{"id":"https://openalex.org/W2049494451","doi":"https://doi.org/10.1016/s0026-2714(03)00302-0","title":"Backside Flip-Chip testing by means of high-bandwidth luminescence detection","display_name":"Backside Flip-Chip testing by means of high-bandwidth luminescence detection","publication_year":2003,"publication_date":"2003-09-01","ids":{"openalex":"https://openalex.org/W2049494451","doi":"https://doi.org/10.1016/s0026-2714(03)00302-0","mag":"2049494451"},"language":"en","primary_location":{"id":"doi:10.1016/s0026-2714(03)00302-0","is_oa":false,"landing_page_url":"https://doi.org/10.1016/s0026-2714(03)00302-0","pdf_url":null,"source":{"id":"https://openalex.org/S133646729","display_name":"Microelectronics Reliability","issn_l":"0026-2714","issn":["0026-2714","1872-941X"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310320990","host_organization_name":"Elsevier BV","host_organization_lineage":["https://openalex.org/P4310320990"],"host_organization_lineage_names":["Elsevier BV"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Microelectronics Reliability","raw_type":"journal-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5036398289","display_name":"Alberto Tosi","orcid":"https://orcid.org/0000-0003-1210-2875"},"institutions":[{"id":"https://openalex.org/I93860229","display_name":"Politecnico di Milano","ror":"https://ror.org/01nffqt88","country_code":"IT","type":"education","lineage":["https://openalex.org/I93860229"]}],"countries":["IT"],"is_corresponding":true,"raw_author_name":"A. Tosi","raw_affiliation_strings":["Politecnico di Milano, Dipartimento di Elettronica e Informazione Piazza Leonardo da Vinci 32, 20133 Milano (Italy) phone: +39 02 23996174, fax: +39 02 23993699"],"affiliations":[{"raw_affiliation_string":"Politecnico di Milano, Dipartimento di Elettronica e Informazione Piazza Leonardo da Vinci 32, 20133 Milano (Italy) phone: +39 02 23996174, fax: +39 02 23993699","institution_ids":["https://openalex.org/I93860229"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5043549704","display_name":"Franco Stellari","orcid":"https://orcid.org/0000-0002-1510-6882"},"institutions":[{"id":"https://openalex.org/I1341412227","display_name":"IBM (United States)","ror":"https://ror.org/05hh8d621","country_code":"US","type":"company","lineage":["https://openalex.org/I1341412227"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"F. Stellari","raw_affiliation_strings":["IBM T.J. Watson Research Center, Yorktown Heights \u2013 NY 10598 (USA)","[IBM T.J. Watson Research Center, Yorktown Heights, NY 10598, USA]"],"affiliations":[{"raw_affiliation_string":"IBM T.J. Watson Research Center, Yorktown Heights \u2013 NY 10598 (USA)","institution_ids":[]},{"raw_affiliation_string":"[IBM T.J. Watson Research Center, Yorktown Heights, NY 10598, USA]","institution_ids":["https://openalex.org/I1341412227"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5054993441","display_name":"Franco Zappa","orcid":"https://orcid.org/0000-0003-1715-501X"},"institutions":[{"id":"https://openalex.org/I93860229","display_name":"Politecnico di Milano","ror":"https://ror.org/01nffqt88","country_code":"IT","type":"education","lineage":["https://openalex.org/I93860229"]}],"countries":["IT"],"is_corresponding":false,"raw_author_name":"F. Zappa","raw_affiliation_strings":["Politecnico di Milano, Dipartimento di Elettronica e Informazione Piazza Leonardo da Vinci 32, 20133 Milano (Italy) phone: +39 02 23996174, fax: +39 02 23993699"],"affiliations":[{"raw_affiliation_string":"Politecnico di Milano, Dipartimento di Elettronica e Informazione Piazza Leonardo da Vinci 32, 20133 Milano (Italy) phone: +39 02 23996174, fax: +39 02 23993699","institution_ids":["https://openalex.org/I93860229"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5108077401","display_name":"S. Cova","orcid":null},"institutions":[{"id":"https://openalex.org/I93860229","display_name":"Politecnico di Milano","ror":"https://ror.org/01nffqt88","country_code":"IT","type":"education","lineage":["https://openalex.org/I93860229"]}],"countries":["IT"],"is_corresponding":false,"raw_author_name":"S. Cova","raw_affiliation_strings":["Politecnico di Milano, Dipartimento di Elettronica e Informazione Piazza Leonardo da Vinci 32, 20133 Milano (Italy) phone: +39 02 23996174, fax: +39 02 23993699"],"affiliations":[{"raw_affiliation_string":"Politecnico di Milano, Dipartimento di Elettronica e Informazione Piazza Leonardo da Vinci 32, 20133 Milano (Italy) phone: +39 02 23996174, fax: +39 02 23993699","institution_ids":["https://openalex.org/I93860229"]}]}],"institutions":[],"countries_distinct_count":2,"institutions_distinct_count":4,"corresponding_author_ids":["https://openalex.org/A5036398289"],"corresponding_institution_ids":["https://openalex.org/I93860229"],"apc_list":{"value":2190,"currency":"USD","value_usd":2190},"apc_paid":null,"fwci":1.4166,"has_fulltext":false,"cited_by_count":5,"citation_normalized_percentile":{"value":0.81869656,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":null,"biblio":{"volume":"43","issue":"9-11","first_page":"1669","last_page":"1674"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T14117","display_name":"Integrated Circuits and Semiconductor Failure Analysis","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T14117","display_name":"Integrated Circuits and Semiconductor Failure Analysis","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11032","display_name":"VLSI and Analog Circuit Testing","score":0.9995999932289124,"subfield":{"id":"https://openalex.org/subfields/1708","display_name":"Hardware and Architecture"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12495","display_name":"Electrostatic Discharge in Electronics","score":0.9958000183105469,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/flip-chip","display_name":"Flip chip","score":0.8366519212722778},{"id":"https://openalex.org/keywords/chip","display_name":"Chip","score":0.5288936495780945},{"id":"https://openalex.org/keywords/bandwidth","display_name":"Bandwidth (computing)","score":0.4953709840774536},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.41866302490234375},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.41847503185272217},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.38937512040138245},{"id":"https://openalex.org/keywords/computer-hardware","display_name":"Computer hardware","score":0.3380715847015381},{"id":"https://openalex.org/keywords/telecommunications","display_name":"Telecommunications","score":0.21342504024505615},{"id":"https://openalex.org/keywords/nanotechnology","display_name":"Nanotechnology","score":0.1259126365184784}],"concepts":[{"id":"https://openalex.org/C79072407","wikidata":"https://www.wikidata.org/wiki/Q432439","display_name":"Flip chip","level":4,"score":0.8366519212722778},{"id":"https://openalex.org/C165005293","wikidata":"https://www.wikidata.org/wiki/Q1074500","display_name":"Chip","level":2,"score":0.5288936495780945},{"id":"https://openalex.org/C2776257435","wikidata":"https://www.wikidata.org/wiki/Q1576430","display_name":"Bandwidth (computing)","level":2,"score":0.4953709840774536},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.41866302490234375},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.41847503185272217},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.38937512040138245},{"id":"https://openalex.org/C9390403","wikidata":"https://www.wikidata.org/wiki/Q3966","display_name":"Computer hardware","level":1,"score":0.3380715847015381},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.21342504024505615},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.1259126365184784},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.0},{"id":"https://openalex.org/C68928338","wikidata":"https://www.wikidata.org/wiki/Q131790","display_name":"Adhesive","level":3,"score":0.0}],"mesh":[],"locations_count":3,"locations":[{"id":"doi:10.1016/s0026-2714(03)00302-0","is_oa":false,"landing_page_url":"https://doi.org/10.1016/s0026-2714(03)00302-0","pdf_url":null,"source":{"id":"https://openalex.org/S133646729","display_name":"Microelectronics Reliability","issn_l":"0026-2714","issn":["0026-2714","1872-941X"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310320990","host_organization_name":"Elsevier BV","host_organization_lineage":["https://openalex.org/P4310320990"],"host_organization_lineage_names":["Elsevier BV"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Microelectronics Reliability","raw_type":"journal-article"},{"id":"pmh:oai:re.public.polimi.it:11311/517657","is_oa":false,"landing_page_url":"http://hdl.handle.net/11311/517657","pdf_url":null,"source":{"id":"https://openalex.org/S4306400312","display_name":"Virtual Community of Pathological Anatomy (University of Castilla La Mancha)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":"https://openalex.org/I79189158","host_organization_name":"University of Castilla-La Mancha","host_organization_lineage":["https://openalex.org/I79189158"],"host_organization_lineage_names":[],"type":"repository"},"license":null,"license_id":null,"version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"","raw_type":"info:eu-repo/semantics/article"},{"id":"pmh:oai:re.public.polimi.it:11311/568452","is_oa":false,"landing_page_url":"http://hdl.handle.net/11311/568452","pdf_url":null,"source":{"id":"https://openalex.org/S4306400312","display_name":"Virtual Community of Pathological Anatomy (University of Castilla La Mancha)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":"https://openalex.org/I79189158","host_organization_name":"University of Castilla-La Mancha","host_organization_lineage":["https://openalex.org/I79189158"],"host_organization_lineage_names":[],"type":"repository"},"license":null,"license_id":null,"version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":null,"raw_type":"info:eu-repo/semantics/conferenceObject"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":17,"referenced_works":["https://openalex.org/W584181066","https://openalex.org/W1577325414","https://openalex.org/W1850577970","https://openalex.org/W2016464725","https://openalex.org/W2030781869","https://openalex.org/W2031108558","https://openalex.org/W2036906963","https://openalex.org/W2038296352","https://openalex.org/W2056955581","https://openalex.org/W2088477509","https://openalex.org/W2118565267","https://openalex.org/W2123355768","https://openalex.org/W2127068923","https://openalex.org/W2153293969","https://openalex.org/W2157642715","https://openalex.org/W2170991408","https://openalex.org/W2532999790"],"related_works":["https://openalex.org/W2350159546","https://openalex.org/W2915158639","https://openalex.org/W1530391261","https://openalex.org/W4211121654","https://openalex.org/W2115932404","https://openalex.org/W4232272518","https://openalex.org/W2261056475","https://openalex.org/W2151795613","https://openalex.org/W2046757767","https://openalex.org/W2532422067"],"abstract_inverted_index":null,"counts_by_year":[],"updated_date":"2026-04-12T07:58:50.170612","created_date":"2025-10-10T00:00:00"}