{"id":"https://openalex.org/W2050094496","doi":"https://doi.org/10.1016/s0026-2714(01)00241-4","title":"Board level reliability of a stacked CSP subjected to cyclic bending","display_name":"Board level reliability of a stacked CSP subjected to cyclic bending","publication_year":2002,"publication_date":"2002-03-01","ids":{"openalex":"https://openalex.org/W2050094496","doi":"https://doi.org/10.1016/s0026-2714(01)00241-4","mag":"2050094496"},"language":"en","primary_location":{"id":"doi:10.1016/s0026-2714(01)00241-4","is_oa":false,"landing_page_url":"https://doi.org/10.1016/s0026-2714(01)00241-4","pdf_url":null,"source":{"id":"https://openalex.org/S133646729","display_name":"Microelectronics Reliability","issn_l":"0026-2714","issn":["0026-2714","1872-941X"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310320990","host_organization_name":"Elsevier BV","host_organization_lineage":["https://openalex.org/P4310320990"],"host_organization_lineage_names":["Elsevier BV"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Microelectronics Reliability","raw_type":"journal-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5110229601","display_name":"J.D. Wu","orcid":"https://orcid.org/0009-0004-6935-8147"},"institutions":[{"id":"https://openalex.org/I2799432993","display_name":"Advanced Semiconductor Engineering (Taiwan)","ror":"https://ror.org/04rgfzt17","country_code":"TW","type":"company","lineage":["https://openalex.org/I2799432993"]}],"countries":["TW"],"is_corresponding":true,"raw_author_name":"J.D Wu","raw_affiliation_strings":["Advanced Semiconductor Engineering, Inc., 2F, 21, Kai Fa Road, 811 Nantze Export Processing Zone, Kaohsiung, Taiwan, ROC"],"affiliations":[{"raw_affiliation_string":"Advanced Semiconductor Engineering, Inc., 2F, 21, Kai Fa Road, 811 Nantze Export Processing Zone, Kaohsiung, Taiwan, ROC","institution_ids":["https://openalex.org/I2799432993"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5110939614","display_name":"Seong Ho","orcid":null},"institutions":[{"id":"https://openalex.org/I2799432993","display_name":"Advanced Semiconductor Engineering (Taiwan)","ror":"https://ror.org/04rgfzt17","country_code":"TW","type":"company","lineage":["https://openalex.org/I2799432993"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"S.H Ho","raw_affiliation_strings":["Advanced Semiconductor Engineering, Inc., 2F, 21, Kai Fa Road, 811 Nantze Export Processing Zone, Kaohsiung, Taiwan, ROC"],"affiliations":[{"raw_affiliation_string":"Advanced Semiconductor Engineering, Inc., 2F, 21, Kai Fa Road, 811 Nantze Export Processing Zone, Kaohsiung, Taiwan, ROC","institution_ids":["https://openalex.org/I2799432993"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5102144537","display_name":"C.-Y. Huang","orcid":null},"institutions":[{"id":"https://openalex.org/I2799432993","display_name":"Advanced Semiconductor Engineering (Taiwan)","ror":"https://ror.org/04rgfzt17","country_code":"TW","type":"company","lineage":["https://openalex.org/I2799432993"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"C.Y Huang","raw_affiliation_strings":["Advanced Semiconductor Engineering, Inc., 2F, 21, Kai Fa Road, 811 Nantze Export Processing Zone, Kaohsiung, Taiwan, ROC"],"affiliations":[{"raw_affiliation_string":"Advanced Semiconductor Engineering, Inc., 2F, 21, Kai Fa Road, 811 Nantze Export Processing Zone, Kaohsiung, Taiwan, ROC","institution_ids":["https://openalex.org/I2799432993"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5111098655","display_name":"C.C. Liao","orcid":null},"institutions":[{"id":"https://openalex.org/I2799432993","display_name":"Advanced Semiconductor Engineering (Taiwan)","ror":"https://ror.org/04rgfzt17","country_code":"TW","type":"company","lineage":["https://openalex.org/I2799432993"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"C.C Liao","raw_affiliation_strings":["Advanced Semiconductor Engineering, Inc., 2F, 21, Kai Fa Road, 811 Nantze Export Processing Zone, Kaohsiung, Taiwan, ROC"],"affiliations":[{"raw_affiliation_string":"Advanced Semiconductor Engineering, Inc., 2F, 21, Kai Fa Road, 811 Nantze Export Processing Zone, Kaohsiung, Taiwan, ROC","institution_ids":["https://openalex.org/I2799432993"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5053925852","display_name":"P.J. Zheng","orcid":"https://orcid.org/0009-0000-5790-4316"},"institutions":[{"id":"https://openalex.org/I2799432993","display_name":"Advanced Semiconductor Engineering (Taiwan)","ror":"https://ror.org/04rgfzt17","country_code":"TW","type":"company","lineage":["https://openalex.org/I2799432993"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"P.J Zheng","raw_affiliation_strings":["Advanced Semiconductor Engineering, Inc., 2F, 21, Kai Fa Road, 811 Nantze Export Processing Zone, Kaohsiung, Taiwan, ROC"],"affiliations":[{"raw_affiliation_string":"Advanced Semiconductor Engineering, Inc., 2F, 21, Kai Fa Road, 811 Nantze Export Processing Zone, Kaohsiung, Taiwan, ROC","institution_ids":["https://openalex.org/I2799432993"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5102827941","display_name":"Shih-Han Hung","orcid":"https://orcid.org/0000-0003-3410-7466"},"institutions":[{"id":"https://openalex.org/I2799432993","display_name":"Advanced Semiconductor Engineering (Taiwan)","ror":"https://ror.org/04rgfzt17","country_code":"TW","type":"company","lineage":["https://openalex.org/I2799432993"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"S.C Hung","raw_affiliation_strings":["Advanced Semiconductor Engineering, Inc., 2F, 21, Kai Fa Road, 811 Nantze Export Processing Zone, Kaohsiung, Taiwan, ROC"],"affiliations":[{"raw_affiliation_string":"Advanced Semiconductor Engineering, Inc., 2F, 21, Kai Fa Road, 811 Nantze Export Processing Zone, Kaohsiung, Taiwan, ROC","institution_ids":["https://openalex.org/I2799432993"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":6,"corresponding_author_ids":["https://openalex.org/A5110229601"],"corresponding_institution_ids":["https://openalex.org/I2799432993"],"apc_list":{"value":2190,"currency":"USD","value_usd":2190},"apc_paid":null,"fwci":1.3699,"has_fulltext":false,"cited_by_count":12,"citation_normalized_percentile":{"value":0.80670846,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":94},"biblio":{"volume":"42","issue":"3","first_page":"407","last_page":"416"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.9998000264167786,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.9998000264167786,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T14117","display_name":"Integrated Circuits and Semiconductor Failure Analysis","score":0.9930999875068665,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.9873999953269958,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.6864010095596313},{"id":"https://openalex.org/keywords/printed-circuit-board","display_name":"Printed circuit board","score":0.6384862065315247},{"id":"https://openalex.org/keywords/structural-engineering","display_name":"Structural engineering","score":0.5666363835334778},{"id":"https://openalex.org/keywords/soldering","display_name":"Soldering","score":0.5420961380004883},{"id":"https://openalex.org/keywords/composite-material","display_name":"Composite material","score":0.49578937888145447},{"id":"https://openalex.org/keywords/bending","display_name":"Bending","score":0.49160510301589966},{"id":"https://openalex.org/keywords/deflection","display_name":"Deflection (physics)","score":0.48540911078453064},{"id":"https://openalex.org/keywords/intermetallic","display_name":"Intermetallic","score":0.4733165502548218},{"id":"https://openalex.org/keywords/failure-mode-and-effects-analysis","display_name":"Failure mode and effects analysis","score":0.4455278813838959},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.20719465613365173}],"concepts":[{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.6864010095596313},{"id":"https://openalex.org/C120793396","wikidata":"https://www.wikidata.org/wiki/Q173350","display_name":"Printed circuit board","level":2,"score":0.6384862065315247},{"id":"https://openalex.org/C66938386","wikidata":"https://www.wikidata.org/wiki/Q633538","display_name":"Structural engineering","level":1,"score":0.5666363835334778},{"id":"https://openalex.org/C50296614","wikidata":"https://www.wikidata.org/wiki/Q211387","display_name":"Soldering","level":2,"score":0.5420961380004883},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.49578937888145447},{"id":"https://openalex.org/C87210426","wikidata":"https://www.wikidata.org/wiki/Q1072476","display_name":"Bending","level":2,"score":0.49160510301589966},{"id":"https://openalex.org/C2781355719","wikidata":"https://www.wikidata.org/wiki/Q2080698","display_name":"Deflection (physics)","level":2,"score":0.48540911078453064},{"id":"https://openalex.org/C27501479","wikidata":"https://www.wikidata.org/wiki/Q428069","display_name":"Intermetallic","level":3,"score":0.4733165502548218},{"id":"https://openalex.org/C66283442","wikidata":"https://www.wikidata.org/wiki/Q1389268","display_name":"Failure mode and effects analysis","level":2,"score":0.4455278813838959},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.20719465613365173},{"id":"https://openalex.org/C120665830","wikidata":"https://www.wikidata.org/wiki/Q14620","display_name":"Optics","level":1,"score":0.0},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.0},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.0},{"id":"https://openalex.org/C2780026712","wikidata":"https://www.wikidata.org/wiki/Q37756","display_name":"Alloy","level":2,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1016/s0026-2714(01)00241-4","is_oa":false,"landing_page_url":"https://doi.org/10.1016/s0026-2714(01)00241-4","pdf_url":null,"source":{"id":"https://openalex.org/S133646729","display_name":"Microelectronics Reliability","issn_l":"0026-2714","issn":["0026-2714","1872-941X"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310320990","host_organization_name":"Elsevier BV","host_organization_lineage":["https://openalex.org/P4310320990"],"host_organization_lineage_names":["Elsevier BV"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Microelectronics Reliability","raw_type":"journal-article"}],"best_oa_location":null,"sustainable_development_goals":[{"id":"https://metadata.un.org/sdg/12","display_name":"Responsible consumption and production","score":0.44999998807907104},{"id":"https://metadata.un.org/sdg/15","display_name":"Life in Land","score":0.4300000071525574}],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":13,"referenced_works":["https://openalex.org/W571002254","https://openalex.org/W1633693358","https://openalex.org/W1822430537","https://openalex.org/W1837700555","https://openalex.org/W1898742279","https://openalex.org/W2088929950","https://openalex.org/W2133314977","https://openalex.org/W2136437160","https://openalex.org/W2170798770","https://openalex.org/W2495573729","https://openalex.org/W2526163915","https://openalex.org/W4285719527","https://openalex.org/W6636826689"],"related_works":["https://openalex.org/W2076898426","https://openalex.org/W2070118610","https://openalex.org/W2745063064","https://openalex.org/W2079422425","https://openalex.org/W1635986310","https://openalex.org/W1634269331","https://openalex.org/W101095401","https://openalex.org/W2041333522","https://openalex.org/W2151533009","https://openalex.org/W2353288894"],"abstract_inverted_index":null,"counts_by_year":[{"year":2017,"cited_by_count":1},{"year":2014,"cited_by_count":1},{"year":2013,"cited_by_count":1}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}