{"id":"https://openalex.org/W2157422705","doi":"https://doi.org/10.1016/s0026-2714(02)00043-4","title":"Construction of a cost-effective failure analysis service network\u2013\u2013microelectronic failure analysis service in Japan","display_name":"Construction of a cost-effective failure analysis service network\u2013\u2013microelectronic failure analysis service in Japan","publication_year":2002,"publication_date":"2002-04-01","ids":{"openalex":"https://openalex.org/W2157422705","doi":"https://doi.org/10.1016/s0026-2714(02)00043-4","mag":"2157422705"},"language":"en","primary_location":{"id":"doi:10.1016/s0026-2714(02)00043-4","is_oa":false,"landing_page_url":"https://doi.org/10.1016/s0026-2714(02)00043-4","pdf_url":null,"source":{"id":"https://openalex.org/S133646729","display_name":"Microelectronics Reliability","issn_l":"0026-2714","issn":["0026-2714","1872-941X"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310320990","host_organization_name":"Elsevier BV","host_organization_lineage":["https://openalex.org/P4310320990"],"host_organization_lineage_names":["Elsevier BV"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Microelectronics Reliability","raw_type":"journal-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5082220448","display_name":"Satoshi Nakajima","orcid":"https://orcid.org/0000-0002-5076-1735"},"institutions":[{"id":"https://openalex.org/I2251713219","display_name":"NTT (Japan)","ror":"https://ror.org/00berct97","country_code":"JP","type":"company","lineage":["https://openalex.org/I2251713219"]}],"countries":["JP"],"is_corresponding":true,"raw_author_name":"S Nakajima","raw_affiliation_strings":["Solid-State Analysis Center, Electronics Business Group, NTT Electronics Corporation, 3-1 ,Morinosato-Wakamiya, Atsugi-shi, Kanagawa, 243-0198, Japan"],"affiliations":[{"raw_affiliation_string":"Solid-State Analysis Center, Electronics Business Group, NTT Electronics Corporation, 3-1 ,Morinosato-Wakamiya, Atsugi-shi, Kanagawa, 243-0198, Japan","institution_ids":["https://openalex.org/I2251713219"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5046996291","display_name":"Shigeru Nakamura","orcid":"https://orcid.org/0000-0002-3607-5974"},"institutions":[{"id":"https://openalex.org/I2251713219","display_name":"NTT (Japan)","ror":"https://ror.org/00berct97","country_code":"JP","type":"company","lineage":["https://openalex.org/I2251713219"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"S Nakamura","raw_affiliation_strings":["Solid-State Analysis Center, Electronics Business Group, NTT Electronics Corporation, 3-1 ,Morinosato-Wakamiya, Atsugi-shi, Kanagawa, 243-0198, Japan"],"affiliations":[{"raw_affiliation_string":"Solid-State Analysis Center, Electronics Business Group, NTT Electronics Corporation, 3-1 ,Morinosato-Wakamiya, Atsugi-shi, Kanagawa, 243-0198, Japan","institution_ids":["https://openalex.org/I2251713219"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5028170474","display_name":"K Kuji","orcid":null},"institutions":[{"id":"https://openalex.org/I2251713219","display_name":"NTT (Japan)","ror":"https://ror.org/00berct97","country_code":"JP","type":"company","lineage":["https://openalex.org/I2251713219"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"K Kuji","raw_affiliation_strings":["Solid-State Analysis Center, Electronics Business Group, NTT Electronics Corporation, 3-1 ,Morinosato-Wakamiya, Atsugi-shi, Kanagawa, 243-0198, Japan"],"affiliations":[{"raw_affiliation_string":"Solid-State Analysis Center, Electronics Business Group, NTT Electronics Corporation, 3-1 ,Morinosato-Wakamiya, Atsugi-shi, Kanagawa, 243-0198, Japan","institution_ids":["https://openalex.org/I2251713219"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5066325797","display_name":"Takemi Ueki","orcid":null},"institutions":[{"id":"https://openalex.org/I2251713219","display_name":"NTT (Japan)","ror":"https://ror.org/00berct97","country_code":"JP","type":"company","lineage":["https://openalex.org/I2251713219"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"T Ueki","raw_affiliation_strings":["Solid-State Analysis Center, Electronics Business Group, NTT Electronics Corporation, 3-1 ,Morinosato-Wakamiya, Atsugi-shi, Kanagawa, 243-0198, Japan"],"affiliations":[{"raw_affiliation_string":"Solid-State Analysis Center, Electronics Business Group, NTT Electronics Corporation, 3-1 ,Morinosato-Wakamiya, Atsugi-shi, Kanagawa, 243-0198, Japan","institution_ids":["https://openalex.org/I2251713219"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5055421052","display_name":"T Ajioka","orcid":null},"institutions":[{"id":"https://openalex.org/I2251713219","display_name":"NTT (Japan)","ror":"https://ror.org/00berct97","country_code":"JP","type":"company","lineage":["https://openalex.org/I2251713219"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"T Ajioka","raw_affiliation_strings":["Solid-State Analysis Center, Electronics Business Group, NTT Electronics Corporation, 3-1 ,Morinosato-Wakamiya, Atsugi-shi, Kanagawa, 243-0198, Japan"],"affiliations":[{"raw_affiliation_string":"Solid-State Analysis Center, Electronics Business Group, NTT Electronics Corporation, 3-1 ,Morinosato-Wakamiya, Atsugi-shi, Kanagawa, 243-0198, Japan","institution_ids":["https://openalex.org/I2251713219"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5023595778","display_name":"Tetsuya Sakai","orcid":"https://orcid.org/0000-0002-6720-963X"},"institutions":[{"id":"https://openalex.org/I2251713219","display_name":"NTT (Japan)","ror":"https://ror.org/00berct97","country_code":"JP","type":"company","lineage":["https://openalex.org/I2251713219"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"T Sakai","raw_affiliation_strings":["Solid-State Analysis Center, Electronics Business Group, NTT Electronics Corporation, 3-1 ,Morinosato-Wakamiya, Atsugi-shi, Kanagawa, 243-0198, Japan"],"affiliations":[{"raw_affiliation_string":"Solid-State Analysis Center, Electronics Business Group, NTT Electronics Corporation, 3-1 ,Morinosato-Wakamiya, Atsugi-shi, Kanagawa, 243-0198, Japan","institution_ids":["https://openalex.org/I2251713219"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":6,"corresponding_author_ids":["https://openalex.org/A5082220448"],"corresponding_institution_ids":["https://openalex.org/I2251713219"],"apc_list":{"value":2190,"currency":"USD","value_usd":2190},"apc_paid":null,"fwci":1.0274,"has_fulltext":false,"cited_by_count":5,"citation_normalized_percentile":{"value":0.78104107,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":null,"biblio":{"volume":"42","issue":"4-5","first_page":"511","last_page":"521"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T14117","display_name":"Integrated Circuits and Semiconductor Failure Analysis","score":0.9998000264167786,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T14117","display_name":"Integrated Circuits and Semiconductor Failure Analysis","score":0.9998000264167786,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11853","display_name":"Semiconductor materials and interfaces","score":0.9976000189781189,"subfield":{"id":"https://openalex.org/subfields/3107","display_name":"Atomic and Molecular Physics, and Optics"},"field":{"id":"https://openalex.org/fields/31","display_name":"Physics and Astronomy"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10472","display_name":"Semiconductor materials and devices","score":0.995199978351593,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/service","display_name":"Service (business)","score":0.702139675617218},{"id":"https://openalex.org/keywords/failure-causes","display_name":"Failure causes","score":0.5405904054641724},{"id":"https://openalex.org/keywords/network-analysis","display_name":"Network analysis","score":0.5387284755706787},{"id":"https://openalex.org/keywords/cost-analysis","display_name":"Cost analysis","score":0.5333381295204163},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.42821869254112244},{"id":"https://openalex.org/keywords/market-analysis","display_name":"Market analysis","score":0.41885197162628174},{"id":"https://openalex.org/keywords/reliability-engineering","display_name":"Reliability engineering","score":0.2728990912437439},{"id":"https://openalex.org/keywords/business","display_name":"Business","score":0.25573062896728516},{"id":"https://openalex.org/keywords/marketing","display_name":"Marketing","score":0.1366840898990631},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.08547058701515198}],"concepts":[{"id":"https://openalex.org/C2780378061","wikidata":"https://www.wikidata.org/wiki/Q25351891","display_name":"Service (business)","level":2,"score":0.702139675617218},{"id":"https://openalex.org/C28944875","wikidata":"https://www.wikidata.org/wiki/Q1925224","display_name":"Failure causes","level":2,"score":0.5405904054641724},{"id":"https://openalex.org/C32946077","wikidata":"https://www.wikidata.org/wiki/Q618079","display_name":"Network analysis","level":2,"score":0.5387284755706787},{"id":"https://openalex.org/C2983335822","wikidata":"https://www.wikidata.org/wiki/Q942582","display_name":"Cost analysis","level":2,"score":0.5333381295204163},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.42821869254112244},{"id":"https://openalex.org/C179036041","wikidata":"https://www.wikidata.org/wiki/Q1901028","display_name":"Market analysis","level":2,"score":0.41885197162628174},{"id":"https://openalex.org/C200601418","wikidata":"https://www.wikidata.org/wiki/Q2193887","display_name":"Reliability engineering","level":1,"score":0.2728990912437439},{"id":"https://openalex.org/C144133560","wikidata":"https://www.wikidata.org/wiki/Q4830453","display_name":"Business","level":0,"score":0.25573062896728516},{"id":"https://openalex.org/C162853370","wikidata":"https://www.wikidata.org/wiki/Q39809","display_name":"Marketing","level":1,"score":0.1366840898990631},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.08547058701515198}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1016/s0026-2714(02)00043-4","is_oa":false,"landing_page_url":"https://doi.org/10.1016/s0026-2714(02)00043-4","pdf_url":null,"source":{"id":"https://openalex.org/S133646729","display_name":"Microelectronics Reliability","issn_l":"0026-2714","issn":["0026-2714","1872-941X"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310320990","host_organization_name":"Elsevier BV","host_organization_lineage":["https://openalex.org/P4310320990"],"host_organization_lineage_names":["Elsevier BV"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Microelectronics Reliability","raw_type":"journal-article"}],"best_oa_location":null,"sustainable_development_goals":[{"score":0.44999998807907104,"id":"https://metadata.un.org/sdg/9","display_name":"Industry, innovation and infrastructure"}],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":6,"referenced_works":["https://openalex.org/W2051921464","https://openalex.org/W2060730497","https://openalex.org/W2065488811","https://openalex.org/W2077630949","https://openalex.org/W2169489108","https://openalex.org/W3114537332"],"related_works":["https://openalex.org/W2757695969","https://openalex.org/W2922947892","https://openalex.org/W4234818151","https://openalex.org/W570939567","https://openalex.org/W2357295472","https://openalex.org/W2285507130","https://openalex.org/W2353149556","https://openalex.org/W2350137418","https://openalex.org/W2369724891","https://openalex.org/W2083290294"],"abstract_inverted_index":null,"counts_by_year":[],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}