{"id":"https://openalex.org/W1966827043","doi":"https://doi.org/10.1016/s0026-2714(03)00309-3","title":"Investigation of delaminations during thermal stress: scanning acoustic microscopy covering low and high temperatures","display_name":"Investigation of delaminations during thermal stress: scanning acoustic microscopy covering low and high temperatures","publication_year":2003,"publication_date":"2003-09-01","ids":{"openalex":"https://openalex.org/W1966827043","doi":"https://doi.org/10.1016/s0026-2714(03)00309-3","mag":"1966827043"},"language":"en","primary_location":{"id":"doi:10.1016/s0026-2714(03)00309-3","is_oa":false,"landing_page_url":"https://doi.org/10.1016/s0026-2714(03)00309-3","pdf_url":null,"source":{"id":"https://openalex.org/S133646729","display_name":"Microelectronics Reliability","issn_l":"0026-2714","issn":["0026-2714","1872-941X"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310320990","host_organization_name":"Elsevier BV","host_organization_lineage":["https://openalex.org/P4310320990"],"host_organization_lineage_names":["Elsevier BV"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Microelectronics Reliability","raw_type":"journal-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5058445880","display_name":"P. Rajamand","orcid":null},"institutions":[{"id":"https://openalex.org/I4400573212","display_name":"Institut National Polytechnique de Lorraine","ror":"https://ror.org/01xjq7424","country_code":"FR","type":"education","lineage":["https://openalex.org/I4400573212"]}],"countries":["FR"],"is_corresponding":false,"raw_author_name":"P. Rajamand","raw_affiliation_strings":["Institut National Polytechnique de Lorraine, Ecole Europ\u00e9enne d\u2019Ing\u00e9nieurs en G\u00e9nie des Mat\u00e9riaux 6, rue Bastien Lepage, B.P. 630, F-54510 Nancy Cedex, France"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Institut National Polytechnique de Lorraine, Ecole Europ\u00e9enne d\u2019Ing\u00e9nieurs en G\u00e9nie des Mat\u00e9riaux 6, rue Bastien Lepage, B.P. 630, F-54510 Nancy Cedex, France","institution_ids":["https://openalex.org/I4400573212"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5085932056","display_name":"R. Tilgner","orcid":null},"institutions":[{"id":"https://openalex.org/I137594350","display_name":"Infineon Technologies (Germany)","ror":"https://ror.org/005kw6t15","country_code":"DE","type":"company","lineage":["https://openalex.org/I137594350"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"R. Tilgner","raw_affiliation_strings":["Infineon Technologies AG, P.O.Box 800949, D-81609 Munich, Germany"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Infineon Technologies AG, P.O.Box 800949, D-81609 Munich, Germany","institution_ids":["https://openalex.org/I137594350"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5017394098","display_name":"Roland Schmidt","orcid":null},"institutions":[{"id":"https://openalex.org/I137594350","display_name":"Infineon Technologies (Germany)","ror":"https://ror.org/005kw6t15","country_code":"DE","type":"company","lineage":["https://openalex.org/I137594350"]}],"countries":["DE"],"is_corresponding":true,"raw_author_name":"R. Schmidt","raw_affiliation_strings":["Infineon Technologies AG, P.O.Box 800949, D-81609 Munich, Germany"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Infineon Technologies AG, P.O.Box 800949, D-81609 Munich, Germany","institution_ids":["https://openalex.org/I137594350"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5065557839","display_name":"T. Baumann","orcid":"https://orcid.org/0000-0002-2060-3672"},"institutions":[{"id":"https://openalex.org/I1325886976","display_name":"Siemens (Germany)","ror":"https://ror.org/059mq0909","country_code":"DE","type":"company","lineage":["https://openalex.org/I1325886976"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"J. Baumann","raw_affiliation_strings":["Siemens AG, Otto-Hahn-Ring 6, D-81739 Munich, Germany","Siemens AG, Otto Hahn Ring 6, D-81739 Munich, Germany"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Siemens AG, Otto-Hahn-Ring 6, D-81739 Munich, Germany","institution_ids":["https://openalex.org/I1325886976"]},{"raw_affiliation_string":"Siemens AG, Otto Hahn Ring 6, D-81739 Munich, Germany","institution_ids":["https://openalex.org/I1325886976"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5047840521","display_name":"P. Klofac","orcid":null},"institutions":[{"id":"https://openalex.org/I1325886976","display_name":"Siemens (Germany)","ror":"https://ror.org/059mq0909","country_code":"DE","type":"company","lineage":["https://openalex.org/I1325886976"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"P. Klofac","raw_affiliation_strings":["Siemens AG, Otto-Hahn-Ring 6, D-81739 Munich, Germany","Siemens AG, Otto Hahn Ring 6, D-81739 Munich, Germany"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Siemens AG, Otto-Hahn-Ring 6, D-81739 Munich, Germany","institution_ids":["https://openalex.org/I1325886976"]},{"raw_affiliation_string":"Siemens AG, Otto Hahn Ring 6, D-81739 Munich, Germany","institution_ids":["https://openalex.org/I1325886976"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5016025502","display_name":"M. Rothenfusser","orcid":null},"institutions":[{"id":"https://openalex.org/I1325886976","display_name":"Siemens (Germany)","ror":"https://ror.org/059mq0909","country_code":"DE","type":"company","lineage":["https://openalex.org/I1325886976"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"M. Rothenfusser","raw_affiliation_strings":["Siemens AG, Otto-Hahn-Ring 6, D-81739 Munich, Germany","Siemens AG, Otto Hahn Ring 6, D-81739 Munich, Germany"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Siemens AG, Otto-Hahn-Ring 6, D-81739 Munich, Germany","institution_ids":["https://openalex.org/I1325886976"]},{"raw_affiliation_string":"Siemens AG, Otto Hahn Ring 6, D-81739 Munich, Germany","institution_ids":["https://openalex.org/I1325886976"]}]}],"institutions":[],"countries_distinct_count":2,"institutions_distinct_count":3,"corresponding_author_ids":["https://openalex.org/A5017394098"],"corresponding_institution_ids":["https://openalex.org/I137594350"],"apc_list":{"value":2190,"currency":"USD","value_usd":2190},"apc_paid":null,"fwci":0.0,"has_fulltext":false,"cited_by_count":2,"citation_normalized_percentile":{"value":0.07231463,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":90,"max":94},"biblio":{"volume":"43","issue":"9-11","first_page":"1815","last_page":"1820"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10662","display_name":"Ultrasonics and Acoustic Wave Propagation","score":0.9994000196456909,"subfield":{"id":"https://openalex.org/subfields/2211","display_name":"Mechanics of Materials"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10662","display_name":"Ultrasonics and Acoustic Wave Propagation","score":0.9994000196456909,"subfield":{"id":"https://openalex.org/subfields/2211","display_name":"Mechanics of Materials"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12169","display_name":"Non-Destructive Testing Techniques","score":0.9977999925613403,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12682","display_name":"Smart Materials for Construction","score":0.9936000108718872,"subfield":{"id":"https://openalex.org/subfields/2310","display_name":"Pollution"},"field":{"id":"https://openalex.org/fields/23","display_name":"Environmental Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/delamination","display_name":"Delamination (geology)","score":0.8218814134597778},{"id":"https://openalex.org/keywords/microelectronics","display_name":"Microelectronics","score":0.7697477340698242},{"id":"https://openalex.org/keywords/acoustic-microscopy","display_name":"Acoustic microscopy","score":0.7278127670288086},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.702115535736084},{"id":"https://openalex.org/keywords/printed-circuit-board","display_name":"Printed circuit board","score":0.6413152813911438},{"id":"https://openalex.org/keywords/scanning-acoustic-microscope","display_name":"Scanning acoustic microscope","score":0.5430838465690613},{"id":"https://openalex.org/keywords/thermal","display_name":"Thermal","score":0.5072998404502869},{"id":"https://openalex.org/keywords/acoustics","display_name":"Acoustics","score":0.5045148134231567},{"id":"https://openalex.org/keywords/composite-material","display_name":"Composite material","score":0.4990096092224121},{"id":"https://openalex.org/keywords/stress","display_name":"Stress (linguistics)","score":0.46699634194374084},{"id":"https://openalex.org/keywords/microscopy","display_name":"Microscopy","score":0.44181787967681885},{"id":"https://openalex.org/keywords/structural-engineering","display_name":"Structural engineering","score":0.3259449303150177},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.21497324109077454},{"id":"https://openalex.org/keywords/optics","display_name":"Optics","score":0.21197926998138428},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.18191498517990112},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.13255202770233154},{"id":"https://openalex.org/keywords/geology","display_name":"Geology","score":0.09728574752807617},{"id":"https://openalex.org/keywords/physics","display_name":"Physics","score":0.09703800082206726}],"concepts":[{"id":"https://openalex.org/C30239060","wikidata":"https://www.wikidata.org/wiki/Q5253111","display_name":"Delamination (geology)","level":4,"score":0.8218814134597778},{"id":"https://openalex.org/C187937830","wikidata":"https://www.wikidata.org/wiki/Q175403","display_name":"Microelectronics","level":2,"score":0.7697477340698242},{"id":"https://openalex.org/C2781117724","wikidata":"https://www.wikidata.org/wiki/Q4674694","display_name":"Acoustic microscopy","level":3,"score":0.7278127670288086},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.702115535736084},{"id":"https://openalex.org/C120793396","wikidata":"https://www.wikidata.org/wiki/Q173350","display_name":"Printed circuit board","level":2,"score":0.6413152813911438},{"id":"https://openalex.org/C2778759172","wikidata":"https://www.wikidata.org/wiki/Q424047","display_name":"Scanning acoustic microscope","level":4,"score":0.5430838465690613},{"id":"https://openalex.org/C204530211","wikidata":"https://www.wikidata.org/wiki/Q752823","display_name":"Thermal","level":2,"score":0.5072998404502869},{"id":"https://openalex.org/C24890656","wikidata":"https://www.wikidata.org/wiki/Q82811","display_name":"Acoustics","level":1,"score":0.5045148134231567},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.4990096092224121},{"id":"https://openalex.org/C21036866","wikidata":"https://www.wikidata.org/wiki/Q181767","display_name":"Stress (linguistics)","level":2,"score":0.46699634194374084},{"id":"https://openalex.org/C147080431","wikidata":"https://www.wikidata.org/wiki/Q1074953","display_name":"Microscopy","level":2,"score":0.44181787967681885},{"id":"https://openalex.org/C66938386","wikidata":"https://www.wikidata.org/wiki/Q633538","display_name":"Structural engineering","level":1,"score":0.3259449303150177},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.21497324109077454},{"id":"https://openalex.org/C120665830","wikidata":"https://www.wikidata.org/wiki/Q14620","display_name":"Optics","level":1,"score":0.21197926998138428},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.18191498517990112},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.13255202770233154},{"id":"https://openalex.org/C127313418","wikidata":"https://www.wikidata.org/wiki/Q1069","display_name":"Geology","level":0,"score":0.09728574752807617},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.09703800082206726},{"id":"https://openalex.org/C77928131","wikidata":"https://www.wikidata.org/wiki/Q193343","display_name":"Tectonics","level":2,"score":0.0},{"id":"https://openalex.org/C138885662","wikidata":"https://www.wikidata.org/wiki/Q5891","display_name":"Philosophy","level":0,"score":0.0},{"id":"https://openalex.org/C41895202","wikidata":"https://www.wikidata.org/wiki/Q8162","display_name":"Linguistics","level":1,"score":0.0},{"id":"https://openalex.org/C153294291","wikidata":"https://www.wikidata.org/wiki/Q25261","display_name":"Meteorology","level":1,"score":0.0},{"id":"https://openalex.org/C58097730","wikidata":"https://www.wikidata.org/wiki/Q176318","display_name":"Subduction","level":3,"score":0.0},{"id":"https://openalex.org/C151730666","wikidata":"https://www.wikidata.org/wiki/Q7205","display_name":"Paleontology","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1016/s0026-2714(03)00309-3","is_oa":false,"landing_page_url":"https://doi.org/10.1016/s0026-2714(03)00309-3","pdf_url":null,"source":{"id":"https://openalex.org/S133646729","display_name":"Microelectronics Reliability","issn_l":"0026-2714","issn":["0026-2714","1872-941X"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310320990","host_organization_name":"Elsevier BV","host_organization_lineage":["https://openalex.org/P4310320990"],"host_organization_lineage_names":["Elsevier BV"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Microelectronics Reliability","raw_type":"journal-article"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":0,"referenced_works":[],"related_works":["https://openalex.org/W2094251059","https://openalex.org/W2374424853","https://openalex.org/W2204665853","https://openalex.org/W4244949776","https://openalex.org/W861436238","https://openalex.org/W2013649711","https://openalex.org/W3107960430","https://openalex.org/W2544700891","https://openalex.org/W3116612094","https://openalex.org/W2044926097"],"abstract_inverted_index":null,"counts_by_year":[{"year":2016,"cited_by_count":1}],"updated_date":"2026-07-22T07:51:19.307946","created_date":"2025-10-10T00:00:00"}