{"id":"https://openalex.org/W2894701434","doi":"https://doi.org/10.1016/j.microrel.2018.06.050","title":"Water cold plates for high power converters: A software tool for easy optimized design","display_name":"Water cold plates for high power converters: A software tool for easy optimized design","publication_year":2018,"publication_date":"2018-09-01","ids":{"openalex":"https://openalex.org/W2894701434","doi":"https://doi.org/10.1016/j.microrel.2018.06.050","mag":"2894701434"},"language":"en","primary_location":{"id":"doi:10.1016/j.microrel.2018.06.050","is_oa":false,"landing_page_url":"https://doi.org/10.1016/j.microrel.2018.06.050","pdf_url":null,"source":{"id":"https://openalex.org/S133646729","display_name":"Microelectronics Reliability","issn_l":"0026-2714","issn":["0026-2714","1872-941X"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310320990","host_organization_name":"Elsevier BV","host_organization_lineage":["https://openalex.org/P4310320990"],"host_organization_lineage_names":["Elsevier BV"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Microelectronics Reliability","raw_type":"journal-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5065975368","display_name":"P. Cova","orcid":"https://orcid.org/0000-0003-0040-098X"},"institutions":[{"id":"https://openalex.org/I124601658","display_name":"University of Parma","ror":"https://ror.org/02k7wn190","country_code":"IT","type":"education","lineage":["https://openalex.org/I124601658"]}],"countries":["IT"],"is_corresponding":true,"raw_author_name":"P. Cova","raw_affiliation_strings":["Dipartimento di Ingegneria e Architettura, University of Parma, Parma, Italy"],"raw_orcid":"https://orcid.org/0000-0003-0040-098X","affiliations":[{"raw_affiliation_string":"Dipartimento di Ingegneria e Architettura, University of Parma, Parma, Italy","institution_ids":["https://openalex.org/I124601658"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5063439216","display_name":"N. Delmonte","orcid":null},"institutions":[{"id":"https://openalex.org/I124601658","display_name":"University of Parma","ror":"https://ror.org/02k7wn190","country_code":"IT","type":"education","lineage":["https://openalex.org/I124601658"]}],"countries":["IT"],"is_corresponding":false,"raw_author_name":"N. Delmonte","raw_affiliation_strings":["Dipartimento di Ingegneria e Architettura, University of Parma, Parma, Italy"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Dipartimento di Ingegneria e Architettura, University of Parma, Parma, Italy","institution_ids":["https://openalex.org/I124601658"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5057820384","display_name":"D. Chiozzi","orcid":"https://orcid.org/0000-0001-8945-5404"},"institutions":[{"id":"https://openalex.org/I124601658","display_name":"University of Parma","ror":"https://ror.org/02k7wn190","country_code":"IT","type":"education","lineage":["https://openalex.org/I124601658"]}],"countries":["IT"],"is_corresponding":false,"raw_author_name":"D. Chiozzi","raw_affiliation_strings":["Dipartimento di Ingegneria e Architettura, University of Parma, Parma, Italy"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Dipartimento di Ingegneria e Architettura, University of Parma, Parma, Italy","institution_ids":["https://openalex.org/I124601658"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5038499667","display_name":"M. Portesine","orcid":null},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"M. Portesine","raw_affiliation_strings":["POSEICO S.p.A., Genova, Italy"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"POSEICO S.p.A., Genova, Italy","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5006943833","display_name":"Filippo Vaccaro","orcid":null},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"F. Vaccaro","raw_affiliation_strings":["POSEICO S.p.A., Genova, Italy"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"POSEICO S.p.A., Genova, Italy","institution_ids":[]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5085669411","display_name":"E. Mantegazza","orcid":null},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"E. Mantegazza","raw_affiliation_strings":["POSEICO S.p.A., Genova, Italy"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"POSEICO S.p.A., Genova, Italy","institution_ids":[]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":6,"corresponding_author_ids":["https://openalex.org/A5065975368"],"corresponding_institution_ids":["https://openalex.org/I124601658"],"apc_list":{"value":2190,"currency":"USD","value_usd":2190},"apc_paid":null,"fwci":0.6834,"has_fulltext":false,"cited_by_count":8,"citation_normalized_percentile":{"value":0.69602666,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":98},"biblio":{"volume":"88-90","issue":null,"first_page":"801","last_page":"805"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10998","display_name":"Heat Transfer and Optimization","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10998","display_name":"Heat Transfer and Optimization","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10850","display_name":"Heat Transfer and Boiling Studies","score":0.9998000264167786,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11945","display_name":"Heat Transfer Mechanisms","score":0.9994999766349792,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/datasheet","display_name":"Datasheet","score":0.6879172921180725},{"id":"https://openalex.org/keywords/computational-fluid-dynamics","display_name":"Computational fluid dynamics","score":0.6279795169830322},{"id":"https://openalex.org/keywords/finite-element-method","display_name":"Finite element method","score":0.56658935546875},{"id":"https://openalex.org/keywords/mechanical-engineering","display_name":"Mechanical engineering","score":0.5440596342086792},{"id":"https://openalex.org/keywords/software","display_name":"Software","score":0.5277272462844849},{"id":"https://openalex.org/keywords/pressure-drop","display_name":"Pressure drop","score":0.5276723504066467},{"id":"https://openalex.org/keywords/converters","display_name":"Converters","score":0.5263460874557495},{"id":"https://openalex.org/keywords/heat-sink","display_name":"Heat sink","score":0.5185947418212891},{"id":"https://openalex.org/keywords/thermal-resistance","display_name":"Thermal resistance","score":0.504151463508606},{"id":"https://openalex.org/keywords/design-tool","display_name":"Design tool","score":0.4736940860748291},{"id":"https://openalex.org/keywords/spice","display_name":"Spice","score":0.4656522870063782},{"id":"https://openalex.org/keywords/power","display_name":"Power (physics)","score":0.4499843120574951},{"id":"https://openalex.org/keywords/computer-aided-design","display_name":"Computer Aided Design","score":0.4404885470867157},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.41058778762817383},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.4075677990913391},{"id":"https://openalex.org/keywords/thermal","display_name":"Thermal","score":0.3299065828323364},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.31314852833747864},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.20091435313224792},{"id":"https://openalex.org/keywords/structural-engineering","display_name":"Structural engineering","score":0.13046294450759888},{"id":"https://openalex.org/keywords/aerospace-engineering","display_name":"Aerospace engineering","score":0.08685028553009033}],"concepts":[{"id":"https://openalex.org/C2781384022","wikidata":"https://www.wikidata.org/wiki/Q1172383","display_name":"Datasheet","level":2,"score":0.6879172921180725},{"id":"https://openalex.org/C1633027","wikidata":"https://www.wikidata.org/wiki/Q815820","display_name":"Computational fluid dynamics","level":2,"score":0.6279795169830322},{"id":"https://openalex.org/C135628077","wikidata":"https://www.wikidata.org/wiki/Q220184","display_name":"Finite element method","level":2,"score":0.56658935546875},{"id":"https://openalex.org/C78519656","wikidata":"https://www.wikidata.org/wiki/Q101333","display_name":"Mechanical engineering","level":1,"score":0.5440596342086792},{"id":"https://openalex.org/C2777904410","wikidata":"https://www.wikidata.org/wiki/Q7397","display_name":"Software","level":2,"score":0.5277272462844849},{"id":"https://openalex.org/C114088122","wikidata":"https://www.wikidata.org/wiki/Q1261069","display_name":"Pressure drop","level":2,"score":0.5276723504066467},{"id":"https://openalex.org/C2778422915","wikidata":"https://www.wikidata.org/wiki/Q10302051","display_name":"Converters","level":3,"score":0.5263460874557495},{"id":"https://openalex.org/C186937647","wikidata":"https://www.wikidata.org/wiki/Q1796959","display_name":"Heat sink","level":2,"score":0.5185947418212891},{"id":"https://openalex.org/C137693562","wikidata":"https://www.wikidata.org/wiki/Q899628","display_name":"Thermal resistance","level":3,"score":0.504151463508606},{"id":"https://openalex.org/C2777466363","wikidata":"https://www.wikidata.org/wiki/Q17008971","display_name":"Design tool","level":2,"score":0.4736940860748291},{"id":"https://openalex.org/C2780077345","wikidata":"https://www.wikidata.org/wiki/Q16891888","display_name":"Spice","level":2,"score":0.4656522870063782},{"id":"https://openalex.org/C163258240","wikidata":"https://www.wikidata.org/wiki/Q25342","display_name":"Power (physics)","level":2,"score":0.4499843120574951},{"id":"https://openalex.org/C119823426","wikidata":"https://www.wikidata.org/wiki/Q184793","display_name":"Computer Aided Design","level":2,"score":0.4404885470867157},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.41058778762817383},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.4075677990913391},{"id":"https://openalex.org/C204530211","wikidata":"https://www.wikidata.org/wiki/Q752823","display_name":"Thermal","level":2,"score":0.3299065828323364},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.31314852833747864},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.20091435313224792},{"id":"https://openalex.org/C66938386","wikidata":"https://www.wikidata.org/wiki/Q633538","display_name":"Structural engineering","level":1,"score":0.13046294450759888},{"id":"https://openalex.org/C146978453","wikidata":"https://www.wikidata.org/wiki/Q3798668","display_name":"Aerospace engineering","level":1,"score":0.08685028553009033},{"id":"https://openalex.org/C97355855","wikidata":"https://www.wikidata.org/wiki/Q11473","display_name":"Thermodynamics","level":1,"score":0.0},{"id":"https://openalex.org/C153294291","wikidata":"https://www.wikidata.org/wiki/Q25261","display_name":"Meteorology","level":1,"score":0.0},{"id":"https://openalex.org/C199360897","wikidata":"https://www.wikidata.org/wiki/Q9143","display_name":"Programming language","level":1,"score":0.0},{"id":"https://openalex.org/C165801399","wikidata":"https://www.wikidata.org/wiki/Q25428","display_name":"Voltage","level":2,"score":0.0},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.0},{"id":"https://openalex.org/C62520636","wikidata":"https://www.wikidata.org/wiki/Q944","display_name":"Quantum mechanics","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1016/j.microrel.2018.06.050","is_oa":false,"landing_page_url":"https://doi.org/10.1016/j.microrel.2018.06.050","pdf_url":null,"source":{"id":"https://openalex.org/S133646729","display_name":"Microelectronics Reliability","issn_l":"0026-2714","issn":["0026-2714","1872-941X"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310320990","host_organization_name":"Elsevier BV","host_organization_lineage":["https://openalex.org/P4310320990"],"host_organization_lineage_names":["Elsevier BV"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Microelectronics Reliability","raw_type":"journal-article"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[],"funders":[{"id":"https://openalex.org/F4320335322","display_name":"European Regional Development Fund","ror":"https://ror.org/00k4n6c32"}],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":7,"referenced_works":["https://openalex.org/W2011185074","https://openalex.org/W2077549623","https://openalex.org/W2088799459","https://openalex.org/W2110636058","https://openalex.org/W2191581248","https://openalex.org/W2568357517","https://openalex.org/W6676695301"],"related_works":["https://openalex.org/W2572450784","https://openalex.org/W2098558496","https://openalex.org/W2790844566","https://openalex.org/W2059629300","https://openalex.org/W2291072988","https://openalex.org/W4245685577","https://openalex.org/W4241261995","https://openalex.org/W4226333926","https://openalex.org/W109347585","https://openalex.org/W2136711480"],"abstract_inverted_index":null,"counts_by_year":[{"year":2026,"cited_by_count":1},{"year":2025,"cited_by_count":1},{"year":2023,"cited_by_count":2},{"year":2021,"cited_by_count":3},{"year":2020,"cited_by_count":1}],"updated_date":"2026-03-27T05:58:40.876381","created_date":"2025-10-10T00:00:00"}