{"id":"https://openalex.org/W7117158208","doi":"https://doi.org/10.1016/j.engappai.2025.113641","title":"A multi-task spatiotemporal deep neural network for predicting penetration depth and morphology in laser welding","display_name":"A multi-task spatiotemporal deep neural network for predicting penetration depth and morphology in laser welding","publication_year":2025,"publication_date":"2025-12-24","ids":{"openalex":"https://openalex.org/W7117158208","doi":"https://doi.org/10.1016/j.engappai.2025.113641"},"language":"en","primary_location":{"id":"doi:10.1016/j.engappai.2025.113641","is_oa":false,"landing_page_url":"https://doi.org/10.1016/j.engappai.2025.113641","pdf_url":null,"source":{"id":"https://openalex.org/S900972176","display_name":"Engineering Applications of Artificial Intelligence","issn_l":"0952-1976","issn":["0952-1976","1873-6769"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310320990","host_organization_name":"Elsevier BV","host_organization_lineage":["https://openalex.org/P4310320990"],"host_organization_lineage_names":["Elsevier BV"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Engineering Applications of Artificial Intelligence","raw_type":"journal-article"},"type":"article","indexed_in":["arxiv","crossref"],"open_access":{"is_oa":true,"oa_status":"green","oa_url":"https://arxiv.org/pdf/2606.26260","any_repository_has_fulltext":true},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5121184549","display_name":"Sen Li","orcid":null},"institutions":[{"id":"https://openalex.org/I183067930","display_name":"Shanghai Jiao Tong University","ror":"https://ror.org/0220qvk04","country_code":"CN","type":"education","lineage":["https://openalex.org/I183067930"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Sen Li","raw_affiliation_strings":["Shanghai Key Laboratory of Materials Laser Processing and Modification, School of Materials Science and Engineering, Shanghai Jiao Tong University, Shanghai, 200240, PR China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Shanghai Key Laboratory of Materials Laser Processing and Modification, School of Materials Science and Engineering, Shanghai Jiao Tong University, Shanghai, 200240, PR China","institution_ids":["https://openalex.org/I183067930"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5062298939","display_name":"Haichao cui","orcid":null},"institutions":[{"id":"https://openalex.org/I183067930","display_name":"Shanghai Jiao Tong University","ror":"https://ror.org/0220qvk04","country_code":"CN","type":"education","lineage":["https://openalex.org/I183067930"]}],"countries":["CN"],"is_corresponding":true,"raw_author_name":"Haichao Cui","raw_affiliation_strings":["Shanghai Key Laboratory of Materials Laser Processing and Modification, School of Materials Science and Engineering, Shanghai Jiao Tong University, Shanghai, 200240, PR China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Shanghai Key Laboratory of Materials Laser Processing and Modification, School of Materials Science and Engineering, Shanghai Jiao Tong University, Shanghai, 200240, PR China","institution_ids":["https://openalex.org/I183067930"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5056663596","display_name":"Chendong Shao","orcid":null},"institutions":[{"id":"https://openalex.org/I183067930","display_name":"Shanghai Jiao Tong University","ror":"https://ror.org/0220qvk04","country_code":"CN","type":"education","lineage":["https://openalex.org/I183067930"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Chendong Shao","raw_affiliation_strings":["Shanghai Key Laboratory of Materials Laser Processing and Modification, School of Materials Science and Engineering, Shanghai Jiao Tong University, Shanghai, 200240, PR China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Shanghai Key Laboratory of Materials Laser Processing and Modification, School of Materials Science and Engineering, Shanghai Jiao Tong University, Shanghai, 200240, PR China","institution_ids":["https://openalex.org/I183067930"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5121142230","display_name":"Yaqi Wang","orcid":null},"institutions":[{"id":"https://openalex.org/I183067930","display_name":"Shanghai Jiao Tong University","ror":"https://ror.org/0220qvk04","country_code":"CN","type":"education","lineage":["https://openalex.org/I183067930"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Yaqi Wang","raw_affiliation_strings":["Shanghai Key Laboratory of Materials Laser Processing and Modification, School of Materials Science and Engineering, Shanghai Jiao Tong University, Shanghai, 200240, PR China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Shanghai Key Laboratory of Materials Laser Processing and Modification, School of Materials Science and Engineering, Shanghai Jiao Tong University, Shanghai, 200240, PR China","institution_ids":["https://openalex.org/I183067930"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5039755873","display_name":"Xinhua Tang","orcid":null},"institutions":[{"id":"https://openalex.org/I183067930","display_name":"Shanghai Jiao Tong University","ror":"https://ror.org/0220qvk04","country_code":"CN","type":"education","lineage":["https://openalex.org/I183067930"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Xinhua Tang","raw_affiliation_strings":["Shanghai Key Laboratory of Materials Laser Processing and Modification, School of Materials Science and Engineering, Shanghai Jiao Tong University, Shanghai, 200240, PR China"],"raw_orcid":"https://orcid.org/0000-0002-2675-4033","affiliations":[{"raw_affiliation_string":"Shanghai Key Laboratory of Materials Laser Processing and Modification, School of Materials Science and Engineering, Shanghai Jiao Tong University, Shanghai, 200240, PR China","institution_ids":["https://openalex.org/I183067930"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":1,"corresponding_author_ids":["https://openalex.org/A5062298939"],"corresponding_institution_ids":["https://openalex.org/I183067930"],"apc_list":{"value":3170,"currency":"USD","value_usd":3170},"apc_paid":null,"fwci":0.0,"has_fulltext":true,"cited_by_count":0,"citation_normalized_percentile":{"value":0.44664999,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":null,"biblio":{"volume":"166","issue":null,"first_page":"113641","last_page":"113641"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10834","display_name":"Welding Techniques and Residual Stresses","score":0.9545000195503235,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10834","display_name":"Welding Techniques and Residual Stresses","score":0.9545000195503235,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10723","display_name":"Advanced Welding Techniques Analysis","score":0.01730000041425228,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10705","display_name":"Additive Manufacturing Materials and Processes","score":0.006200000178068876,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/welding","display_name":"Welding","score":0.7736999988555908},{"id":"https://openalex.org/keywords/convolutional-neural-network","display_name":"Convolutional neural network","score":0.6384000182151794},{"id":"https://openalex.org/keywords/penetration-depth","display_name":"Penetration depth","score":0.6011999845504761},{"id":"https://openalex.org/keywords/artificial-neural-network","display_name":"Artificial neural network","score":0.5965999960899353},{"id":"https://openalex.org/keywords/weld-pool","display_name":"Weld pool","score":0.5795999765396118},{"id":"https://openalex.org/keywords/robustness","display_name":"Robustness (evolution)","score":0.5645999908447266},{"id":"https://openalex.org/keywords/penetration","display_name":"Penetration (warfare)","score":0.5192999839782715},{"id":"https://openalex.org/keywords/deep-learning","display_name":"Deep learning","score":0.48840001225471497}],"concepts":[{"id":"https://openalex.org/C19474535","wikidata":"https://www.wikidata.org/wiki/Q131172","display_name":"Welding","level":2,"score":0.7736999988555908},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.7182999849319458},{"id":"https://openalex.org/C81363708","wikidata":"https://www.wikidata.org/wiki/Q17084460","display_name":"Convolutional neural network","level":2,"score":0.6384000182151794},{"id":"https://openalex.org/C193493375","wikidata":"https://www.wikidata.org/wiki/Q1306232","display_name":"Penetration depth","level":2,"score":0.6011999845504761},{"id":"https://openalex.org/C50644808","wikidata":"https://www.wikidata.org/wiki/Q192776","display_name":"Artificial neural network","level":2,"score":0.5965999960899353},{"id":"https://openalex.org/C2776143536","wikidata":"https://www.wikidata.org/wiki/Q7980866","display_name":"Weld pool","level":5,"score":0.5795999765396118},{"id":"https://openalex.org/C63479239","wikidata":"https://www.wikidata.org/wiki/Q7353546","display_name":"Robustness (evolution)","level":3,"score":0.5645999908447266},{"id":"https://openalex.org/C154945302","wikidata":"https://www.wikidata.org/wiki/Q11660","display_name":"Artificial intelligence","level":1,"score":0.5266000032424927},{"id":"https://openalex.org/C80107235","wikidata":"https://www.wikidata.org/wiki/Q7162625","display_name":"Penetration (warfare)","level":2,"score":0.5192999839782715},{"id":"https://openalex.org/C108583219","wikidata":"https://www.wikidata.org/wiki/Q197536","display_name":"Deep learning","level":2,"score":0.48840001225471497},{"id":"https://openalex.org/C89344249","wikidata":"https://www.wikidata.org/wiki/Q937468","display_name":"Laser beam welding","level":3,"score":0.47609999775886536},{"id":"https://openalex.org/C169903167","wikidata":"https://www.wikidata.org/wiki/Q3985153","display_name":"Test set","level":2,"score":0.3799999952316284},{"id":"https://openalex.org/C9417928","wikidata":"https://www.wikidata.org/wiki/Q1070689","display_name":"Image processing","level":3,"score":0.3756999969482422},{"id":"https://openalex.org/C520434653","wikidata":"https://www.wikidata.org/wiki/Q38867","display_name":"Laser","level":2,"score":0.3702000081539154},{"id":"https://openalex.org/C98045186","wikidata":"https://www.wikidata.org/wiki/Q205663","display_name":"Process (computing)","level":2,"score":0.32440000772476196},{"id":"https://openalex.org/C153180895","wikidata":"https://www.wikidata.org/wiki/Q7148389","display_name":"Pattern recognition (psychology)","level":2,"score":0.29899999499320984},{"id":"https://openalex.org/C31972630","wikidata":"https://www.wikidata.org/wiki/Q844240","display_name":"Computer vision","level":1,"score":0.2976999878883362},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.2816999852657318},{"id":"https://openalex.org/C52622490","wikidata":"https://www.wikidata.org/wiki/Q1026626","display_name":"Feature extraction","level":2,"score":0.2770000100135803},{"id":"https://openalex.org/C5339829","wikidata":"https://www.wikidata.org/wiki/Q1425977","display_name":"Machine vision","level":2,"score":0.2745000123977661},{"id":"https://openalex.org/C56529433","wikidata":"https://www.wikidata.org/wiki/Q626700","display_name":"Nondestructive testing","level":2,"score":0.27410000562667847},{"id":"https://openalex.org/C155386361","wikidata":"https://www.wikidata.org/wiki/Q1649571","display_name":"Process control","level":3,"score":0.26510000228881836}],"mesh":[],"locations_count":2,"locations":[{"id":"doi:10.1016/j.engappai.2025.113641","is_oa":false,"landing_page_url":"https://doi.org/10.1016/j.engappai.2025.113641","pdf_url":null,"source":{"id":"https://openalex.org/S900972176","display_name":"Engineering Applications of Artificial Intelligence","issn_l":"0952-1976","issn":["0952-1976","1873-6769"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310320990","host_organization_name":"Elsevier BV","host_organization_lineage":["https://openalex.org/P4310320990"],"host_organization_lineage_names":["Elsevier BV"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Engineering Applications of Artificial Intelligence","raw_type":"journal-article"},{"id":"pmh:oai:arXiv.org:2606.26260","is_oa":true,"landing_page_url":"https://arxiv.org/abs/2606.26260","pdf_url":"https://arxiv.org/pdf/2606.26260","source":{"id":"https://openalex.org/S4306400194","display_name":"arXiv (Cornell University)","issn_l":null,"issn":null,"is_oa":true,"is_in_doaj":false,"is_core":false,"host_organization":"https://openalex.org/I205783295","host_organization_name":"Cornell University","host_organization_lineage":["https://openalex.org/I205783295"],"host_organization_lineage_names":[],"type":"repository"},"license":null,"license_id":null,"version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":null,"raw_type":"text"}],"best_oa_location":{"id":"pmh:oai:arXiv.org:2606.26260","is_oa":true,"landing_page_url":"https://arxiv.org/abs/2606.26260","pdf_url":"https://arxiv.org/pdf/2606.26260","source":{"id":"https://openalex.org/S4306400194","display_name":"arXiv (Cornell University)","issn_l":null,"issn":null,"is_oa":true,"is_in_doaj":false,"is_core":false,"host_organization":"https://openalex.org/I205783295","host_organization_name":"Cornell University","host_organization_lineage":["https://openalex.org/I205783295"],"host_organization_lineage_names":[],"type":"repository"},"license":null,"license_id":null,"version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":null,"raw_type":"text"},"sustainable_development_goals":[],"awards":[{"id":"https://openalex.org/G5107365133","display_name":null,"funder_award_id":"2023YFB3407800","funder_id":"https://openalex.org/F4320335774","funder_display_name":"Key Technologies Research and Development Program"},{"id":"https://openalex.org/G5269381916","display_name":null,"funder_award_id":"U2141213","funder_id":"https://openalex.org/F4320321001","funder_display_name":"National Natural Science Foundation of China"}],"funders":[{"id":"https://openalex.org/F4320321001","display_name":"National Natural Science Foundation of China","ror":"https://ror.org/01h0zpd94"},{"id":"https://openalex.org/F4320335774","display_name":"Key Technologies Research and Development Program","ror":null},{"id":"https://openalex.org/F4320335777","display_name":"National Key Research and Development Program of China","ror":null}],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":23,"referenced_works":["https://openalex.org/W212646144","https://openalex.org/W315718592","https://openalex.org/W1883251988","https://openalex.org/W1977686971","https://openalex.org/W1985479415","https://openalex.org/W1998626418","https://openalex.org/W2035462959","https://openalex.org/W2070565034","https://openalex.org/W2075047657","https://openalex.org/W2079367174","https://openalex.org/W2086933771","https://openalex.org/W2100495367","https://openalex.org/W2559761848","https://openalex.org/W2806451703","https://openalex.org/W2890224976","https://openalex.org/W2965127231","https://openalex.org/W2998179457","https://openalex.org/W3048118749","https://openalex.org/W3117263772","https://openalex.org/W3203573311","https://openalex.org/W4307900354","https://openalex.org/W4386577658","https://openalex.org/W4391517444"],"related_works":[],"abstract_inverted_index":null,"counts_by_year":[],"updated_date":"2026-06-15T08:34:33.830935","created_date":"2025-12-24T00:00:00"}