{"id":"https://openalex.org/W1975426011","doi":"https://doi.org/10.1016/s0026-2714(02)00262-7","title":"The optimization design of bump interconnections in flip chip packages from the electrical standpoint","display_name":"The optimization design of bump interconnections in flip chip packages from the electrical standpoint","publication_year":2002,"publication_date":"2002-11-11","ids":{"openalex":"https://openalex.org/W1975426011","doi":"https://doi.org/10.1016/s0026-2714(02)00262-7","mag":"1975426011"},"language":"en","primary_location":{"id":"doi:10.1016/s0026-2714(02)00262-7","is_oa":false,"landing_page_url":"https://doi.org/10.1016/s0026-2714(02)00262-7","pdf_url":null,"source":{"id":"https://openalex.org/S133646729","display_name":"Microelectronics Reliability","issn_l":"0026-2714","issn":["0026-2714","1872-941X"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310320990","host_organization_name":"Elsevier BV","host_organization_lineage":["https://openalex.org/P4310320990"],"host_organization_lineage_names":["Elsevier BV"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Microelectronics Reliability","raw_type":"journal-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5088075975","display_name":"De\u2010Shin Liu","orcid":"https://orcid.org/0000-0002-3613-3206"},"institutions":[{"id":"https://openalex.org/I148099254","display_name":"National Chung Cheng University","ror":"https://ror.org/0028v3876","country_code":"TW","type":"education","lineage":["https://openalex.org/I148099254"]}],"countries":["TW"],"is_corresponding":true,"raw_author_name":"De-Shin Liu","raw_affiliation_strings":["Department of Mechanical Engineering, National Chung Cheng University, 160 San-Hsing, Ming-Hsiung, Chia-Yi 621, Taiwan, ROC","Department of Mechanical Engineering, National Chung Cheng University, 160, San-Hsing, Ming-Hsiung, Chia-Yi 621, Taiwan, ROC"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Mechanical Engineering, National Chung Cheng University, 160 San-Hsing, Ming-Hsiung, Chia-Yi 621, Taiwan, ROC","institution_ids":["https://openalex.org/I148099254"]},{"raw_affiliation_string":"Department of Mechanical Engineering, National Chung Cheng University, 160, San-Hsing, Ming-Hsiung, Chia-Yi 621, Taiwan, ROC","institution_ids":["https://openalex.org/I148099254"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5111926895","display_name":"Chin-Yu Ni","orcid":null},"institutions":[{"id":"https://openalex.org/I148099254","display_name":"National Chung Cheng University","ror":"https://ror.org/0028v3876","country_code":"TW","type":"education","lineage":["https://openalex.org/I148099254"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"Chin-Yu Ni","raw_affiliation_strings":["Department of Mechanical Engineering, National Chung Cheng University, 160 San-Hsing, Ming-Hsiung, Chia-Yi 621, Taiwan, ROC","Department of Mechanical Engineering, National Chung Cheng University, 160, San-Hsing, Ming-Hsiung, Chia-Yi 621, Taiwan, ROC"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Mechanical Engineering, National Chung Cheng University, 160 San-Hsing, Ming-Hsiung, Chia-Yi 621, Taiwan, ROC","institution_ids":["https://openalex.org/I148099254"]},{"raw_affiliation_string":"Department of Mechanical Engineering, National Chung Cheng University, 160, San-Hsing, Ming-Hsiung, Chia-Yi 621, Taiwan, ROC","institution_ids":["https://openalex.org/I148099254"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":1,"corresponding_author_ids":["https://openalex.org/A5088075975"],"corresponding_institution_ids":["https://openalex.org/I148099254"],"apc_list":{"value":2190,"currency":"USD","value_usd":2190},"apc_paid":null,"fwci":0.3433,"has_fulltext":false,"cited_by_count":3,"citation_normalized_percentile":{"value":0.57130287,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":null,"biblio":{"volume":"42","issue":"12","first_page":"1893","last_page":"1901"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11522","display_name":"VLSI and FPGA Design Techniques","score":0.9993000030517578,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11522","display_name":"VLSI and FPGA Design Techniques","score":0.9993000030517578,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.9991999864578247,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.9990000128746033,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/flip-chip","display_name":"Flip chip","score":0.8838566541671753},{"id":"https://openalex.org/keywords/electrical-impedance","display_name":"Electrical impedance","score":0.5968660116195679},{"id":"https://openalex.org/keywords/voltage","display_name":"Voltage","score":0.575366199016571},{"id":"https://openalex.org/keywords/chip","display_name":"Chip","score":0.5429979562759399},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.51088947057724},{"id":"https://openalex.org/keywords/dimension","display_name":"Dimension (graph theory)","score":0.5087266564369202},{"id":"https://openalex.org/keywords/power","display_name":"Power (physics)","score":0.49961233139038086},{"id":"https://openalex.org/keywords/optimal-design","display_name":"Optimal design","score":0.4208243489265442},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.3925626277923584},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.35459673404693604},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.33559703826904297},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.17354178428649902},{"id":"https://openalex.org/keywords/mathematics","display_name":"Mathematics","score":0.09809640049934387}],"concepts":[{"id":"https://openalex.org/C79072407","wikidata":"https://www.wikidata.org/wiki/Q432439","display_name":"Flip chip","level":4,"score":0.8838566541671753},{"id":"https://openalex.org/C17829176","wikidata":"https://www.wikidata.org/wiki/Q179043","display_name":"Electrical impedance","level":2,"score":0.5968660116195679},{"id":"https://openalex.org/C165801399","wikidata":"https://www.wikidata.org/wiki/Q25428","display_name":"Voltage","level":2,"score":0.575366199016571},{"id":"https://openalex.org/C165005293","wikidata":"https://www.wikidata.org/wiki/Q1074500","display_name":"Chip","level":2,"score":0.5429979562759399},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.51088947057724},{"id":"https://openalex.org/C33676613","wikidata":"https://www.wikidata.org/wiki/Q13415176","display_name":"Dimension (graph theory)","level":2,"score":0.5087266564369202},{"id":"https://openalex.org/C163258240","wikidata":"https://www.wikidata.org/wiki/Q25342","display_name":"Power (physics)","level":2,"score":0.49961233139038086},{"id":"https://openalex.org/C186394612","wikidata":"https://www.wikidata.org/wiki/Q7098942","display_name":"Optimal design","level":2,"score":0.4208243489265442},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.3925626277923584},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.35459673404693604},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.33559703826904297},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.17354178428649902},{"id":"https://openalex.org/C33923547","wikidata":"https://www.wikidata.org/wiki/Q395","display_name":"Mathematics","level":0,"score":0.09809640049934387},{"id":"https://openalex.org/C202444582","wikidata":"https://www.wikidata.org/wiki/Q837863","display_name":"Pure mathematics","level":1,"score":0.0},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.0},{"id":"https://openalex.org/C119857082","wikidata":"https://www.wikidata.org/wiki/Q2539","display_name":"Machine learning","level":1,"score":0.0},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.0},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.0},{"id":"https://openalex.org/C68928338","wikidata":"https://www.wikidata.org/wiki/Q131790","display_name":"Adhesive","level":3,"score":0.0},{"id":"https://openalex.org/C62520636","wikidata":"https://www.wikidata.org/wiki/Q944","display_name":"Quantum mechanics","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1016/s0026-2714(02)00262-7","is_oa":false,"landing_page_url":"https://doi.org/10.1016/s0026-2714(02)00262-7","pdf_url":null,"source":{"id":"https://openalex.org/S133646729","display_name":"Microelectronics Reliability","issn_l":"0026-2714","issn":["0026-2714","1872-941X"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310320990","host_organization_name":"Elsevier BV","host_organization_lineage":["https://openalex.org/P4310320990"],"host_organization_lineage_names":["Elsevier BV"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Microelectronics Reliability","raw_type":"journal-article"}],"best_oa_location":null,"sustainable_development_goals":[{"id":"https://metadata.un.org/sdg/7","display_name":"Affordable and clean energy","score":0.7400000095367432}],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":21,"referenced_works":["https://openalex.org/W571002254","https://openalex.org/W571460840","https://openalex.org/W810261226","https://openalex.org/W1497256448","https://openalex.org/W2004050225","https://openalex.org/W2005591028","https://openalex.org/W2049522673","https://openalex.org/W2052255474","https://openalex.org/W2096590200","https://openalex.org/W2115204026","https://openalex.org/W2125930834","https://openalex.org/W2137212926","https://openalex.org/W2139814288","https://openalex.org/W2144784404","https://openalex.org/W2157202573","https://openalex.org/W2162299084","https://openalex.org/W2162967044","https://openalex.org/W3023540311","https://openalex.org/W3158761656","https://openalex.org/W6663644682","https://openalex.org/W6680290245"],"related_works":["https://openalex.org/W2350159546","https://openalex.org/W2915158639","https://openalex.org/W4232272518","https://openalex.org/W1530391261","https://openalex.org/W4211121654","https://openalex.org/W2532422067","https://openalex.org/W2046757767","https://openalex.org/W2115932404","https://openalex.org/W2261056475","https://openalex.org/W2151795613"],"abstract_inverted_index":null,"counts_by_year":[],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}