{"id":"https://openalex.org/W1995116090","doi":"https://doi.org/10.1016/s0026-2714(01)00258-x","title":"A thermo-mechanical study on the electrical resistance of aluminum wire conductors","display_name":"A thermo-mechanical study on the electrical resistance of aluminum wire conductors","publication_year":2002,"publication_date":"2002-03-01","ids":{"openalex":"https://openalex.org/W1995116090","doi":"https://doi.org/10.1016/s0026-2714(01)00258-x","mag":"1995116090"},"language":"en","primary_location":{"id":"doi:10.1016/s0026-2714(01)00258-x","is_oa":false,"landing_page_url":"https://doi.org/10.1016/s0026-2714(01)00258-x","pdf_url":null,"source":{"id":"https://openalex.org/S133646729","display_name":"Microelectronics Reliability","issn_l":"0026-2714","issn":["0026-2714","1872-941X"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310320990","host_organization_name":"Elsevier BV","host_organization_lineage":["https://openalex.org/P4310320990"],"host_organization_lineage_names":["Elsevier BV"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Microelectronics Reliability","raw_type":"journal-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5088075975","display_name":"De\u2010Shin Liu","orcid":"https://orcid.org/0000-0002-3613-3206"},"institutions":[{"id":"https://openalex.org/I148099254","display_name":"National Chung Cheng University","ror":"https://ror.org/0028v3876","country_code":"TW","type":"education","lineage":["https://openalex.org/I148099254"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"De-Shin Liu","raw_affiliation_strings":["Department of Mechanical Engineering, National Chung Cheng University, 160, San-Hsing, Ming-Hsiung, Chia-Yi 621, Taiwan, ROC"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Mechanical Engineering, National Chung Cheng University, 160, San-Hsing, Ming-Hsiung, Chia-Yi 621, Taiwan, ROC","institution_ids":["https://openalex.org/I148099254"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5111926895","display_name":"Chin-Yu Ni","orcid":null},"institutions":[{"id":"https://openalex.org/I148099254","display_name":"National Chung Cheng University","ror":"https://ror.org/0028v3876","country_code":"TW","type":"education","lineage":["https://openalex.org/I148099254"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"Chin-Yu Ni","raw_affiliation_strings":["Department of Mechanical Engineering, National Chung Cheng University, 160, San-Hsing, Ming-Hsiung, Chia-Yi 621, Taiwan, ROC"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Mechanical Engineering, National Chung Cheng University, 160, San-Hsing, Ming-Hsiung, Chia-Yi 621, Taiwan, ROC","institution_ids":["https://openalex.org/I148099254"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":1,"corresponding_author_ids":[],"corresponding_institution_ids":["https://openalex.org/I148099254"],"apc_list":{"value":2190,"currency":"USD","value_usd":2190},"apc_paid":null,"fwci":0.3433,"has_fulltext":false,"cited_by_count":10,"citation_normalized_percentile":{"value":0.57468145,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":94},"biblio":{"volume":"42","issue":"3","first_page":"367","last_page":"374"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.9991999864578247,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11661","display_name":"Copper Interconnects and Reliability","score":0.9961000084877014,"subfield":{"id":"https://openalex.org/subfields/2504","display_name":"Electronic, Optical and Magnetic Materials"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/electrical-conductor","display_name":"Electrical conductor","score":0.7432982921600342},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.6134979724884033},{"id":"https://openalex.org/keywords/aluminium","display_name":"Aluminium","score":0.5856624245643616},{"id":"https://openalex.org/keywords/electrical-resistance-and-conductance","display_name":"Electrical resistance and conductance","score":0.5828282237052917},{"id":"https://openalex.org/keywords/composite-material","display_name":"Composite material","score":0.4891667664051056},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.3966785669326782},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.23837754130363464}],"concepts":[{"id":"https://openalex.org/C202374169","wikidata":"https://www.wikidata.org/wiki/Q124291","display_name":"Electrical conductor","level":2,"score":0.7432982921600342},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.6134979724884033},{"id":"https://openalex.org/C513153333","wikidata":"https://www.wikidata.org/wiki/Q663","display_name":"Aluminium","level":2,"score":0.5856624245643616},{"id":"https://openalex.org/C94857076","wikidata":"https://www.wikidata.org/wiki/Q106603432","display_name":"Electrical resistance and conductance","level":2,"score":0.5828282237052917},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.4891667664051056},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.3966785669326782},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.23837754130363464}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1016/s0026-2714(01)00258-x","is_oa":false,"landing_page_url":"https://doi.org/10.1016/s0026-2714(01)00258-x","pdf_url":null,"source":{"id":"https://openalex.org/S133646729","display_name":"Microelectronics Reliability","issn_l":"0026-2714","issn":["0026-2714","1872-941X"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310320990","host_organization_name":"Elsevier BV","host_organization_lineage":["https://openalex.org/P4310320990"],"host_organization_lineage_names":["Elsevier BV"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Microelectronics Reliability","raw_type":"journal-article"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":8,"referenced_works":["https://openalex.org/W657996384","https://openalex.org/W1989333489","https://openalex.org/W1990719492","https://openalex.org/W2060461515","https://openalex.org/W2100915576","https://openalex.org/W2150259883","https://openalex.org/W2170560481","https://openalex.org/W2798741486"],"related_works":["https://openalex.org/W2899084033","https://openalex.org/W3082440218","https://openalex.org/W2380293314","https://openalex.org/W2943188944","https://openalex.org/W2137307547","https://openalex.org/W2066776083","https://openalex.org/W1979963384","https://openalex.org/W2900524175","https://openalex.org/W2971226466","https://openalex.org/W2331308819"],"abstract_inverted_index":null,"counts_by_year":[{"year":2024,"cited_by_count":1},{"year":2023,"cited_by_count":1},{"year":2020,"cited_by_count":1}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}