{"id":"https://openalex.org/W2076103026","doi":"https://doi.org/10.1016/s0026-2714(03)00160-4","title":"Experimental study on the thermal performance of micro-heat pipe with cross-section of polygon","display_name":"Experimental study on the thermal performance of micro-heat pipe with cross-section of polygon","publication_year":2003,"publication_date":"2003-07-16","ids":{"openalex":"https://openalex.org/W2076103026","doi":"https://doi.org/10.1016/s0026-2714(03)00160-4","mag":"2076103026"},"language":"en","primary_location":{"id":"doi:10.1016/s0026-2714(03)00160-4","is_oa":false,"landing_page_url":"https://doi.org/10.1016/s0026-2714(03)00160-4","pdf_url":null,"source":{"id":"https://openalex.org/S133646729","display_name":"Microelectronics Reliability","issn_l":"0026-2714","issn":["0026-2714","1872-941X"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310320990","host_organization_name":"Elsevier BV","host_organization_lineage":["https://openalex.org/P4310320990"],"host_organization_lineage_names":["Elsevier BV"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Microelectronics Reliability","raw_type":"journal-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5110635349","display_name":"Seok Hwan Moon","orcid":null},"institutions":[{"id":"https://openalex.org/I142401562","display_name":"Electronics and Telecommunications Research Institute","ror":"https://ror.org/03ysstz10","country_code":"KR","type":"facility","lineage":["https://openalex.org/I142401562","https://openalex.org/I2801339556","https://openalex.org/I4210144908","https://openalex.org/I4387152098"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Seok Hwan Moon","raw_affiliation_strings":["Microsystem Team, Human Information Department, Electronics and Telecommunications Research Institute, 161 Gajong-Dong, Yusong-Gu, Daejon 305-350, South Korea"],"affiliations":[{"raw_affiliation_string":"Microsystem Team, Human Information Department, Electronics and Telecommunications Research Institute, 161 Gajong-Dong, Yusong-Gu, Daejon 305-350, South Korea","institution_ids":["https://openalex.org/I142401562"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5055250887","display_name":"Gunn Hwang","orcid":"https://orcid.org/0000-0003-3242-7079"},"institutions":[{"id":"https://openalex.org/I142401562","display_name":"Electronics and Telecommunications Research Institute","ror":"https://ror.org/03ysstz10","country_code":"KR","type":"facility","lineage":["https://openalex.org/I142401562","https://openalex.org/I2801339556","https://openalex.org/I4210144908","https://openalex.org/I4387152098"]}],"countries":["KR"],"is_corresponding":true,"raw_author_name":"Gunn Hwang","raw_affiliation_strings":["Microsystem Team, Human Information Department, Electronics and Telecommunications Research Institute, 161 Gajong-Dong, Yusong-Gu, Daejon 305-350, South Korea"],"affiliations":[{"raw_affiliation_string":"Microsystem Team, Human Information Department, Electronics and Telecommunications Research Institute, 161 Gajong-Dong, Yusong-Gu, Daejon 305-350, South Korea","institution_ids":["https://openalex.org/I142401562"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5110685372","display_name":"Sang Choon Ko","orcid":null},"institutions":[{"id":"https://openalex.org/I142401562","display_name":"Electronics and Telecommunications Research Institute","ror":"https://ror.org/03ysstz10","country_code":"KR","type":"facility","lineage":["https://openalex.org/I142401562","https://openalex.org/I2801339556","https://openalex.org/I4210144908","https://openalex.org/I4387152098"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Sang Choon Ko","raw_affiliation_strings":["Microsystem Team, Human Information Department, Electronics and Telecommunications Research Institute, 161 Gajong-Dong, Yusong-Gu, Daejon 305-350, South Korea"],"affiliations":[{"raw_affiliation_string":"Microsystem Team, Human Information Department, Electronics and Telecommunications Research Institute, 161 Gajong-Dong, Yusong-Gu, Daejon 305-350, South Korea","institution_ids":["https://openalex.org/I142401562"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5101470209","display_name":"Youn Tae Kim","orcid":"https://orcid.org/0000-0002-3905-9312"},"institutions":[{"id":"https://openalex.org/I142401562","display_name":"Electronics and Telecommunications Research Institute","ror":"https://ror.org/03ysstz10","country_code":"KR","type":"facility","lineage":["https://openalex.org/I142401562","https://openalex.org/I2801339556","https://openalex.org/I4210144908","https://openalex.org/I4387152098"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Youn Tae Kim","raw_affiliation_strings":["Microsystem Team, Human Information Department, Electronics and Telecommunications Research Institute, 161 Gajong-Dong, Yusong-Gu, Daejon 305-350, South Korea"],"affiliations":[{"raw_affiliation_string":"Microsystem Team, Human Information Department, Electronics and Telecommunications Research Institute, 161 Gajong-Dong, Yusong-Gu, Daejon 305-350, South Korea","institution_ids":["https://openalex.org/I142401562"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":4,"corresponding_author_ids":["https://openalex.org/A5055250887"],"corresponding_institution_ids":["https://openalex.org/I142401562"],"apc_list":{"value":2190,"currency":"USD","value_usd":2190},"apc_paid":null,"fwci":2.1572,"has_fulltext":false,"cited_by_count":67,"citation_normalized_percentile":{"value":0.86923436,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":99},"biblio":{"volume":"44","issue":"2","first_page":"315","last_page":"321"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10850","display_name":"Heat Transfer and Boiling Studies","score":0.9991999864578247,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10850","display_name":"Heat Transfer and Boiling Studies","score":0.9991999864578247,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10998","display_name":"Heat Transfer and Optimization","score":0.9980000257492065,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T14156","display_name":"Engineering Applied Research","score":0.9858999848365784,"subfield":{"id":"https://openalex.org/subfields/2205","display_name":"Civil and Structural Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/miniaturization","display_name":"Miniaturization","score":0.7145586013793945},{"id":"https://openalex.org/keywords/heat-pipe","display_name":"Heat pipe","score":0.6403973698616028},{"id":"https://openalex.org/keywords/software-portability","display_name":"Software portability","score":0.5489512085914612},{"id":"https://openalex.org/keywords/mechanical-engineering","display_name":"Mechanical engineering","score":0.5319839715957642},{"id":"https://openalex.org/keywords/heat-transfer","display_name":"Heat transfer","score":0.5181935429573059},{"id":"https://openalex.org/keywords/cross-section","display_name":"Cross section (physics)","score":0.4987220764160156},{"id":"https://openalex.org/keywords/electronic-component","display_name":"Electronic component","score":0.4938221871852875},{"id":"https://openalex.org/keywords/polygon","display_name":"Polygon (computer graphics)","score":0.4865197539329529},{"id":"https://openalex.org/keywords/electronics","display_name":"Electronics","score":0.46369683742523193},{"id":"https://openalex.org/keywords/thermal","display_name":"Thermal","score":0.4563174843788147},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.40690362453460693},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.35638123750686646},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.2923216223716736},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.21804937720298767},{"id":"https://openalex.org/keywords/mechanics","display_name":"Mechanics","score":0.136721670627594},{"id":"https://openalex.org/keywords/physics","display_name":"Physics","score":0.09146064519882202}],"concepts":[{"id":"https://openalex.org/C57528182","wikidata":"https://www.wikidata.org/wiki/Q1271842","display_name":"Miniaturization","level":2,"score":0.7145586013793945},{"id":"https://openalex.org/C37728375","wikidata":"https://www.wikidata.org/wiki/Q600568","display_name":"Heat pipe","level":3,"score":0.6403973698616028},{"id":"https://openalex.org/C63000827","wikidata":"https://www.wikidata.org/wiki/Q3080428","display_name":"Software portability","level":2,"score":0.5489512085914612},{"id":"https://openalex.org/C78519656","wikidata":"https://www.wikidata.org/wiki/Q101333","display_name":"Mechanical engineering","level":1,"score":0.5319839715957642},{"id":"https://openalex.org/C50517652","wikidata":"https://www.wikidata.org/wiki/Q179635","display_name":"Heat transfer","level":2,"score":0.5181935429573059},{"id":"https://openalex.org/C52234038","wikidata":"https://www.wikidata.org/wiki/Q17128025","display_name":"Cross section (physics)","level":2,"score":0.4987220764160156},{"id":"https://openalex.org/C81060104","wikidata":"https://www.wikidata.org/wiki/Q11653","display_name":"Electronic component","level":2,"score":0.4938221871852875},{"id":"https://openalex.org/C190694206","wikidata":"https://www.wikidata.org/wiki/Q3276654","display_name":"Polygon (computer graphics)","level":3,"score":0.4865197539329529},{"id":"https://openalex.org/C138331895","wikidata":"https://www.wikidata.org/wiki/Q11650","display_name":"Electronics","level":2,"score":0.46369683742523193},{"id":"https://openalex.org/C204530211","wikidata":"https://www.wikidata.org/wiki/Q752823","display_name":"Thermal","level":2,"score":0.4563174843788147},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.40690362453460693},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.35638123750686646},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.2923216223716736},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.21804937720298767},{"id":"https://openalex.org/C57879066","wikidata":"https://www.wikidata.org/wiki/Q41217","display_name":"Mechanics","level":1,"score":0.136721670627594},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.09146064519882202},{"id":"https://openalex.org/C62520636","wikidata":"https://www.wikidata.org/wiki/Q944","display_name":"Quantum mechanics","level":1,"score":0.0},{"id":"https://openalex.org/C153294291","wikidata":"https://www.wikidata.org/wiki/Q25261","display_name":"Meteorology","level":1,"score":0.0},{"id":"https://openalex.org/C199360897","wikidata":"https://www.wikidata.org/wiki/Q9143","display_name":"Programming language","level":1,"score":0.0},{"id":"https://openalex.org/C126042441","wikidata":"https://www.wikidata.org/wiki/Q1324888","display_name":"Frame (networking)","level":2,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1016/s0026-2714(03)00160-4","is_oa":false,"landing_page_url":"https://doi.org/10.1016/s0026-2714(03)00160-4","pdf_url":null,"source":{"id":"https://openalex.org/S133646729","display_name":"Microelectronics Reliability","issn_l":"0026-2714","issn":["0026-2714","1872-941X"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310320990","host_organization_name":"Elsevier BV","host_organization_lineage":["https://openalex.org/P4310320990"],"host_organization_lineage_names":["Elsevier BV"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Microelectronics Reliability","raw_type":"journal-article"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":4,"referenced_works":["https://openalex.org/W1670217947","https://openalex.org/W2068462331","https://openalex.org/W2094851886","https://openalex.org/W2124146241"],"related_works":["https://openalex.org/W107105315","https://openalex.org/W4367156293","https://openalex.org/W1584537303","https://openalex.org/W4388155270","https://openalex.org/W2886573639","https://openalex.org/W2162873932","https://openalex.org/W2013982337","https://openalex.org/W2162010091","https://openalex.org/W2150258753","https://openalex.org/W141662614"],"abstract_inverted_index":null,"counts_by_year":[{"year":2026,"cited_by_count":2},{"year":2025,"cited_by_count":1},{"year":2024,"cited_by_count":2},{"year":2023,"cited_by_count":2},{"year":2022,"cited_by_count":1},{"year":2021,"cited_by_count":2},{"year":2020,"cited_by_count":2},{"year":2019,"cited_by_count":3},{"year":2018,"cited_by_count":2},{"year":2017,"cited_by_count":3},{"year":2016,"cited_by_count":3},{"year":2015,"cited_by_count":5},{"year":2014,"cited_by_count":1},{"year":2013,"cited_by_count":6},{"year":2012,"cited_by_count":4}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}