{"id":"https://openalex.org/W1979448488","doi":"https://doi.org/10.1016/s0026-2714(02)00269-x","title":"Effect of substrate flexibility on solder joint reliability","display_name":"Effect of substrate flexibility on solder joint reliability","publication_year":2002,"publication_date":"2002-11-11","ids":{"openalex":"https://openalex.org/W1979448488","doi":"https://doi.org/10.1016/s0026-2714(02)00269-x","mag":"1979448488"},"language":"en","primary_location":{"id":"doi:10.1016/s0026-2714(02)00269-x","is_oa":false,"landing_page_url":"https://doi.org/10.1016/s0026-2714(02)00269-x","pdf_url":null,"source":{"id":"https://openalex.org/S133646729","display_name":"Microelectronics Reliability","issn_l":"0026-2714","issn":["0026-2714","1872-941X"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310320990","host_organization_name":"Elsevier BV","host_organization_lineage":["https://openalex.org/P4310320990"],"host_organization_lineage_names":["Elsevier BV"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Microelectronics Reliability","raw_type":"journal-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5041215212","display_name":"Xingsheng Liu","orcid":"https://orcid.org/0000-0002-8815-7752"},"institutions":[{"id":"https://openalex.org/I859038795","display_name":"Virginia Tech","ror":"https://ror.org/02smfhw86","country_code":"US","type":"education","lineage":["https://openalex.org/I859038795"]}],"countries":["US"],"is_corresponding":true,"raw_author_name":"Xingsheng Liu","raw_affiliation_strings":["Materials Science and Engineering Department and Center for Power Electronics Systems, Virginia Tech, Blacksburg, VA 24061, USA"],"affiliations":[{"raw_affiliation_string":"Materials Science and Engineering Department and Center for Power Electronics Systems, Virginia Tech, Blacksburg, VA 24061, USA","institution_ids":["https://openalex.org/I859038795"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5085781084","display_name":"Shuangyan Xu","orcid":"https://orcid.org/0000-0001-9523-2266"},"institutions":[{"id":"https://openalex.org/I2800055476","display_name":"Mechanics' Institute","ror":"https://ror.org/02xfvtk67","country_code":"US","type":"other","lineage":["https://openalex.org/I2800055476"]},{"id":"https://openalex.org/I859038795","display_name":"Virginia Tech","ror":"https://ror.org/02smfhw86","country_code":"US","type":"education","lineage":["https://openalex.org/I859038795"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Shuangyan Xu","raw_affiliation_strings":["Engineering Science and Mechanics Department, Adhension Mechanics Laboratory, Virginia Tech, Blacksburg, VA 24061, USA"],"affiliations":[{"raw_affiliation_string":"Engineering Science and Mechanics Department, Adhension Mechanics Laboratory, Virginia Tech, Blacksburg, VA 24061, USA","institution_ids":["https://openalex.org/I2800055476","https://openalex.org/I859038795"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5100601910","display_name":"Guo\u2010Quan Lu","orcid":"https://orcid.org/0000-0003-3079-8589"},"institutions":[{"id":"https://openalex.org/I859038795","display_name":"Virginia Tech","ror":"https://ror.org/02smfhw86","country_code":"US","type":"education","lineage":["https://openalex.org/I859038795"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Guo-Quan Lu","raw_affiliation_strings":["Materials Science and Engineering Department and Center for Power Electronics Systems, Virginia Tech, Blacksburg, VA 24061, USA"],"affiliations":[{"raw_affiliation_string":"Materials Science and Engineering Department and Center for Power Electronics Systems, Virginia Tech, Blacksburg, VA 24061, USA","institution_ids":["https://openalex.org/I859038795"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5041951738","display_name":"David Dillard","orcid":"https://orcid.org/0000-0002-2903-9318"},"institutions":[{"id":"https://openalex.org/I859038795","display_name":"Virginia Tech","ror":"https://ror.org/02smfhw86","country_code":"US","type":"education","lineage":["https://openalex.org/I859038795"]},{"id":"https://openalex.org/I2800055476","display_name":"Mechanics' Institute","ror":"https://ror.org/02xfvtk67","country_code":"US","type":"other","lineage":["https://openalex.org/I2800055476"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"David A Dillard","raw_affiliation_strings":["Engineering Science and Mechanics Department, Adhension Mechanics Laboratory, Virginia Tech, Blacksburg, VA 24061, USA"],"affiliations":[{"raw_affiliation_string":"Engineering Science and Mechanics Department, Adhension Mechanics Laboratory, Virginia Tech, Blacksburg, VA 24061, USA","institution_ids":["https://openalex.org/I2800055476","https://openalex.org/I859038795"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":4,"corresponding_author_ids":["https://openalex.org/A5041215212"],"corresponding_institution_ids":["https://openalex.org/I859038795"],"apc_list":{"value":2190,"currency":"USD","value_usd":2190},"apc_paid":null,"fwci":1.3699,"has_fulltext":false,"cited_by_count":27,"citation_normalized_percentile":{"value":0.80146076,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":96},"biblio":{"volume":"42","issue":"12","first_page":"1883","last_page":"1891"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.9958999752998352,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10624","display_name":"Silicon and Solar Cell Technologies","score":0.9840999841690063,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/flip-chip","display_name":"Flip chip","score":0.8790984749794006},{"id":"https://openalex.org/keywords/soldering","display_name":"Soldering","score":0.813341498374939},{"id":"https://openalex.org/keywords/temperature-cycling","display_name":"Temperature cycling","score":0.7697588205337524},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.7373079657554626},{"id":"https://openalex.org/keywords/ball-grid-array","display_name":"Ball grid array","score":0.7204902172088623},{"id":"https://openalex.org/keywords/joint","display_name":"Joint (building)","score":0.5220922231674194},{"id":"https://openalex.org/keywords/composite-material","display_name":"Composite material","score":0.5101588368415833},{"id":"https://openalex.org/keywords/substrate","display_name":"Substrate (aquarium)","score":0.5022311210632324},{"id":"https://openalex.org/keywords/flex","display_name":"FLEX","score":0.4927096664905548},{"id":"https://openalex.org/keywords/structural-engineering","display_name":"Structural engineering","score":0.49198290705680847},{"id":"https://openalex.org/keywords/bending","display_name":"Bending","score":0.4897444248199463},{"id":"https://openalex.org/keywords/reliability","display_name":"Reliability (semiconductor)","score":0.4187872111797333},{"id":"https://openalex.org/keywords/thermal","display_name":"Thermal","score":0.25042983889579773},{"id":"https://openalex.org/keywords/layer","display_name":"Layer (electronics)","score":0.14647215604782104},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.12892025709152222},{"id":"https://openalex.org/keywords/adhesive","display_name":"Adhesive","score":0.062160342931747437}],"concepts":[{"id":"https://openalex.org/C79072407","wikidata":"https://www.wikidata.org/wiki/Q432439","display_name":"Flip chip","level":4,"score":0.8790984749794006},{"id":"https://openalex.org/C50296614","wikidata":"https://www.wikidata.org/wiki/Q211387","display_name":"Soldering","level":2,"score":0.813341498374939},{"id":"https://openalex.org/C177564732","wikidata":"https://www.wikidata.org/wiki/Q7698333","display_name":"Temperature cycling","level":3,"score":0.7697588205337524},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.7373079657554626},{"id":"https://openalex.org/C94709252","wikidata":"https://www.wikidata.org/wiki/Q570628","display_name":"Ball grid array","level":3,"score":0.7204902172088623},{"id":"https://openalex.org/C18555067","wikidata":"https://www.wikidata.org/wiki/Q8375051","display_name":"Joint (building)","level":2,"score":0.5220922231674194},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.5101588368415833},{"id":"https://openalex.org/C2777289219","wikidata":"https://www.wikidata.org/wiki/Q7632154","display_name":"Substrate (aquarium)","level":2,"score":0.5022311210632324},{"id":"https://openalex.org/C2776252893","wikidata":"https://www.wikidata.org/wiki/Q1364836","display_name":"FLEX","level":2,"score":0.4927096664905548},{"id":"https://openalex.org/C66938386","wikidata":"https://www.wikidata.org/wiki/Q633538","display_name":"Structural engineering","level":1,"score":0.49198290705680847},{"id":"https://openalex.org/C87210426","wikidata":"https://www.wikidata.org/wiki/Q1072476","display_name":"Bending","level":2,"score":0.4897444248199463},{"id":"https://openalex.org/C43214815","wikidata":"https://www.wikidata.org/wiki/Q7310987","display_name":"Reliability (semiconductor)","level":3,"score":0.4187872111797333},{"id":"https://openalex.org/C204530211","wikidata":"https://www.wikidata.org/wiki/Q752823","display_name":"Thermal","level":2,"score":0.25042983889579773},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.14647215604782104},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.12892025709152222},{"id":"https://openalex.org/C68928338","wikidata":"https://www.wikidata.org/wiki/Q131790","display_name":"Adhesive","level":3,"score":0.062160342931747437},{"id":"https://openalex.org/C127313418","wikidata":"https://www.wikidata.org/wiki/Q1069","display_name":"Geology","level":0,"score":0.0},{"id":"https://openalex.org/C153294291","wikidata":"https://www.wikidata.org/wiki/Q25261","display_name":"Meteorology","level":1,"score":0.0},{"id":"https://openalex.org/C163258240","wikidata":"https://www.wikidata.org/wiki/Q25342","display_name":"Power (physics)","level":2,"score":0.0},{"id":"https://openalex.org/C111368507","wikidata":"https://www.wikidata.org/wiki/Q43518","display_name":"Oceanography","level":1,"score":0.0},{"id":"https://openalex.org/C62520636","wikidata":"https://www.wikidata.org/wiki/Q944","display_name":"Quantum mechanics","level":1,"score":0.0},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.0},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1016/s0026-2714(02)00269-x","is_oa":false,"landing_page_url":"https://doi.org/10.1016/s0026-2714(02)00269-x","pdf_url":null,"source":{"id":"https://openalex.org/S133646729","display_name":"Microelectronics Reliability","issn_l":"0026-2714","issn":["0026-2714","1872-941X"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310320990","host_organization_name":"Elsevier BV","host_organization_lineage":["https://openalex.org/P4310320990"],"host_organization_lineage_names":["Elsevier BV"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Microelectronics Reliability","raw_type":"journal-article"}],"best_oa_location":null,"sustainable_development_goals":[{"score":0.41999998688697815,"id":"https://metadata.un.org/sdg/7","display_name":"Affordable and clean energy"}],"awards":[],"funders":[{"id":"https://openalex.org/F4320306076","display_name":"National Science Foundation","ror":"https://ror.org/021nxhr62"}],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":12,"referenced_works":["https://openalex.org/W567677580","https://openalex.org/W1691874592","https://openalex.org/W2119790014","https://openalex.org/W2124683993","https://openalex.org/W2124912291","https://openalex.org/W2125930834","https://openalex.org/W2131722625","https://openalex.org/W2159576287","https://openalex.org/W2169115783","https://openalex.org/W2597148892","https://openalex.org/W3158761656","https://openalex.org/W4285719527"],"related_works":["https://openalex.org/W2050959455","https://openalex.org/W2167784957","https://openalex.org/W1951801788","https://openalex.org/W2155941634","https://openalex.org/W2380335578","https://openalex.org/W2367693714","https://openalex.org/W2134467738","https://openalex.org/W4295036922","https://openalex.org/W2079719989","https://openalex.org/W1837700555"],"abstract_inverted_index":null,"counts_by_year":[{"year":2024,"cited_by_count":2},{"year":2018,"cited_by_count":1},{"year":2017,"cited_by_count":2},{"year":2016,"cited_by_count":2},{"year":2015,"cited_by_count":2},{"year":2014,"cited_by_count":1},{"year":2013,"cited_by_count":1},{"year":2012,"cited_by_count":1}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}