{"id":"https://openalex.org/W2023435527","doi":"https://doi.org/10.1016/s0026-2714(03)00260-9","title":"Characterization of thin and ultra-thin SiO2 films and SiO2/Si interfaces with combined conducting and topographic atomic force microscopy","display_name":"Characterization of thin and ultra-thin SiO2 films and SiO2/Si interfaces with combined conducting and topographic atomic force microscopy","publication_year":2003,"publication_date":"2003-09-01","ids":{"openalex":"https://openalex.org/W2023435527","doi":"https://doi.org/10.1016/s0026-2714(03)00260-9","mag":"2023435527"},"language":"en","primary_location":{"id":"doi:10.1016/s0026-2714(03)00260-9","is_oa":false,"landing_page_url":"https://doi.org/10.1016/s0026-2714(03)00260-9","pdf_url":null,"source":{"id":"https://openalex.org/S133646729","display_name":"Microelectronics Reliability","issn_l":"0026-2714","issn":["0026-2714","1872-941X"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310320990","host_organization_name":"Elsevier BV","host_organization_lineage":["https://openalex.org/P4310320990"],"host_organization_lineage_names":["Elsevier BV"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Microelectronics Reliability","raw_type":"journal-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5015618456","display_name":"Werner Frammelsberger","orcid":"https://orcid.org/0000-0002-4253-222X"},"institutions":[{"id":"https://openalex.org/I178535277","display_name":"University of the West of England","ror":"https://ror.org/02nwg5t34","country_code":"GB","type":"education","lineage":["https://openalex.org/I178535277"]},{"id":"https://openalex.org/I83041830","display_name":"Deggendorf Institute of Technology","ror":"https://ror.org/02kw5st29","country_code":"DE","type":"education","lineage":["https://openalex.org/I83041830"]}],"countries":["DE","GB"],"is_corresponding":true,"raw_author_name":"Werner Frammelsberger","raw_affiliation_strings":["University of Applied Sciences Deggendorf, Deggendorf, Germany","University of the West of England, Bristol, United Kingdom"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"University of Applied Sciences Deggendorf, Deggendorf, Germany","institution_ids":["https://openalex.org/I83041830"]},{"raw_affiliation_string":"University of the West of England, Bristol, United Kingdom","institution_ids":["https://openalex.org/I178535277"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5013454336","display_name":"G\u00fcnther Benstetter","orcid":"https://orcid.org/0000-0001-7625-1293"},"institutions":[{"id":"https://openalex.org/I83041830","display_name":"Deggendorf Institute of Technology","ror":"https://ror.org/02kw5st29","country_code":"DE","type":"education","lineage":["https://openalex.org/I83041830"]}],"countries":["DE"],"is_corresponding":true,"raw_author_name":"Guenther Benstetter","raw_affiliation_strings":["University of Applied Sciences Deggendorf, Deggendorf, Germany"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"University of Applied Sciences Deggendorf, Deggendorf, Germany","institution_ids":["https://openalex.org/I83041830"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5055953348","display_name":"Thomas Schweinboeck","orcid":null},"institutions":[{"id":"https://openalex.org/I137594350","display_name":"Infineon Technologies (Germany)","ror":"https://ror.org/005kw6t15","country_code":"DE","type":"company","lineage":["https://openalex.org/I137594350"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"Thomas Schweinboeck","raw_affiliation_strings":["Infineon Technologies, Munich, Germany"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Infineon Technologies, Munich, Germany","institution_ids":["https://openalex.org/I137594350"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5036268494","display_name":"Richard Stamp","orcid":null},"institutions":[{"id":"https://openalex.org/I178535277","display_name":"University of the West of England","ror":"https://ror.org/02nwg5t34","country_code":"GB","type":"education","lineage":["https://openalex.org/I178535277"]}],"countries":["GB"],"is_corresponding":false,"raw_author_name":"Richard J Stamp","raw_affiliation_strings":["University of the West of England, Bristol, United Kingdom","University of the West of England, Bristol, United Kingdom,"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"University of the West of England, Bristol, United Kingdom","institution_ids":["https://openalex.org/I178535277"]},{"raw_affiliation_string":"University of the West of England, Bristol, United Kingdom,","institution_ids":["https://openalex.org/I178535277"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5090680833","display_name":"Janice Kiely","orcid":null},"institutions":[{"id":"https://openalex.org/I178535277","display_name":"University of the West of England","ror":"https://ror.org/02nwg5t34","country_code":"GB","type":"education","lineage":["https://openalex.org/I178535277"]}],"countries":["GB"],"is_corresponding":false,"raw_author_name":"Janice Kiely","raw_affiliation_strings":["University of the West of England, Bristol, United Kingdom","University of the West of England, Bristol, United Kingdom,"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"University of the West of England, Bristol, United Kingdom","institution_ids":["https://openalex.org/I178535277"]},{"raw_affiliation_string":"University of the West of England, Bristol, United Kingdom,","institution_ids":["https://openalex.org/I178535277"]}]}],"institutions":[],"countries_distinct_count":2,"institutions_distinct_count":3,"corresponding_author_ids":["https://openalex.org/A5013454336","https://openalex.org/A5015618456"],"corresponding_institution_ids":["https://openalex.org/I178535277","https://openalex.org/I83041830"],"apc_list":{"value":2190,"currency":"USD","value_usd":2190},"apc_paid":null,"fwci":1.0175,"has_fulltext":false,"cited_by_count":9,"citation_normalized_percentile":{"value":0.74634856,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":94},"biblio":{"volume":"43","issue":"9-11","first_page":"1465","last_page":"1470"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10923","display_name":"Force Microscopy Techniques and Applications","score":0.9994000196456909,"subfield":{"id":"https://openalex.org/subfields/3107","display_name":"Atomic and Molecular Physics, and Optics"},"field":{"id":"https://openalex.org/fields/31","display_name":"Physics and Astronomy"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10923","display_name":"Force Microscopy Techniques and Applications","score":0.9994000196456909,"subfield":{"id":"https://openalex.org/subfields/3107","display_name":"Atomic and Molecular Physics, and Optics"},"field":{"id":"https://openalex.org/fields/31","display_name":"Physics and Astronomy"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12466","display_name":"Near-Field Optical Microscopy","score":0.9850999712944031,"subfield":{"id":"https://openalex.org/subfields/2204","display_name":"Biomedical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12340","display_name":"Anodic Oxide Films and Nanostructures","score":0.9819999933242798,"subfield":{"id":"https://openalex.org/subfields/2505","display_name":"Materials Chemistry"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/characterization","display_name":"Characterization (materials science)","score":0.8076533079147339},{"id":"https://openalex.org/keywords/atomic-force-microscopy","display_name":"Atomic force microscopy","score":0.7067767381668091},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.5991782546043396},{"id":"https://openalex.org/keywords/conductive-atomic-force-microscopy","display_name":"Conductive atomic force microscopy","score":0.5887173414230347},{"id":"https://openalex.org/keywords/thin-film","display_name":"Thin film","score":0.5803780555725098},{"id":"https://openalex.org/keywords/photoconductive-atomic-force-microscopy","display_name":"Photoconductive atomic force microscopy","score":0.49976205825805664},{"id":"https://openalex.org/keywords/nanotechnology","display_name":"Nanotechnology","score":0.49136295914649963},{"id":"https://openalex.org/keywords/silicon","display_name":"Silicon","score":0.46233034133911133},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.4471200704574585},{"id":"https://openalex.org/keywords/composite-material","display_name":"Composite material","score":0.2591964900493622},{"id":"https://openalex.org/keywords/scanning-capacitance-microscopy","display_name":"Scanning capacitance microscopy","score":0.19001469016075134},{"id":"https://openalex.org/keywords/scanning-confocal-electron-microscopy","display_name":"Scanning confocal electron microscopy","score":0.135616272687912},{"id":"https://openalex.org/keywords/scanning-electron-microscope","display_name":"Scanning electron microscope","score":0.10828238725662231}],"concepts":[{"id":"https://openalex.org/C2780841128","wikidata":"https://www.wikidata.org/wiki/Q5073781","display_name":"Characterization (materials science)","level":2,"score":0.8076533079147339},{"id":"https://openalex.org/C102951782","wikidata":"https://www.wikidata.org/wiki/Q49295","display_name":"Atomic force microscopy","level":2,"score":0.7067767381668091},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.5991782546043396},{"id":"https://openalex.org/C206008964","wikidata":"https://www.wikidata.org/wiki/Q5159384","display_name":"Conductive atomic force microscopy","level":3,"score":0.5887173414230347},{"id":"https://openalex.org/C19067145","wikidata":"https://www.wikidata.org/wiki/Q1137203","display_name":"Thin film","level":2,"score":0.5803780555725098},{"id":"https://openalex.org/C82764429","wikidata":"https://www.wikidata.org/wiki/Q7187730","display_name":"Photoconductive atomic force microscopy","level":5,"score":0.49976205825805664},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.49136295914649963},{"id":"https://openalex.org/C544956773","wikidata":"https://www.wikidata.org/wiki/Q670","display_name":"Silicon","level":2,"score":0.46233034133911133},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.4471200704574585},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.2591964900493622},{"id":"https://openalex.org/C99752389","wikidata":"https://www.wikidata.org/wiki/Q9337610","display_name":"Scanning capacitance microscopy","level":4,"score":0.19001469016075134},{"id":"https://openalex.org/C187921700","wikidata":"https://www.wikidata.org/wiki/Q7430074","display_name":"Scanning confocal electron microscopy","level":3,"score":0.135616272687912},{"id":"https://openalex.org/C26771246","wikidata":"https://www.wikidata.org/wiki/Q321095","display_name":"Scanning electron microscope","level":2,"score":0.10828238725662231}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1016/s0026-2714(03)00260-9","is_oa":false,"landing_page_url":"https://doi.org/10.1016/s0026-2714(03)00260-9","pdf_url":null,"source":{"id":"https://openalex.org/S133646729","display_name":"Microelectronics Reliability","issn_l":"0026-2714","issn":["0026-2714","1872-941X"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310320990","host_organization_name":"Elsevier BV","host_organization_lineage":["https://openalex.org/P4310320990"],"host_organization_lineage_names":["Elsevier BV"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Microelectronics Reliability","raw_type":"journal-article"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":0,"referenced_works":[],"related_works":["https://openalex.org/W88948087","https://openalex.org/W2802217751","https://openalex.org/W2793088195","https://openalex.org/W1586544047","https://openalex.org/W121510295","https://openalex.org/W2271423976","https://openalex.org/W2012665303","https://openalex.org/W2020635208","https://openalex.org/W3149936590","https://openalex.org/W2295551798"],"abstract_inverted_index":null,"counts_by_year":[{"year":2017,"cited_by_count":1},{"year":2013,"cited_by_count":1}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}