{"id":"https://openalex.org/W2000595247","doi":"https://doi.org/10.1016/s0026-2714(03)00027-1","title":"Copper metallization influence on power MOS reliability","display_name":"Copper metallization influence on power MOS reliability","publication_year":2003,"publication_date":"2003-04-01","ids":{"openalex":"https://openalex.org/W2000595247","doi":"https://doi.org/10.1016/s0026-2714(03)00027-1","mag":"2000595247"},"language":"en","primary_location":{"id":"doi:10.1016/s0026-2714(03)00027-1","is_oa":false,"landing_page_url":"https://doi.org/10.1016/s0026-2714(03)00027-1","pdf_url":null,"source":{"id":"https://openalex.org/S133646729","display_name":"Microelectronics Reliability","issn_l":"0026-2714","issn":["0026-2714","1872-941X"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310320990","host_organization_name":"Elsevier BV","host_organization_lineage":["https://openalex.org/P4310320990"],"host_organization_lineage_names":["Elsevier BV"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Microelectronics Reliability","raw_type":"journal-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5026823159","display_name":"Adeline Feybesse","orcid":null},"institutions":[{"id":"https://openalex.org/I1294671590","display_name":"Centre National de la Recherche Scientifique","ror":"https://ror.org/02feahw73","country_code":"FR","type":"government","lineage":["https://openalex.org/I1294671590"]},{"id":"https://openalex.org/I4210107416","display_name":"Roche (France)","ror":"https://ror.org/01mqmer16","country_code":"FR","type":"company","lineage":["https://openalex.org/I118019719","https://openalex.org/I4210107416"]},{"id":"https://openalex.org/I190497903","display_name":"Laboratoire d'Analyse et d'Architecture des Syst\u00e8mes","ror":"https://ror.org/03vcm6439","country_code":"FR","type":"facility","lineage":["https://openalex.org/I1294671590","https://openalex.org/I1294671590","https://openalex.org/I1294671590","https://openalex.org/I134560555","https://openalex.org/I190497903","https://openalex.org/I196454796","https://openalex.org/I205747304","https://openalex.org/I205747304","https://openalex.org/I4210095849","https://openalex.org/I4210159245","https://openalex.org/I4387153255","https://openalex.org/I4405258862","https://openalex.org/I4405258862","https://openalex.org/I4405258862","https://openalex.org/I4405258862"]},{"id":"https://openalex.org/I4210147988","display_name":"Motorola (France)","ror":"https://ror.org/05m34fq04","country_code":"FR","type":"company","lineage":["https://openalex.org/I1333370159","https://openalex.org/I4210147988"]}],"countries":["FR"],"is_corresponding":true,"raw_author_name":"Adeline Feybesse","raw_affiliation_strings":["LAAS/CNRS, 07 Avenue du Colonel Roche, 31077 Toulouse Cedex 4, France","Motorola, 134 Avenue Eisenhower, B.P. 1029, 31023 Toulouse Cedex, France"],"affiliations":[{"raw_affiliation_string":"LAAS/CNRS, 07 Avenue du Colonel Roche, 31077 Toulouse Cedex 4, France","institution_ids":["https://openalex.org/I190497903","https://openalex.org/I4210107416","https://openalex.org/I1294671590"]},{"raw_affiliation_string":"Motorola, 134 Avenue Eisenhower, B.P. 1029, 31023 Toulouse Cedex, France","institution_ids":["https://openalex.org/I4210147988"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5001191725","display_name":"I. Deram","orcid":null},"institutions":[{"id":"https://openalex.org/I4210147988","display_name":"Motorola (France)","ror":"https://ror.org/05m34fq04","country_code":"FR","type":"company","lineage":["https://openalex.org/I1333370159","https://openalex.org/I4210147988"]}],"countries":["FR"],"is_corresponding":false,"raw_author_name":"Ivana Deram","raw_affiliation_strings":["Motorola, 134 Avenue Eisenhower, B.P. 1029, 31023 Toulouse Cedex, France"],"affiliations":[{"raw_affiliation_string":"Motorola, 134 Avenue Eisenhower, B.P. 1029, 31023 Toulouse Cedex, France","institution_ids":["https://openalex.org/I4210147988"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5110158637","display_name":"Jean-Michel Reyn\u00e8s","orcid":null},"institutions":[{"id":"https://openalex.org/I4210147988","display_name":"Motorola (France)","ror":"https://ror.org/05m34fq04","country_code":"FR","type":"company","lineage":["https://openalex.org/I1333370159","https://openalex.org/I4210147988"]}],"countries":["FR"],"is_corresponding":false,"raw_author_name":"Jean-Michel Reynes","raw_affiliation_strings":["Motorola, 134 Avenue Eisenhower, B.P. 1029, 31023 Toulouse Cedex, France"],"affiliations":[{"raw_affiliation_string":"Motorola, 134 Avenue Eisenhower, B.P. 1029, 31023 Toulouse Cedex, France","institution_ids":["https://openalex.org/I4210147988"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5028305632","display_name":"\u00c9ric Moreau","orcid":null},"institutions":[{"id":"https://openalex.org/I4210147988","display_name":"Motorola (France)","ror":"https://ror.org/05m34fq04","country_code":"FR","type":"company","lineage":["https://openalex.org/I1333370159","https://openalex.org/I4210147988"]}],"countries":["FR"],"is_corresponding":false,"raw_author_name":"Eric Moreau","raw_affiliation_strings":["Motorola, 134 Avenue Eisenhower, B.P. 1029, 31023 Toulouse Cedex, France"],"affiliations":[{"raw_affiliation_string":"Motorola, 134 Avenue Eisenhower, B.P. 1029, 31023 Toulouse Cedex, France","institution_ids":["https://openalex.org/I4210147988"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":4,"corresponding_author_ids":["https://openalex.org/A5026823159"],"corresponding_institution_ids":["https://openalex.org/I1294671590","https://openalex.org/I190497903","https://openalex.org/I4210107416","https://openalex.org/I4210147988"],"apc_list":{"value":2190,"currency":"USD","value_usd":2190},"apc_paid":null,"fwci":0.3525,"has_fulltext":false,"cited_by_count":6,"citation_normalized_percentile":{"value":0.61693347,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":96},"biblio":{"volume":"43","issue":"4","first_page":"571","last_page":"576"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10472","display_name":"Semiconductor materials and devices","score":0.9998000264167786,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10472","display_name":"Semiconductor materials and devices","score":0.9998000264167786,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T14117","display_name":"Integrated Circuits and Semiconductor Failure Analysis","score":0.9994000196456909,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11661","display_name":"Copper Interconnects and Reliability","score":0.9991999864578247,"subfield":{"id":"https://openalex.org/subfields/2504","display_name":"Electronic, Optical and Magnetic Materials"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/copper","display_name":"Copper","score":0.8370850086212158},{"id":"https://openalex.org/keywords/reliability","display_name":"Reliability (semiconductor)","score":0.7724825739860535},{"id":"https://openalex.org/keywords/characterization","display_name":"Characterization (materials science)","score":0.7072799205780029},{"id":"https://openalex.org/keywords/reliability-engineering","display_name":"Reliability engineering","score":0.5675740838050842},{"id":"https://openalex.org/keywords/work","display_name":"Work (physics)","score":0.497513085603714},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.4923020601272583},{"id":"https://openalex.org/keywords/power","display_name":"Power (physics)","score":0.4751184582710266},{"id":"https://openalex.org/keywords/diffusion","display_name":"Diffusion","score":0.4270702600479126},{"id":"https://openalex.org/keywords/engineering-physics","display_name":"Engineering physics","score":0.38139215111732483},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.3470141887664795},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.3342990577220917},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.3336717486381531},{"id":"https://openalex.org/keywords/metallurgy","display_name":"Metallurgy","score":0.3132311999797821},{"id":"https://openalex.org/keywords/mechanical-engineering","display_name":"Mechanical engineering","score":0.27517062425613403},{"id":"https://openalex.org/keywords/nanotechnology","display_name":"Nanotechnology","score":0.16881301999092102},{"id":"https://openalex.org/keywords/physics","display_name":"Physics","score":0.08181688189506531},{"id":"https://openalex.org/keywords/thermodynamics","display_name":"Thermodynamics","score":0.0763961672782898}],"concepts":[{"id":"https://openalex.org/C544778455","wikidata":"https://www.wikidata.org/wiki/Q753","display_name":"Copper","level":2,"score":0.8370850086212158},{"id":"https://openalex.org/C43214815","wikidata":"https://www.wikidata.org/wiki/Q7310987","display_name":"Reliability (semiconductor)","level":3,"score":0.7724825739860535},{"id":"https://openalex.org/C2780841128","wikidata":"https://www.wikidata.org/wiki/Q5073781","display_name":"Characterization (materials science)","level":2,"score":0.7072799205780029},{"id":"https://openalex.org/C200601418","wikidata":"https://www.wikidata.org/wiki/Q2193887","display_name":"Reliability engineering","level":1,"score":0.5675740838050842},{"id":"https://openalex.org/C18762648","wikidata":"https://www.wikidata.org/wiki/Q42213","display_name":"Work (physics)","level":2,"score":0.497513085603714},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.4923020601272583},{"id":"https://openalex.org/C163258240","wikidata":"https://www.wikidata.org/wiki/Q25342","display_name":"Power (physics)","level":2,"score":0.4751184582710266},{"id":"https://openalex.org/C69357855","wikidata":"https://www.wikidata.org/wiki/Q163214","display_name":"Diffusion","level":2,"score":0.4270702600479126},{"id":"https://openalex.org/C61696701","wikidata":"https://www.wikidata.org/wiki/Q770766","display_name":"Engineering physics","level":1,"score":0.38139215111732483},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.3470141887664795},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.3342990577220917},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.3336717486381531},{"id":"https://openalex.org/C191897082","wikidata":"https://www.wikidata.org/wiki/Q11467","display_name":"Metallurgy","level":1,"score":0.3132311999797821},{"id":"https://openalex.org/C78519656","wikidata":"https://www.wikidata.org/wiki/Q101333","display_name":"Mechanical engineering","level":1,"score":0.27517062425613403},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.16881301999092102},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.08181688189506531},{"id":"https://openalex.org/C97355855","wikidata":"https://www.wikidata.org/wiki/Q11473","display_name":"Thermodynamics","level":1,"score":0.0763961672782898}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1016/s0026-2714(03)00027-1","is_oa":false,"landing_page_url":"https://doi.org/10.1016/s0026-2714(03)00027-1","pdf_url":null,"source":{"id":"https://openalex.org/S133646729","display_name":"Microelectronics Reliability","issn_l":"0026-2714","issn":["0026-2714","1872-941X"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310320990","host_organization_name":"Elsevier BV","host_organization_lineage":["https://openalex.org/P4310320990"],"host_organization_lineage_names":["Elsevier BV"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Microelectronics Reliability","raw_type":"journal-article"}],"best_oa_location":null,"sustainable_development_goals":[{"score":0.5199999809265137,"id":"https://metadata.un.org/sdg/9","display_name":"Industry, innovation and infrastructure"}],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":9,"referenced_works":["https://openalex.org/W1597355861","https://openalex.org/W1847613005","https://openalex.org/W1982808500","https://openalex.org/W2001253944","https://openalex.org/W2051892856","https://openalex.org/W2057109349","https://openalex.org/W2084645196","https://openalex.org/W2114863023","https://openalex.org/W4285719527"],"related_works":["https://openalex.org/W3107994849","https://openalex.org/W1981429685","https://openalex.org/W2473021157","https://openalex.org/W2064780653","https://openalex.org/W2410954876","https://openalex.org/W2794905580","https://openalex.org/W4247143848","https://openalex.org/W1999112988","https://openalex.org/W2009883749","https://openalex.org/W2735573198"],"abstract_inverted_index":null,"counts_by_year":[{"year":2022,"cited_by_count":1},{"year":2015,"cited_by_count":1},{"year":2014,"cited_by_count":2}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}