{"id":"https://openalex.org/W2019471930","doi":"https://doi.org/10.1016/s0026-2714(03)00191-4","title":"Flip-chip packaging solution for CMOS image sensor device","display_name":"Flip-chip packaging solution for CMOS image sensor device","publication_year":2003,"publication_date":"2003-09-12","ids":{"openalex":"https://openalex.org/W2019471930","doi":"https://doi.org/10.1016/s0026-2714(03)00191-4","mag":"2019471930"},"language":"en","primary_location":{"id":"doi:10.1016/s0026-2714(03)00191-4","is_oa":false,"landing_page_url":"https://doi.org/10.1016/s0026-2714(03)00191-4","pdf_url":null,"source":{"id":"https://openalex.org/S133646729","display_name":"Microelectronics Reliability","issn_l":"0026-2714","issn":["0026-2714","1872-941X"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310320990","host_organization_name":"Elsevier BV","host_organization_lineage":["https://openalex.org/P4310320990"],"host_organization_lineage_names":["Elsevier BV"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Microelectronics Reliability","raw_type":"journal-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5083945808","display_name":"Jong\u2010Heon Kim","orcid":"https://orcid.org/0000-0002-3003-125X"},"institutions":[],"countries":[],"is_corresponding":true,"raw_author_name":"Jong-heon Kim","raw_affiliation_strings":["Semiconductor Division Ccube Digital Corp. Ltd, 17-5 Block, Ochang Science Complex, Chungbuk 363-883, South Korea"],"affiliations":[{"raw_affiliation_string":"Semiconductor Division Ccube Digital Corp. Ltd, 17-5 Block, Ochang Science Complex, Chungbuk 363-883, South Korea","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5050324051","display_name":"Insoo Kang","orcid":"https://orcid.org/0000-0001-7483-1171"},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"In-Soo Kang","raw_affiliation_strings":["Semiconductor Division Ccube Digital Corp. Ltd, 17-5 Block, Ochang Science Complex, Chungbuk 363-883, South Korea"],"affiliations":[{"raw_affiliation_string":"Semiconductor Division Ccube Digital Corp. Ltd, 17-5 Block, Ochang Science Complex, Chungbuk 363-883, South Korea","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5086716770","display_name":"Chi-jung Song","orcid":null},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Chi-jung Song","raw_affiliation_strings":["Semiconductor Division Ccube Digital Corp. Ltd, 17-5 Block, Ochang Science Complex, Chungbuk 363-883, South Korea"],"affiliations":[{"raw_affiliation_string":"Semiconductor Division Ccube Digital Corp. Ltd, 17-5 Block, Ochang Science Complex, Chungbuk 363-883, South Korea","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5019274439","display_name":"Young-Jik Hur","orcid":null},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Young-Jik Hur","raw_affiliation_strings":["Semiconductor Division Ccube Digital Corp. Ltd, 17-5 Block, Ochang Science Complex, Chungbuk 363-883, South Korea"],"affiliations":[{"raw_affiliation_string":"Semiconductor Division Ccube Digital Corp. Ltd, 17-5 Block, Ochang Science Complex, Chungbuk 363-883, South Korea","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5077418914","display_name":"Hak-Nam Kim","orcid":null},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Hak-Nam Kim","raw_affiliation_strings":["Semiconductor Division Ccube Digital Corp. Ltd, 17-5 Block, Ochang Science Complex, Chungbuk 363-883, South Korea"],"affiliations":[{"raw_affiliation_string":"Semiconductor Division Ccube Digital Corp. Ltd, 17-5 Block, Ochang Science Complex, Chungbuk 363-883, South Korea","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5063604721","display_name":"Esdy Baek","orcid":null},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Esdy Baek","raw_affiliation_strings":["Semiconductor Division Ccube Digital Corp. Ltd, 17-5 Block, Ochang Science Complex, Chungbuk 363-883, South Korea"],"affiliations":[{"raw_affiliation_string":"Semiconductor Division Ccube Digital Corp. Ltd, 17-5 Block, Ochang Science Complex, Chungbuk 363-883, South Korea","institution_ids":[]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5049380452","display_name":"T. Seo","orcid":null},"institutions":[{"id":"https://openalex.org/I2250650973","display_name":"Samsung (South Korea)","ror":"https://ror.org/04w3jy968","country_code":"KR","type":"company","lineage":["https://openalex.org/I2250650973"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Tae-Jun Seo","raw_affiliation_strings":["Display & Network Division, Samsung Electro-Mechanics, 314, Maetan-3Dong, Paldal-Gu, Suwon, Kyungi-Do 442-743, South Korea"],"affiliations":[{"raw_affiliation_string":"Display & Network Division, Samsung Electro-Mechanics, 314, Maetan-3Dong, Paldal-Gu, Suwon, Kyungi-Do 442-743, South Korea","institution_ids":["https://openalex.org/I2250650973"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":7,"corresponding_author_ids":["https://openalex.org/A5083945808"],"corresponding_institution_ids":[],"apc_list":{"value":2190,"currency":"USD","value_usd":2190},"apc_paid":null,"fwci":1.0576,"has_fulltext":false,"cited_by_count":5,"citation_normalized_percentile":{"value":0.77314707,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":94,"max":96},"biblio":{"volume":"44","issue":"1","first_page":"155","last_page":"161"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.9908000230789185,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.9908000230789185,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.9857000112533569,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11523","display_name":"Nanomaterials and Printing Technologies","score":0.9641000032424927,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/bumping","display_name":"Bumping","score":0.9882151484489441},{"id":"https://openalex.org/keywords/flip-chip","display_name":"Flip chip","score":0.9258308410644531},{"id":"https://openalex.org/keywords/chip","display_name":"Chip","score":0.5587956309318542},{"id":"https://openalex.org/keywords/image-sensor","display_name":"Image sensor","score":0.5019800662994385},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.49575528502464294},{"id":"https://openalex.org/keywords/chip-scale-package","display_name":"Chip-scale package","score":0.482389360666275},{"id":"https://openalex.org/keywords/soldering","display_name":"Soldering","score":0.4802325367927551},{"id":"https://openalex.org/keywords/thermal-copper-pillar-bump","display_name":"Thermal copper pillar bump","score":0.4259834289550781},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.41966864466667175},{"id":"https://openalex.org/keywords/quad-flat-no-leads-package","display_name":"Quad Flat No-leads package","score":0.4169904589653015},{"id":"https://openalex.org/keywords/cmos","display_name":"CMOS","score":0.4167669713497162},{"id":"https://openalex.org/keywords/electronic-packaging","display_name":"Electronic packaging","score":0.41255536675453186},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.34224385023117065},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.3346344828605652},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.27544575929641724},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.2649632692337036},{"id":"https://openalex.org/keywords/mechanical-engineering","display_name":"Mechanical engineering","score":0.1996113657951355},{"id":"https://openalex.org/keywords/nanotechnology","display_name":"Nanotechnology","score":0.09247303009033203},{"id":"https://openalex.org/keywords/artificial-intelligence","display_name":"Artificial intelligence","score":0.08073598146438599}],"concepts":[{"id":"https://openalex.org/C2776512755","wikidata":"https://www.wikidata.org/wiki/Q632543","display_name":"Bumping","level":2,"score":0.9882151484489441},{"id":"https://openalex.org/C79072407","wikidata":"https://www.wikidata.org/wiki/Q432439","display_name":"Flip chip","level":4,"score":0.9258308410644531},{"id":"https://openalex.org/C165005293","wikidata":"https://www.wikidata.org/wiki/Q1074500","display_name":"Chip","level":2,"score":0.5587956309318542},{"id":"https://openalex.org/C76935873","wikidata":"https://www.wikidata.org/wiki/Q209121","display_name":"Image sensor","level":2,"score":0.5019800662994385},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.49575528502464294},{"id":"https://openalex.org/C126233035","wikidata":"https://www.wikidata.org/wiki/Q5101572","display_name":"Chip-scale package","level":3,"score":0.482389360666275},{"id":"https://openalex.org/C50296614","wikidata":"https://www.wikidata.org/wiki/Q211387","display_name":"Soldering","level":2,"score":0.4802325367927551},{"id":"https://openalex.org/C125619702","wikidata":"https://www.wikidata.org/wiki/Q7783038","display_name":"Thermal copper pillar bump","level":5,"score":0.4259834289550781},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.41966864466667175},{"id":"https://openalex.org/C162877825","wikidata":"https://www.wikidata.org/wiki/Q2121809","display_name":"Quad Flat No-leads package","level":4,"score":0.4169904589653015},{"id":"https://openalex.org/C46362747","wikidata":"https://www.wikidata.org/wiki/Q173431","display_name":"CMOS","level":2,"score":0.4167669713497162},{"id":"https://openalex.org/C69567186","wikidata":"https://www.wikidata.org/wiki/Q5358403","display_name":"Electronic packaging","level":2,"score":0.41255536675453186},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.34224385023117065},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.3346344828605652},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.27544575929641724},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.2649632692337036},{"id":"https://openalex.org/C78519656","wikidata":"https://www.wikidata.org/wiki/Q101333","display_name":"Mechanical engineering","level":1,"score":0.1996113657951355},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.09247303009033203},{"id":"https://openalex.org/C154945302","wikidata":"https://www.wikidata.org/wiki/Q11660","display_name":"Artificial intelligence","level":1,"score":0.08073598146438599},{"id":"https://openalex.org/C68928338","wikidata":"https://www.wikidata.org/wiki/Q131790","display_name":"Adhesive","level":3,"score":0.0},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.0},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1016/s0026-2714(03)00191-4","is_oa":false,"landing_page_url":"https://doi.org/10.1016/s0026-2714(03)00191-4","pdf_url":null,"source":{"id":"https://openalex.org/S133646729","display_name":"Microelectronics Reliability","issn_l":"0026-2714","issn":["0026-2714","1872-941X"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310320990","host_organization_name":"Elsevier BV","host_organization_lineage":["https://openalex.org/P4310320990"],"host_organization_lineage_names":["Elsevier BV"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Microelectronics Reliability","raw_type":"journal-article"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[],"funders":[{"id":"https://openalex.org/F4320332195","display_name":"Samsung","ror":"https://ror.org/04w3jy968"}],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":3,"referenced_works":["https://openalex.org/W1978112631","https://openalex.org/W2146316338","https://openalex.org/W6681501226"],"related_works":["https://openalex.org/W1991382265","https://openalex.org/W2550547144","https://openalex.org/W2097720478","https://openalex.org/W2393005754","https://openalex.org/W3146287251","https://openalex.org/W2045281161","https://openalex.org/W2148265096","https://openalex.org/W58730736","https://openalex.org/W2026723811","https://openalex.org/W2057502705"],"abstract_inverted_index":null,"counts_by_year":[{"year":2015,"cited_by_count":2}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}