{"id":"https://openalex.org/W2000397561","doi":"https://doi.org/10.1016/s0026-2714(02)00116-6","title":"Procedure for design optimization of a T-cap flip chip package","display_name":"Procedure for design optimization of a T-cap flip chip package","publication_year":2002,"publication_date":"2002-11-11","ids":{"openalex":"https://openalex.org/W2000397561","doi":"https://doi.org/10.1016/s0026-2714(02)00116-6","mag":"2000397561"},"language":"en","primary_location":{"id":"doi:10.1016/s0026-2714(02)00116-6","is_oa":false,"landing_page_url":"https://doi.org/10.1016/s0026-2714(02)00116-6","pdf_url":null,"source":{"id":"https://openalex.org/S133646729","display_name":"Microelectronics Reliability","issn_l":"0026-2714","issn":["0026-2714","1872-941X"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310320990","host_organization_name":"Elsevier BV","host_organization_lineage":["https://openalex.org/P4310320990"],"host_organization_lineage_names":["Elsevier BV"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Microelectronics Reliability","raw_type":"journal-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5111926895","display_name":"Chin-Yu Ni","orcid":null},"institutions":[{"id":"https://openalex.org/I148099254","display_name":"National Chung Cheng University","ror":"https://ror.org/0028v3876","country_code":"TW","type":"education","lineage":["https://openalex.org/I148099254"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"Chin-Yu Ni","raw_affiliation_strings":["Department of Mechanical Engineering, National Chung Cheng University, 160, San-Hsing, Ming-Hsiung, Chia-Yi 621, Taiwan, ROC"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Mechanical Engineering, National Chung Cheng University, 160, San-Hsing, Ming-Hsiung, Chia-Yi 621, Taiwan, ROC","institution_ids":["https://openalex.org/I148099254"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5088075975","display_name":"De\u2010Shin Liu","orcid":"https://orcid.org/0000-0002-3613-3206"},"institutions":[{"id":"https://openalex.org/I148099254","display_name":"National Chung Cheng University","ror":"https://ror.org/0028v3876","country_code":"TW","type":"education","lineage":["https://openalex.org/I148099254"]}],"countries":["TW"],"is_corresponding":true,"raw_author_name":"De-Shin Liu","raw_affiliation_strings":["Department of Mechanical Engineering, National Chung Cheng University, 160, San-Hsing, Ming-Hsiung, Chia-Yi 621, Taiwan, ROC"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Mechanical Engineering, National Chung Cheng University, 160, San-Hsing, Ming-Hsiung, Chia-Yi 621, Taiwan, ROC","institution_ids":["https://openalex.org/I148099254"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5003064257","display_name":"Ching-Yang Chen","orcid":null},"institutions":[{"id":"https://openalex.org/I148099254","display_name":"National Chung Cheng University","ror":"https://ror.org/0028v3876","country_code":"TW","type":"education","lineage":["https://openalex.org/I148099254"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"Ching-Yang Chen","raw_affiliation_strings":["Department of Mechanical Engineering, National Chung Cheng University, 160, San-Hsing, Ming-Hsiung, Chia-Yi 621, Taiwan, ROC"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Mechanical Engineering, National Chung Cheng University, 160, San-Hsing, Ming-Hsiung, Chia-Yi 621, Taiwan, ROC","institution_ids":["https://openalex.org/I148099254"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":1,"corresponding_author_ids":["https://openalex.org/A5088075975"],"corresponding_institution_ids":["https://openalex.org/I148099254"],"apc_list":{"value":2190,"currency":"USD","value_usd":2190},"apc_paid":null,"fwci":0.0,"has_fulltext":false,"cited_by_count":12,"citation_normalized_percentile":{"value":0.12590762,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":95},"biblio":{"volume":"42","issue":"12","first_page":"1903","last_page":"1911"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.9993000030517578,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11799","display_name":"Adhesion, Friction, and Surface Interactions","score":0.984000027179718,"subfield":{"id":"https://openalex.org/subfields/2211","display_name":"Mechanics of Materials"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/flip-chip","display_name":"Flip chip","score":0.9502109289169312},{"id":"https://openalex.org/keywords/soldering","display_name":"Soldering","score":0.7194848656654358},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.6310406923294067},{"id":"https://openalex.org/keywords/curing","display_name":"Curing (chemistry)","score":0.5381764769554138},{"id":"https://openalex.org/keywords/chip-scale-package","display_name":"Chip-scale package","score":0.5148596167564392},{"id":"https://openalex.org/keywords/finite-element-method","display_name":"Finite element method","score":0.5133580565452576},{"id":"https://openalex.org/keywords/fabrication","display_name":"Fabrication","score":0.4854064881801605},{"id":"https://openalex.org/keywords/temperature-cycling","display_name":"Temperature cycling","score":0.48344430327415466},{"id":"https://openalex.org/keywords/die","display_name":"Die (integrated circuit)","score":0.4768832325935364},{"id":"https://openalex.org/keywords/reliability","display_name":"Reliability (semiconductor)","score":0.47365912795066833},{"id":"https://openalex.org/keywords/quad-flat-no-leads-package","display_name":"Quad Flat No-leads package","score":0.4699547290802002},{"id":"https://openalex.org/keywords/design-of-experiments","display_name":"Design of experiments","score":0.44407525658607483},{"id":"https://openalex.org/keywords/chip","display_name":"Chip","score":0.43984416127204895},{"id":"https://openalex.org/keywords/structural-engineering","display_name":"Structural engineering","score":0.414550244808197},{"id":"https://openalex.org/keywords/mechanical-engineering","display_name":"Mechanical engineering","score":0.4040657877922058},{"id":"https://openalex.org/keywords/composite-material","display_name":"Composite material","score":0.3949436545372009},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.3642944395542145},{"id":"https://openalex.org/keywords/thermal","display_name":"Thermal","score":0.34992724657058716},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.21554112434387207},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.10849592089653015},{"id":"https://openalex.org/keywords/wafer","display_name":"Wafer","score":0.10202717781066895},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.09366956353187561}],"concepts":[{"id":"https://openalex.org/C79072407","wikidata":"https://www.wikidata.org/wiki/Q432439","display_name":"Flip chip","level":4,"score":0.9502109289169312},{"id":"https://openalex.org/C50296614","wikidata":"https://www.wikidata.org/wiki/Q211387","display_name":"Soldering","level":2,"score":0.7194848656654358},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.6310406923294067},{"id":"https://openalex.org/C132976073","wikidata":"https://www.wikidata.org/wiki/Q2991861","display_name":"Curing (chemistry)","level":2,"score":0.5381764769554138},{"id":"https://openalex.org/C126233035","wikidata":"https://www.wikidata.org/wiki/Q5101572","display_name":"Chip-scale package","level":3,"score":0.5148596167564392},{"id":"https://openalex.org/C135628077","wikidata":"https://www.wikidata.org/wiki/Q220184","display_name":"Finite element method","level":2,"score":0.5133580565452576},{"id":"https://openalex.org/C136525101","wikidata":"https://www.wikidata.org/wiki/Q5428139","display_name":"Fabrication","level":3,"score":0.4854064881801605},{"id":"https://openalex.org/C177564732","wikidata":"https://www.wikidata.org/wiki/Q7698333","display_name":"Temperature cycling","level":3,"score":0.48344430327415466},{"id":"https://openalex.org/C111106434","wikidata":"https://www.wikidata.org/wiki/Q1072430","display_name":"Die (integrated circuit)","level":2,"score":0.4768832325935364},{"id":"https://openalex.org/C43214815","wikidata":"https://www.wikidata.org/wiki/Q7310987","display_name":"Reliability (semiconductor)","level":3,"score":0.47365912795066833},{"id":"https://openalex.org/C162877825","wikidata":"https://www.wikidata.org/wiki/Q2121809","display_name":"Quad Flat No-leads package","level":4,"score":0.4699547290802002},{"id":"https://openalex.org/C34559072","wikidata":"https://www.wikidata.org/wiki/Q2334061","display_name":"Design of experiments","level":2,"score":0.44407525658607483},{"id":"https://openalex.org/C165005293","wikidata":"https://www.wikidata.org/wiki/Q1074500","display_name":"Chip","level":2,"score":0.43984416127204895},{"id":"https://openalex.org/C66938386","wikidata":"https://www.wikidata.org/wiki/Q633538","display_name":"Structural engineering","level":1,"score":0.414550244808197},{"id":"https://openalex.org/C78519656","wikidata":"https://www.wikidata.org/wiki/Q101333","display_name":"Mechanical engineering","level":1,"score":0.4040657877922058},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.3949436545372009},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.3642944395542145},{"id":"https://openalex.org/C204530211","wikidata":"https://www.wikidata.org/wiki/Q752823","display_name":"Thermal","level":2,"score":0.34992724657058716},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.21554112434387207},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.10849592089653015},{"id":"https://openalex.org/C160671074","wikidata":"https://www.wikidata.org/wiki/Q267131","display_name":"Wafer","level":2,"score":0.10202717781066895},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.09366956353187561},{"id":"https://openalex.org/C105795698","wikidata":"https://www.wikidata.org/wiki/Q12483","display_name":"Statistics","level":1,"score":0.0},{"id":"https://openalex.org/C142724271","wikidata":"https://www.wikidata.org/wiki/Q7208","display_name":"Pathology","level":1,"score":0.0},{"id":"https://openalex.org/C68928338","wikidata":"https://www.wikidata.org/wiki/Q131790","display_name":"Adhesive","level":3,"score":0.0},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.0},{"id":"https://openalex.org/C62520636","wikidata":"https://www.wikidata.org/wiki/Q944","display_name":"Quantum mechanics","level":1,"score":0.0},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.0},{"id":"https://openalex.org/C33923547","wikidata":"https://www.wikidata.org/wiki/Q395","display_name":"Mathematics","level":0,"score":0.0},{"id":"https://openalex.org/C153294291","wikidata":"https://www.wikidata.org/wiki/Q25261","display_name":"Meteorology","level":1,"score":0.0},{"id":"https://openalex.org/C71924100","wikidata":"https://www.wikidata.org/wiki/Q11190","display_name":"Medicine","level":0,"score":0.0},{"id":"https://openalex.org/C204787440","wikidata":"https://www.wikidata.org/wiki/Q188504","display_name":"Alternative medicine","level":2,"score":0.0},{"id":"https://openalex.org/C163258240","wikidata":"https://www.wikidata.org/wiki/Q25342","display_name":"Power (physics)","level":2,"score":0.0},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1016/s0026-2714(02)00116-6","is_oa":false,"landing_page_url":"https://doi.org/10.1016/s0026-2714(02)00116-6","pdf_url":null,"source":{"id":"https://openalex.org/S133646729","display_name":"Microelectronics Reliability","issn_l":"0026-2714","issn":["0026-2714","1872-941X"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310320990","host_organization_name":"Elsevier BV","host_organization_lineage":["https://openalex.org/P4310320990"],"host_organization_lineage_names":["Elsevier BV"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Microelectronics Reliability","raw_type":"journal-article"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":12,"referenced_works":["https://openalex.org/W571002254","https://openalex.org/W1987737701","https://openalex.org/W2044834799","https://openalex.org/W2053285842","https://openalex.org/W2062323033","https://openalex.org/W2070141922","https://openalex.org/W2144784404","https://openalex.org/W2162967044","https://openalex.org/W2170136137","https://openalex.org/W4301283990","https://openalex.org/W6681392672","https://openalex.org/W6684124981"],"related_works":["https://openalex.org/W2053654711","https://openalex.org/W2606799121","https://openalex.org/W2147419853","https://openalex.org/W1974133951","https://openalex.org/W2134854211","https://openalex.org/W1983742508","https://openalex.org/W2121551953","https://openalex.org/W618367153","https://openalex.org/W2134577393","https://openalex.org/W2393245046"],"abstract_inverted_index":null,"counts_by_year":[{"year":2022,"cited_by_count":1},{"year":2021,"cited_by_count":2},{"year":2015,"cited_by_count":1},{"year":2014,"cited_by_count":1},{"year":2012,"cited_by_count":1}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}