{"id":"https://openalex.org/W2068777327","doi":"https://doi.org/10.1016/s0026-2714(02)00239-1","title":"Effects of fourth alloying additive on microstructures and tensile properties of Sn\u2013Ag\u2013Cu alloy and joints with Cu","display_name":"Effects of fourth alloying additive on microstructures and tensile properties of Sn\u2013Ag\u2013Cu alloy and joints with Cu","publication_year":2003,"publication_date":"2003-01-30","ids":{"openalex":"https://openalex.org/W2068777327","doi":"https://doi.org/10.1016/s0026-2714(02)00239-1","mag":"2068777327"},"language":"en","primary_location":{"id":"doi:10.1016/s0026-2714(02)00239-1","is_oa":false,"landing_page_url":"https://doi.org/10.1016/s0026-2714(02)00239-1","pdf_url":null,"source":{"id":"https://openalex.org/S133646729","display_name":"Microelectronics Reliability","issn_l":"0026-2714","issn":["0026-2714","1872-941X"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310320990","host_organization_name":"Elsevier BV","host_organization_lineage":["https://openalex.org/P4310320990"],"host_organization_lineage_names":["Elsevier BV"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Microelectronics Reliability","raw_type":"journal-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5009835269","display_name":"K.S. Kim","orcid":null},"institutions":[{"id":"https://openalex.org/I98285908","display_name":"Osaka University","ror":"https://ror.org/035t8zc32","country_code":"JP","type":"education","lineage":["https://openalex.org/I98285908"]}],"countries":["JP"],"is_corresponding":true,"raw_author_name":"K.S. Kim","raw_affiliation_strings":["Department of Adaptive Machine Systems, Osaka University, Yamadaoka 1-1, Suita, Osaka 565-0871, Japan","Institute of Scientific and Industrial Research, Osaka University, Mihogaoka 8-1, Ibaraki, Osaka 567-0047, Japan"],"affiliations":[{"raw_affiliation_string":"Department of Adaptive Machine Systems, Osaka University, Yamadaoka 1-1, Suita, Osaka 565-0871, Japan","institution_ids":["https://openalex.org/I98285908"]},{"raw_affiliation_string":"Institute of Scientific and Industrial Research, Osaka University, Mihogaoka 8-1, Ibaraki, Osaka 567-0047, Japan","institution_ids":["https://openalex.org/I98285908"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5067526696","display_name":"Seok\u2010Hwan Huh","orcid":"https://orcid.org/0000-0002-8084-4144"},"institutions":[{"id":"https://openalex.org/I98285908","display_name":"Osaka University","ror":"https://ror.org/035t8zc32","country_code":"JP","type":"education","lineage":["https://openalex.org/I98285908"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"S.H. Huh","raw_affiliation_strings":["Department of Adaptive Machine Systems, Osaka University, Yamadaoka 1-1, Suita, Osaka 565-0871, Japan"],"affiliations":[{"raw_affiliation_string":"Department of Adaptive Machine Systems, Osaka University, Yamadaoka 1-1, Suita, Osaka 565-0871, Japan","institution_ids":["https://openalex.org/I98285908"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5070481334","display_name":"Katsuaki Suganuma","orcid":"https://orcid.org/0000-0003-2137-9905"},"institutions":[{"id":"https://openalex.org/I98285908","display_name":"Osaka University","ror":"https://ror.org/035t8zc32","country_code":"JP","type":"education","lineage":["https://openalex.org/I98285908"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"K. Suganuma","raw_affiliation_strings":["Institute of Scientific and Industrial Research, Osaka University, Mihogaoka 8-1, Ibaraki, Osaka 567-0047, Japan"],"affiliations":[{"raw_affiliation_string":"Institute of Scientific and Industrial Research, Osaka University, Mihogaoka 8-1, Ibaraki, Osaka 567-0047, Japan","institution_ids":["https://openalex.org/I98285908"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":3,"corresponding_author_ids":["https://openalex.org/A5009835269"],"corresponding_institution_ids":["https://openalex.org/I98285908"],"apc_list":{"value":2190,"currency":"USD","value_usd":2190},"apc_paid":null,"fwci":11.6508,"has_fulltext":false,"cited_by_count":290,"citation_normalized_percentile":{"value":0.98945293,"is_in_top_1_percent":false,"is_in_top_10_percent":true},"cited_by_percentile_year":{"min":96,"max":100},"biblio":{"volume":"43","issue":"2","first_page":"259","last_page":"267"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10670","display_name":"Aluminum Alloy Microstructure Properties","score":0.9984999895095825,"subfield":{"id":"https://openalex.org/subfields/2202","display_name":"Aerospace Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10723","display_name":"Advanced Welding Techniques Analysis","score":0.998199999332428,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.8811018466949463},{"id":"https://openalex.org/keywords/intermetallic","display_name":"Intermetallic","score":0.8455355167388916},{"id":"https://openalex.org/keywords/ultimate-tensile-strength","display_name":"Ultimate tensile strength","score":0.7616314888000488},{"id":"https://openalex.org/keywords/alloy","display_name":"Alloy","score":0.7509337663650513},{"id":"https://openalex.org/keywords/metallurgy","display_name":"Metallurgy","score":0.6438930034637451},{"id":"https://openalex.org/keywords/microstructure","display_name":"Microstructure","score":0.5960063338279724},{"id":"https://openalex.org/keywords/soldering","display_name":"Soldering","score":0.5870493650436401},{"id":"https://openalex.org/keywords/supercooling","display_name":"Supercooling","score":0.5512295365333557},{"id":"https://openalex.org/keywords/brittleness","display_name":"Brittleness","score":0.5262799859046936},{"id":"https://openalex.org/keywords/joint","display_name":"Joint (building)","score":0.43592801690101624}],"concepts":[{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.8811018466949463},{"id":"https://openalex.org/C27501479","wikidata":"https://www.wikidata.org/wiki/Q428069","display_name":"Intermetallic","level":3,"score":0.8455355167388916},{"id":"https://openalex.org/C112950240","wikidata":"https://www.wikidata.org/wiki/Q76005","display_name":"Ultimate tensile strength","level":2,"score":0.7616314888000488},{"id":"https://openalex.org/C2780026712","wikidata":"https://www.wikidata.org/wiki/Q37756","display_name":"Alloy","level":2,"score":0.7509337663650513},{"id":"https://openalex.org/C191897082","wikidata":"https://www.wikidata.org/wiki/Q11467","display_name":"Metallurgy","level":1,"score":0.6438930034637451},{"id":"https://openalex.org/C87976508","wikidata":"https://www.wikidata.org/wiki/Q1498213","display_name":"Microstructure","level":2,"score":0.5960063338279724},{"id":"https://openalex.org/C50296614","wikidata":"https://www.wikidata.org/wiki/Q211387","display_name":"Soldering","level":2,"score":0.5870493650436401},{"id":"https://openalex.org/C112964491","wikidata":"https://www.wikidata.org/wiki/Q213659","display_name":"Supercooling","level":2,"score":0.5512295365333557},{"id":"https://openalex.org/C136478896","wikidata":"https://www.wikidata.org/wiki/Q898288","display_name":"Brittleness","level":2,"score":0.5262799859046936},{"id":"https://openalex.org/C18555067","wikidata":"https://www.wikidata.org/wiki/Q8375051","display_name":"Joint (building)","level":2,"score":0.43592801690101624},{"id":"https://openalex.org/C170154142","wikidata":"https://www.wikidata.org/wiki/Q150737","display_name":"Architectural engineering","level":1,"score":0.0},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.0},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.0},{"id":"https://openalex.org/C97355855","wikidata":"https://www.wikidata.org/wiki/Q11473","display_name":"Thermodynamics","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1016/s0026-2714(02)00239-1","is_oa":false,"landing_page_url":"https://doi.org/10.1016/s0026-2714(02)00239-1","pdf_url":null,"source":{"id":"https://openalex.org/S133646729","display_name":"Microelectronics Reliability","issn_l":"0026-2714","issn":["0026-2714","1872-941X"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310320990","host_organization_name":"Elsevier BV","host_organization_lineage":["https://openalex.org/P4310320990"],"host_organization_lineage_names":["Elsevier BV"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Microelectronics Reliability","raw_type":"journal-article"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":20,"referenced_works":["https://openalex.org/W1500052871","https://openalex.org/W1980722467","https://openalex.org/W1991153001","https://openalex.org/W1991291398","https://openalex.org/W2000777957","https://openalex.org/W2004929495","https://openalex.org/W2014768743","https://openalex.org/W2017959119","https://openalex.org/W2030123997","https://openalex.org/W2055618665","https://openalex.org/W2062086178","https://openalex.org/W2066137615","https://openalex.org/W2072084473","https://openalex.org/W2098143596","https://openalex.org/W2105603966","https://openalex.org/W2117236490","https://openalex.org/W2132095257","https://openalex.org/W2160364749","https://openalex.org/W2256155874","https://openalex.org/W4285719527"],"related_works":["https://openalex.org/W2745063064","https://openalex.org/W2079422425","https://openalex.org/W1635986310","https://openalex.org/W4239199100","https://openalex.org/W2386865376","https://openalex.org/W2359630309","https://openalex.org/W2514058477","https://openalex.org/W2223877278","https://openalex.org/W4383378151","https://openalex.org/W1985302311"],"abstract_inverted_index":null,"counts_by_year":[{"year":2026,"cited_by_count":4},{"year":2025,"cited_by_count":5},{"year":2024,"cited_by_count":5},{"year":2023,"cited_by_count":3},{"year":2022,"cited_by_count":13},{"year":2021,"cited_by_count":7},{"year":2020,"cited_by_count":6},{"year":2019,"cited_by_count":9},{"year":2018,"cited_by_count":9},{"year":2017,"cited_by_count":9},{"year":2016,"cited_by_count":11},{"year":2015,"cited_by_count":9},{"year":2014,"cited_by_count":14},{"year":2013,"cited_by_count":20},{"year":2012,"cited_by_count":31}],"updated_date":"2026-03-31T07:56:22.981413","created_date":"2025-10-10T00:00:00"}