{"id":"https://openalex.org/W2000046899","doi":"https://doi.org/10.1016/s0026-2714(03)00035-0","title":"Reliability assessment and hygroswelling modeling of FCBGA with no-flow underfill","display_name":"Reliability assessment and hygroswelling modeling of FCBGA with no-flow underfill","publication_year":2003,"publication_date":"2003-04-30","ids":{"openalex":"https://openalex.org/W2000046899","doi":"https://doi.org/10.1016/s0026-2714(03)00035-0","mag":"2000046899"},"language":"en","primary_location":{"id":"doi:10.1016/s0026-2714(03)00035-0","is_oa":false,"landing_page_url":"https://doi.org/10.1016/s0026-2714(03)00035-0","pdf_url":null,"source":{"id":"https://openalex.org/S133646729","display_name":"Microelectronics Reliability","issn_l":"0026-2714","issn":["0026-2714","1872-941X"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310320990","host_organization_name":"Elsevier BV","host_organization_lineage":["https://openalex.org/P4310320990"],"host_organization_lineage_names":["Elsevier BV"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Microelectronics Reliability","raw_type":"journal-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5020540772","display_name":"Tong Yan Tee","orcid":null},"institutions":[{"id":"https://openalex.org/I4210133433","display_name":"STMicroelectronics (Singapore)","ror":"https://ror.org/030c4gr60","country_code":"SG","type":"company","lineage":["https://openalex.org/I131827901","https://openalex.org/I4210133433"]}],"countries":["SG"],"is_corresponding":true,"raw_author_name":"Tong Yan Tee","raw_affiliation_strings":["STMicroelectronics, 629 Lorong 4/6 Toa Payoh, Singapore 319521, Singapore"],"affiliations":[{"raw_affiliation_string":"STMicroelectronics, 629 Lorong 4/6 Toa Payoh, Singapore 319521, Singapore","institution_ids":["https://openalex.org/I4210133433"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5080701136","display_name":"Chek Lim Kho","orcid":null},"institutions":[{"id":"https://openalex.org/I4210133433","display_name":"STMicroelectronics (Singapore)","ror":"https://ror.org/030c4gr60","country_code":"SG","type":"company","lineage":["https://openalex.org/I131827901","https://openalex.org/I4210133433"]}],"countries":["SG"],"is_corresponding":false,"raw_author_name":"Chek Lim Kho","raw_affiliation_strings":["STMicroelectronics, 629 Lorong 4/6 Toa Payoh, Singapore 319521, Singapore"],"affiliations":[{"raw_affiliation_string":"STMicroelectronics, 629 Lorong 4/6 Toa Payoh, Singapore 319521, Singapore","institution_ids":["https://openalex.org/I4210133433"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5033766749","display_name":"D. Yap","orcid":null},"institutions":[{"id":"https://openalex.org/I4210133433","display_name":"STMicroelectronics (Singapore)","ror":"https://ror.org/030c4gr60","country_code":"SG","type":"company","lineage":["https://openalex.org/I131827901","https://openalex.org/I4210133433"]}],"countries":["SG"],"is_corresponding":false,"raw_author_name":"Daniel Yap","raw_affiliation_strings":["STMicroelectronics, 629 Lorong 4/6 Toa Payoh, Singapore 319521, Singapore"],"affiliations":[{"raw_affiliation_string":"STMicroelectronics, 629 Lorong 4/6 Toa Payoh, Singapore 319521, Singapore","institution_ids":["https://openalex.org/I4210133433"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5049552433","display_name":"Carol Toh","orcid":null},"institutions":[{"id":"https://openalex.org/I4210133433","display_name":"STMicroelectronics (Singapore)","ror":"https://ror.org/030c4gr60","country_code":"SG","type":"company","lineage":["https://openalex.org/I131827901","https://openalex.org/I4210133433"]}],"countries":["SG"],"is_corresponding":false,"raw_author_name":"Carol Toh","raw_affiliation_strings":["STMicroelectronics, 629 Lorong 4/6 Toa Payoh, Singapore 319521, Singapore"],"affiliations":[{"raw_affiliation_string":"STMicroelectronics, 629 Lorong 4/6 Toa Payoh, Singapore 319521, Singapore","institution_ids":["https://openalex.org/I4210133433"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5009667610","display_name":"Xavier Baraton","orcid":null},"institutions":[{"id":"https://openalex.org/I4210133433","display_name":"STMicroelectronics (Singapore)","ror":"https://ror.org/030c4gr60","country_code":"SG","type":"company","lineage":["https://openalex.org/I131827901","https://openalex.org/I4210133433"]}],"countries":["SG"],"is_corresponding":false,"raw_author_name":"Xavier Baraton","raw_affiliation_strings":["STMicroelectronics, 629 Lorong 4/6 Toa Payoh, Singapore 319521, Singapore"],"affiliations":[{"raw_affiliation_string":"STMicroelectronics, 629 Lorong 4/6 Toa Payoh, Singapore 319521, Singapore","institution_ids":["https://openalex.org/I4210133433"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5100714988","display_name":"Z.W. Zhong","orcid":"https://orcid.org/0000-0002-0762-3580"},"institutions":[{"id":"https://openalex.org/I172675005","display_name":"Nanyang Technological University","ror":"https://ror.org/02e7b5302","country_code":"SG","type":"education","lineage":["https://openalex.org/I172675005"]}],"countries":["SG"],"is_corresponding":false,"raw_author_name":"Zhaowei Zhong","raw_affiliation_strings":["Nanyang Technological University, School of MPE, 50 Nanyang Avenue, Singapore 639798, Singapore"],"affiliations":[{"raw_affiliation_string":"Nanyang Technological University, School of MPE, 50 Nanyang Avenue, Singapore 639798, Singapore","institution_ids":["https://openalex.org/I172675005"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":6,"corresponding_author_ids":["https://openalex.org/A5020540772"],"corresponding_institution_ids":["https://openalex.org/I4210133433"],"apc_list":{"value":2190,"currency":"USD","value_usd":2190},"apc_paid":null,"fwci":7.0507,"has_fulltext":false,"cited_by_count":53,"citation_normalized_percentile":{"value":0.97231005,"is_in_top_1_percent":false,"is_in_top_10_percent":true},"cited_by_percentile_year":{"min":89,"max":97},"biblio":{"volume":"43","issue":"5","first_page":"741","last_page":"749"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.9994000196456909,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10219","display_name":"Mechanical Behavior of Composites","score":0.9991999864578247,"subfield":{"id":"https://openalex.org/subfields/2211","display_name":"Mechanics of Materials"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/flip-chip","display_name":"Flip chip","score":0.8580703735351562},{"id":"https://openalex.org/keywords/ball-grid-array","display_name":"Ball grid array","score":0.8555166125297546},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.7848121523857117},{"id":"https://openalex.org/keywords/composite-material","display_name":"Composite material","score":0.7090031504631042},{"id":"https://openalex.org/keywords/delamination","display_name":"Delamination (geology)","score":0.5281363129615784},{"id":"https://openalex.org/keywords/moisture","display_name":"Moisture","score":0.5229701995849609},{"id":"https://openalex.org/keywords/die","display_name":"Die (integrated circuit)","score":0.4120834767818451},{"id":"https://openalex.org/keywords/soldering","display_name":"Soldering","score":0.3115444779396057},{"id":"https://openalex.org/keywords/adhesive","display_name":"Adhesive","score":0.3065009117126465},{"id":"https://openalex.org/keywords/layer","display_name":"Layer (electronics)","score":0.07212147116661072}],"concepts":[{"id":"https://openalex.org/C79072407","wikidata":"https://www.wikidata.org/wiki/Q432439","display_name":"Flip chip","level":4,"score":0.8580703735351562},{"id":"https://openalex.org/C94709252","wikidata":"https://www.wikidata.org/wiki/Q570628","display_name":"Ball grid array","level":3,"score":0.8555166125297546},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.7848121523857117},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.7090031504631042},{"id":"https://openalex.org/C30239060","wikidata":"https://www.wikidata.org/wiki/Q5253111","display_name":"Delamination (geology)","level":4,"score":0.5281363129615784},{"id":"https://openalex.org/C176864760","wikidata":"https://www.wikidata.org/wiki/Q217651","display_name":"Moisture","level":2,"score":0.5229701995849609},{"id":"https://openalex.org/C111106434","wikidata":"https://www.wikidata.org/wiki/Q1072430","display_name":"Die (integrated circuit)","level":2,"score":0.4120834767818451},{"id":"https://openalex.org/C50296614","wikidata":"https://www.wikidata.org/wiki/Q211387","display_name":"Soldering","level":2,"score":0.3115444779396057},{"id":"https://openalex.org/C68928338","wikidata":"https://www.wikidata.org/wiki/Q131790","display_name":"Adhesive","level":3,"score":0.3065009117126465},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.07212147116661072},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.0},{"id":"https://openalex.org/C151730666","wikidata":"https://www.wikidata.org/wiki/Q7205","display_name":"Paleontology","level":1,"score":0.0},{"id":"https://openalex.org/C77928131","wikidata":"https://www.wikidata.org/wiki/Q193343","display_name":"Tectonics","level":2,"score":0.0},{"id":"https://openalex.org/C58097730","wikidata":"https://www.wikidata.org/wiki/Q176318","display_name":"Subduction","level":3,"score":0.0},{"id":"https://openalex.org/C86803240","wikidata":"https://www.wikidata.org/wiki/Q420","display_name":"Biology","level":0,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1016/s0026-2714(03)00035-0","is_oa":false,"landing_page_url":"https://doi.org/10.1016/s0026-2714(03)00035-0","pdf_url":null,"source":{"id":"https://openalex.org/S133646729","display_name":"Microelectronics Reliability","issn_l":"0026-2714","issn":["0026-2714","1872-941X"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310320990","host_organization_name":"Elsevier BV","host_organization_lineage":["https://openalex.org/P4310320990"],"host_organization_lineage_names":["Elsevier BV"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Microelectronics Reliability","raw_type":"journal-article"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":13,"referenced_works":["https://openalex.org/W44853396","https://openalex.org/W1740601578","https://openalex.org/W1842403498","https://openalex.org/W1971214850","https://openalex.org/W2105812579","https://openalex.org/W2111005142","https://openalex.org/W2135865031","https://openalex.org/W2143793988","https://openalex.org/W2145827698","https://openalex.org/W2163745963","https://openalex.org/W2164473168","https://openalex.org/W6675581265","https://openalex.org/W6681137954"],"related_works":["https://openalex.org/W1951801788","https://openalex.org/W2050959455","https://openalex.org/W2167784957","https://openalex.org/W2155941634","https://openalex.org/W2380335578","https://openalex.org/W2079719989","https://openalex.org/W2367693714","https://openalex.org/W2134467738","https://openalex.org/W4295036922","https://openalex.org/W2365278150"],"abstract_inverted_index":null,"counts_by_year":[{"year":2025,"cited_by_count":1},{"year":2024,"cited_by_count":1},{"year":2022,"cited_by_count":1},{"year":2020,"cited_by_count":1},{"year":2018,"cited_by_count":1},{"year":2017,"cited_by_count":1},{"year":2015,"cited_by_count":1},{"year":2014,"cited_by_count":1},{"year":2013,"cited_by_count":2},{"year":2012,"cited_by_count":3}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}