{"id":"https://openalex.org/W2037303235","doi":"https://doi.org/10.1016/s0026-2714(03)00184-7","title":"Comprehensive board-level solder joint reliability modeling and testing of QFN and PowerQFN packages","display_name":"Comprehensive board-level solder joint reliability modeling and testing of QFN and PowerQFN packages","publication_year":2003,"publication_date":"2003-07-22","ids":{"openalex":"https://openalex.org/W2037303235","doi":"https://doi.org/10.1016/s0026-2714(03)00184-7","mag":"2037303235"},"language":"en","primary_location":{"id":"doi:10.1016/s0026-2714(03)00184-7","is_oa":false,"landing_page_url":"https://doi.org/10.1016/s0026-2714(03)00184-7","pdf_url":null,"source":{"id":"https://openalex.org/S133646729","display_name":"Microelectronics Reliability","issn_l":"0026-2714","issn":["0026-2714","1872-941X"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310320990","host_organization_name":"Elsevier BV","host_organization_lineage":["https://openalex.org/P4310320990"],"host_organization_lineage_names":["Elsevier BV"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Microelectronics Reliability","raw_type":"journal-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5020540772","display_name":"Tong Yan Tee","orcid":null},"institutions":[{"id":"https://openalex.org/I4210133433","display_name":"STMicroelectronics (Singapore)","ror":"https://ror.org/030c4gr60","country_code":"SG","type":"company","lineage":["https://openalex.org/I131827901","https://openalex.org/I4210133433"]}],"countries":["SG"],"is_corresponding":true,"raw_author_name":"Tong Yan Tee","raw_affiliation_strings":["STMicroelectronics, 629 Lorong 4/6 Toa Payoh, Singapore 319521, Singapore"],"affiliations":[{"raw_affiliation_string":"STMicroelectronics, 629 Lorong 4/6 Toa Payoh, Singapore 319521, Singapore","institution_ids":["https://openalex.org/I4210133433"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5032563301","display_name":"Hun Shen Ng","orcid":null},"institutions":[{"id":"https://openalex.org/I4210133433","display_name":"STMicroelectronics (Singapore)","ror":"https://ror.org/030c4gr60","country_code":"SG","type":"company","lineage":["https://openalex.org/I131827901","https://openalex.org/I4210133433"]}],"countries":["SG"],"is_corresponding":false,"raw_author_name":"Hun Shen Ng","raw_affiliation_strings":["STMicroelectronics, 629 Lorong 4/6 Toa Payoh, Singapore 319521, Singapore"],"affiliations":[{"raw_affiliation_string":"STMicroelectronics, 629 Lorong 4/6 Toa Payoh, Singapore 319521, Singapore","institution_ids":["https://openalex.org/I4210133433"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5033766749","display_name":"D. Yap","orcid":null},"institutions":[{"id":"https://openalex.org/I4210133433","display_name":"STMicroelectronics (Singapore)","ror":"https://ror.org/030c4gr60","country_code":"SG","type":"company","lineage":["https://openalex.org/I131827901","https://openalex.org/I4210133433"]}],"countries":["SG"],"is_corresponding":false,"raw_author_name":"Daniel Yap","raw_affiliation_strings":["STMicroelectronics, 629 Lorong 4/6 Toa Payoh, Singapore 319521, Singapore"],"affiliations":[{"raw_affiliation_string":"STMicroelectronics, 629 Lorong 4/6 Toa Payoh, Singapore 319521, Singapore","institution_ids":["https://openalex.org/I4210133433"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5100714988","display_name":"Z.W. Zhong","orcid":"https://orcid.org/0000-0002-0762-3580"},"institutions":[{"id":"https://openalex.org/I172675005","display_name":"Nanyang Technological University","ror":"https://ror.org/02e7b5302","country_code":"SG","type":"education","lineage":["https://openalex.org/I172675005"]}],"countries":["SG"],"is_corresponding":false,"raw_author_name":"Zhaowei Zhong","raw_affiliation_strings":["School of MPE, Nanyang Technological University, 50 Nanyang Avenue, Singapore 639798, Singapore"],"affiliations":[{"raw_affiliation_string":"School of MPE, Nanyang Technological University, 50 Nanyang Avenue, Singapore 639798, Singapore","institution_ids":["https://openalex.org/I172675005"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":4,"corresponding_author_ids":["https://openalex.org/A5020540772"],"corresponding_institution_ids":["https://openalex.org/I4210133433"],"apc_list":{"value":2190,"currency":"USD","value_usd":2190},"apc_paid":null,"fwci":3.1728,"has_fulltext":false,"cited_by_count":52,"citation_normalized_percentile":{"value":0.91505808,"is_in_top_1_percent":false,"is_in_top_10_percent":true},"cited_by_percentile_year":{"min":89,"max":98},"biblio":{"volume":"43","issue":"8","first_page":"1329","last_page":"1338"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.9998000264167786,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.9998000264167786,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.9976999759674072,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11444","display_name":"Electromagnetic Compatibility and Noise Suppression","score":0.9896000027656555,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/quad-flat-no-leads-package","display_name":"Quad Flat No-leads package","score":0.9781787395477295},{"id":"https://openalex.org/keywords/reliability","display_name":"Reliability (semiconductor)","score":0.6371057629585266},{"id":"https://openalex.org/keywords/reliability-engineering","display_name":"Reliability engineering","score":0.5812425017356873},{"id":"https://openalex.org/keywords/soldering","display_name":"Soldering","score":0.5811886787414551},{"id":"https://openalex.org/keywords/joint","display_name":"Joint (building)","score":0.5476072430610657},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.4402756094932556},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.3678269386291504},{"id":"https://openalex.org/keywords/structural-engineering","display_name":"Structural engineering","score":0.2369179129600525},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.141880065202713},{"id":"https://openalex.org/keywords/metallurgy","display_name":"Metallurgy","score":0.09579086303710938},{"id":"https://openalex.org/keywords/composite-material","display_name":"Composite material","score":0.08534151315689087}],"concepts":[{"id":"https://openalex.org/C162877825","wikidata":"https://www.wikidata.org/wiki/Q2121809","display_name":"Quad Flat No-leads package","level":4,"score":0.9781787395477295},{"id":"https://openalex.org/C43214815","wikidata":"https://www.wikidata.org/wiki/Q7310987","display_name":"Reliability (semiconductor)","level":3,"score":0.6371057629585266},{"id":"https://openalex.org/C200601418","wikidata":"https://www.wikidata.org/wiki/Q2193887","display_name":"Reliability engineering","level":1,"score":0.5812425017356873},{"id":"https://openalex.org/C50296614","wikidata":"https://www.wikidata.org/wiki/Q211387","display_name":"Soldering","level":2,"score":0.5811886787414551},{"id":"https://openalex.org/C18555067","wikidata":"https://www.wikidata.org/wiki/Q8375051","display_name":"Joint (building)","level":2,"score":0.5476072430610657},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.4402756094932556},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.3678269386291504},{"id":"https://openalex.org/C66938386","wikidata":"https://www.wikidata.org/wiki/Q633538","display_name":"Structural engineering","level":1,"score":0.2369179129600525},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.141880065202713},{"id":"https://openalex.org/C191897082","wikidata":"https://www.wikidata.org/wiki/Q11467","display_name":"Metallurgy","level":1,"score":0.09579086303710938},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.08534151315689087},{"id":"https://openalex.org/C163258240","wikidata":"https://www.wikidata.org/wiki/Q25342","display_name":"Power (physics)","level":2,"score":0.0},{"id":"https://openalex.org/C68928338","wikidata":"https://www.wikidata.org/wiki/Q131790","display_name":"Adhesive","level":3,"score":0.0},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.0},{"id":"https://openalex.org/C62520636","wikidata":"https://www.wikidata.org/wiki/Q944","display_name":"Quantum mechanics","level":1,"score":0.0},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1016/s0026-2714(03)00184-7","is_oa":false,"landing_page_url":"https://doi.org/10.1016/s0026-2714(03)00184-7","pdf_url":null,"source":{"id":"https://openalex.org/S133646729","display_name":"Microelectronics Reliability","issn_l":"0026-2714","issn":["0026-2714","1872-941X"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310320990","host_organization_name":"Elsevier BV","host_organization_lineage":["https://openalex.org/P4310320990"],"host_organization_lineage_names":["Elsevier BV"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Microelectronics Reliability","raw_type":"journal-article"}],"best_oa_location":null,"sustainable_development_goals":[{"display_name":"Affordable and clean energy","score":0.44999998807907104,"id":"https://metadata.un.org/sdg/7"}],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":11,"referenced_works":["https://openalex.org/W567677580","https://openalex.org/W1915958641","https://openalex.org/W1932765511","https://openalex.org/W2093993867","https://openalex.org/W2120404135","https://openalex.org/W2134216772","https://openalex.org/W2150421174","https://openalex.org/W2153884005","https://openalex.org/W2156829941","https://openalex.org/W2165044554","https://openalex.org/W2254820849"],"related_works":["https://openalex.org/W2359630309","https://openalex.org/W2223877278","https://openalex.org/W1985302311","https://openalex.org/W2979329063","https://openalex.org/W152706197","https://openalex.org/W2033512842","https://openalex.org/W4322734194","https://openalex.org/W3005535424","https://openalex.org/W4233600955","https://openalex.org/W2913665393"],"abstract_inverted_index":null,"counts_by_year":[{"year":2025,"cited_by_count":2},{"year":2024,"cited_by_count":3},{"year":2023,"cited_by_count":2},{"year":2021,"cited_by_count":2},{"year":2020,"cited_by_count":3},{"year":2018,"cited_by_count":5},{"year":2017,"cited_by_count":3},{"year":2016,"cited_by_count":3},{"year":2015,"cited_by_count":3},{"year":2014,"cited_by_count":5},{"year":2013,"cited_by_count":3},{"year":2012,"cited_by_count":1}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}