104,110,114,129],"logical":[40],"sentences.":[41],"Based":[42],"on":[43,66],"these":[44],"data,":[45],"the":[46,117,124,133],"performs":[48],"constraint":[50],"checking,":[51],"computes":[52],"feasible":[53],"designs,":[54],"graphical":[57],"analysis":[58],"facilities,":[59],"allowing":[60],"users":[61,92],"to":[62,93],"compare":[63],"designs":[64],"based":[65],"multiple":[67],"criteria.":[68],"As":[69],"first":[71],"application,":[72],"has":[74,90],"been":[75],"used":[76],"as":[77],"printed":[79],"circuit":[80],"board":[81],"(PCB)":[82],"construction":[83],"assistant.":[85],"In":[86],"initial":[87],"tests,":[88],"helped":[91],"find":[94],"configurations":[96],"not":[97],"previously":[98],"considered":[99],"yield":[101],"comparable":[102],"performance":[103],"cost":[105],"while":[106],"offering":[107],"better":[108],"manufacturability":[109],"reliability.":[111],"capabilities":[113],"use":[115],"are":[120,127],"described":[121],"detail,":[123],"underlying":[125],"technologies":[126],"outlined,":[128],"evaluation":[131],"prototype":[134],"presented.":[137]},"counts_by_year":[],"updated_date":"2026-05-21T09:19:25.381259","created_date":"2025-10-10T00:00:00"}