{"id":"https://openalex.org/W2030398726","doi":"https://doi.org/10.1016/s0026-2714(03)00211-7","title":"Improving the deflection of wire bonds in stacked chip scale package (CSP)","display_name":"Improving the deflection of wire bonds in stacked chip scale package (CSP)","publication_year":2003,"publication_date":"2003-09-12","ids":{"openalex":"https://openalex.org/W2030398726","doi":"https://doi.org/10.1016/s0026-2714(03)00211-7","mag":"2030398726"},"language":"en","primary_location":{"id":"doi:10.1016/s0026-2714(03)00211-7","is_oa":false,"landing_page_url":"https://doi.org/10.1016/s0026-2714(03)00211-7","pdf_url":null,"source":{"id":"https://openalex.org/S133646729","display_name":"Microelectronics Reliability","issn_l":"0026-2714","issn":["0026-2714","1872-941X"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310320990","host_organization_name":"Elsevier BV","host_organization_lineage":["https://openalex.org/P4310320990"],"host_organization_lineage_names":["Elsevier BV"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Microelectronics Reliability","raw_type":"journal-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5081306360","display_name":"Yasuhiro Yao","orcid":null},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Y.F. Yao","raw_affiliation_strings":["Agere Systems Singapore Pte. Ltd., 3 Kallang Sector, Kolam Ayer Industrial Park, Singapore 349278, Singapore"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Agere Systems Singapore Pte. Ltd., 3 Kallang Sector, Kolam Ayer Industrial Park, Singapore 349278, Singapore","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5101742808","display_name":"T.Y. Lin","orcid":"https://orcid.org/0000-0001-7769-3675"},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"T.Y. Lin","raw_affiliation_strings":["Agere Systems Singapore Pte. Ltd., 3 Kallang Sector, Kolam Ayer Industrial Park, Singapore 349278, Singapore"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Agere Systems Singapore Pte. Ltd., 3 Kallang Sector, Kolam Ayer Industrial Park, Singapore 349278, Singapore","institution_ids":[]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5006721107","display_name":"K.H. Chua","orcid":null},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"K.H. Chua","raw_affiliation_strings":["Agere Systems Singapore Pte. Ltd., 3 Kallang Sector, Kolam Ayer Industrial Park, Singapore 349278, Singapore"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Agere Systems Singapore Pte. Ltd., 3 Kallang Sector, Kolam Ayer Industrial Park, Singapore 349278, Singapore","institution_ids":[]}]}],"institutions":[],"countries_distinct_count":0,"institutions_distinct_count":3,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":{"value":2190,"currency":"USD","value_usd":2190},"apc_paid":null,"fwci":2.4799,"has_fulltext":false,"cited_by_count":20,"citation_normalized_percentile":{"value":0.8886844,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":90,"max":98},"biblio":{"volume":"43","issue":"12","first_page":"2039","last_page":"2045"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.9997000098228455,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.9997000098228455,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.9986000061035156,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11338","display_name":"Advancements in Photolithography Techniques","score":0.9886999726295471,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/chip-scale-package","display_name":"Chip-scale package","score":0.7352538704872131},{"id":"https://openalex.org/keywords/chip","display_name":"Chip","score":0.6757771372795105},{"id":"https://openalex.org/keywords/wire-bonding","display_name":"Wire bonding","score":0.6277600526809692},{"id":"https://openalex.org/keywords/deflection","display_name":"Deflection (physics)","score":0.5445672273635864},{"id":"https://openalex.org/keywords/quad-flat-no-leads-package","display_name":"Quad Flat No-leads package","score":0.5332410335540771},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.41085922718048096},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.4070744216442108},{"id":"https://openalex.org/keywords/embedded-system","display_name":"Embedded system","score":0.3518076539039612},{"id":"https://openalex.org/keywords/composite-material","display_name":"Composite material","score":0.23004919290542603},{"id":"https://openalex.org/keywords/physics","display_name":"Physics","score":0.15844547748565674},{"id":"https://openalex.org/keywords/optics","display_name":"Optics","score":0.13480538129806519},{"id":"https://openalex.org/keywords/telecommunications","display_name":"Telecommunications","score":0.10487627983093262}],"concepts":[{"id":"https://openalex.org/C126233035","wikidata":"https://www.wikidata.org/wiki/Q5101572","display_name":"Chip-scale package","level":3,"score":0.7352538704872131},{"id":"https://openalex.org/C165005293","wikidata":"https://www.wikidata.org/wiki/Q1074500","display_name":"Chip","level":2,"score":0.6757771372795105},{"id":"https://openalex.org/C140269135","wikidata":"https://www.wikidata.org/wiki/Q750783","display_name":"Wire bonding","level":3,"score":0.6277600526809692},{"id":"https://openalex.org/C2781355719","wikidata":"https://www.wikidata.org/wiki/Q2080698","display_name":"Deflection (physics)","level":2,"score":0.5445672273635864},{"id":"https://openalex.org/C162877825","wikidata":"https://www.wikidata.org/wiki/Q2121809","display_name":"Quad Flat No-leads package","level":4,"score":0.5332410335540771},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.41085922718048096},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.4070744216442108},{"id":"https://openalex.org/C149635348","wikidata":"https://www.wikidata.org/wiki/Q193040","display_name":"Embedded system","level":1,"score":0.3518076539039612},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.23004919290542603},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.15844547748565674},{"id":"https://openalex.org/C120665830","wikidata":"https://www.wikidata.org/wiki/Q14620","display_name":"Optics","level":1,"score":0.13480538129806519},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.10487627983093262},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.0},{"id":"https://openalex.org/C68928338","wikidata":"https://www.wikidata.org/wiki/Q131790","display_name":"Adhesive","level":3,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1016/s0026-2714(03)00211-7","is_oa":false,"landing_page_url":"https://doi.org/10.1016/s0026-2714(03)00211-7","pdf_url":null,"source":{"id":"https://openalex.org/S133646729","display_name":"Microelectronics Reliability","issn_l":"0026-2714","issn":["0026-2714","1872-941X"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310320990","host_organization_name":"Elsevier BV","host_organization_lineage":["https://openalex.org/P4310320990"],"host_organization_lineage_names":["Elsevier BV"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Microelectronics Reliability","raw_type":"journal-article"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":7,"referenced_works":["https://openalex.org/W1995968510","https://openalex.org/W2008015730","https://openalex.org/W2039115804","https://openalex.org/W2136324688","https://openalex.org/W2143818651","https://openalex.org/W4244959437","https://openalex.org/W6652386594"],"related_works":["https://openalex.org/W2053654711","https://openalex.org/W2949384349","https://openalex.org/W2291879779","https://openalex.org/W2042651503","https://openalex.org/W2185986687","https://openalex.org/W1601162912","https://openalex.org/W1983742508","https://openalex.org/W1974133951","https://openalex.org/W2060946771","https://openalex.org/W3163937968"],"abstract_inverted_index":null,"counts_by_year":[{"year":2023,"cited_by_count":2},{"year":2017,"cited_by_count":1},{"year":2016,"cited_by_count":2},{"year":2014,"cited_by_count":1},{"year":2012,"cited_by_count":5}],"updated_date":"2026-06-11T09:08:48.828518","created_date":"2025-10-10T00:00:00"}