{"id":"https://openalex.org/W1989228051","doi":"https://doi.org/10.1016/s0026-2714(01)00163-9","title":"Thermal fatigue in solder joints of Ag-Pd and Ag-Pt metallized LTCC modules","display_name":"Thermal fatigue in solder joints of Ag-Pd and Ag-Pt metallized LTCC modules","publication_year":2001,"publication_date":"2001-09-01","ids":{"openalex":"https://openalex.org/W1989228051","doi":"https://doi.org/10.1016/s0026-2714(01)00163-9","mag":"1989228051"},"language":"en","primary_location":{"id":"doi:10.1016/s0026-2714(01)00163-9","is_oa":false,"landing_page_url":"https://doi.org/10.1016/s0026-2714(01)00163-9","pdf_url":null,"source":{"id":"https://openalex.org/S133646729","display_name":"Microelectronics Reliability","issn_l":"0026-2714","issn":["0026-2714","1872-941X"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310320990","host_organization_name":"Elsevier BV","host_organization_lineage":["https://openalex.org/P4310320990"],"host_organization_lineage_names":["Elsevier BV"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Microelectronics Reliability","raw_type":"journal-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5033747725","display_name":"R. Rautioaho","orcid":null},"institutions":[{"id":"https://openalex.org/I98381234","display_name":"University of Oulu","ror":"https://ror.org/03yj89h83","country_code":"FI","type":"education","lineage":["https://openalex.org/I98381234"]}],"countries":["FI"],"is_corresponding":true,"raw_author_name":"R. Rautioaho","raw_affiliation_strings":["Materials Engineering Laboratory and EMPART Research Group of Infotech Oulu, P.O. B 4200, FIN 90014 University of Oulu, Finland"],"affiliations":[{"raw_affiliation_string":"Materials Engineering Laboratory and EMPART Research Group of Infotech Oulu, P.O. B 4200, FIN 90014 University of Oulu, Finland","institution_ids":["https://openalex.org/I98381234"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5050482342","display_name":"Olli Nousiainen","orcid":null},"institutions":[{"id":"https://openalex.org/I98381234","display_name":"University of Oulu","ror":"https://ror.org/03yj89h83","country_code":"FI","type":"education","lineage":["https://openalex.org/I98381234"]}],"countries":["FI"],"is_corresponding":false,"raw_author_name":"O. Nousiainen","raw_affiliation_strings":["Materials Engineering Laboratory and EMPART Research Group of Infotech Oulu, P.O. B 4200, FIN 90014 University of Oulu, Finland"],"affiliations":[{"raw_affiliation_string":"Materials Engineering Laboratory and EMPART Research Group of Infotech Oulu, P.O. B 4200, FIN 90014 University of Oulu, Finland","institution_ids":["https://openalex.org/I98381234"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5089902389","display_name":"S. Lepp\u00e4vuori","orcid":null},"institutions":[{"id":"https://openalex.org/I98381234","display_name":"University of Oulu","ror":"https://ror.org/03yj89h83","country_code":"FI","type":"education","lineage":["https://openalex.org/I98381234"]}],"countries":["FI"],"is_corresponding":false,"raw_author_name":"S. Lepp\u00e4vuori","raw_affiliation_strings":["Microelectronics Laboratory and EMPART Research Group of Infotech Oulu, P.O.B. 4500, FIN 90014 University of Oulu, Finland"],"affiliations":[{"raw_affiliation_string":"Microelectronics Laboratory and EMPART Research Group of Infotech Oulu, P.O.B. 4500, FIN 90014 University of Oulu, Finland","institution_ids":["https://openalex.org/I98381234"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5011078339","display_name":"Jaakko Lenkkeri","orcid":null},"institutions":[{"id":"https://openalex.org/I87653560","display_name":"VTT Technical Research Centre of Finland","ror":"https://ror.org/04b181w54","country_code":"FI","type":"nonprofit","lineage":["https://openalex.org/I4210089493","https://openalex.org/I87653560"]}],"countries":["FI"],"is_corresponding":false,"raw_author_name":"J. Lenkkeri","raw_affiliation_strings":["VTT Electronics, Kaitov\u00e4yl\u00e4 1, P.O.B. 1100, 90570 Oulu, Finland"],"affiliations":[{"raw_affiliation_string":"VTT Electronics, Kaitov\u00e4yl\u00e4 1, P.O.B. 1100, 90570 Oulu, Finland","institution_ids":["https://openalex.org/I87653560"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5002222248","display_name":"Tuomo Jaakola","orcid":null},"institutions":[{"id":"https://openalex.org/I87653560","display_name":"VTT Technical Research Centre of Finland","ror":"https://ror.org/04b181w54","country_code":"FI","type":"nonprofit","lineage":["https://openalex.org/I4210089493","https://openalex.org/I87653560"]}],"countries":["FI"],"is_corresponding":false,"raw_author_name":"T. Jaakola","raw_affiliation_strings":["VTT Electronics, Kaitov\u00e4yl\u00e4 1, P.O.B. 1100, 90570 Oulu, Finland"],"affiliations":[{"raw_affiliation_string":"VTT Electronics, Kaitov\u00e4yl\u00e4 1, P.O.B. 1100, 90570 Oulu, Finland","institution_ids":["https://openalex.org/I87653560"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":5,"corresponding_author_ids":["https://openalex.org/A5033747725"],"corresponding_institution_ids":["https://openalex.org/I98381234"],"apc_list":{"value":2190,"currency":"USD","value_usd":2190},"apc_paid":null,"fwci":0.0,"has_fulltext":false,"cited_by_count":13,"citation_normalized_percentile":{"value":0.08951,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":99},"biblio":{"volume":"41","issue":"9-10","first_page":"1643","last_page":"1648"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.9980999827384949,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.9980999827384949,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T13251","display_name":"Electrical and Thermal Properties of Materials","score":0.9958000183105469,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T14128","display_name":"Metallurgical and Alloy Processes","score":0.9876000285148621,"subfield":{"id":"https://openalex.org/subfields/2500","display_name":"General Materials Science"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/soldering","display_name":"Soldering","score":0.8838164806365967},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.6498419046401978},{"id":"https://openalex.org/keywords/thermal-fatigue","display_name":"Thermal fatigue","score":0.5374314188957214},{"id":"https://openalex.org/keywords/thermal","display_name":"Thermal","score":0.4309002459049225},{"id":"https://openalex.org/keywords/metallurgy","display_name":"Metallurgy","score":0.40891143679618835},{"id":"https://openalex.org/keywords/composite-material","display_name":"Composite material","score":0.3966027796268463},{"id":"https://openalex.org/keywords/physics","display_name":"Physics","score":0.06547272205352783}],"concepts":[{"id":"https://openalex.org/C50296614","wikidata":"https://www.wikidata.org/wiki/Q211387","display_name":"Soldering","level":2,"score":0.8838164806365967},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.6498419046401978},{"id":"https://openalex.org/C2984904865","wikidata":"https://www.wikidata.org/wiki/Q1425130","display_name":"Thermal fatigue","level":3,"score":0.5374314188957214},{"id":"https://openalex.org/C204530211","wikidata":"https://www.wikidata.org/wiki/Q752823","display_name":"Thermal","level":2,"score":0.4309002459049225},{"id":"https://openalex.org/C191897082","wikidata":"https://www.wikidata.org/wiki/Q11467","display_name":"Metallurgy","level":1,"score":0.40891143679618835},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.3966027796268463},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.06547272205352783},{"id":"https://openalex.org/C153294291","wikidata":"https://www.wikidata.org/wiki/Q25261","display_name":"Meteorology","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1016/s0026-2714(01)00163-9","is_oa":false,"landing_page_url":"https://doi.org/10.1016/s0026-2714(01)00163-9","pdf_url":null,"source":{"id":"https://openalex.org/S133646729","display_name":"Microelectronics Reliability","issn_l":"0026-2714","issn":["0026-2714","1872-941X"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310320990","host_organization_name":"Elsevier BV","host_organization_lineage":["https://openalex.org/P4310320990"],"host_organization_lineage_names":["Elsevier BV"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Microelectronics Reliability","raw_type":"journal-article"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":0,"referenced_works":[],"related_works":["https://openalex.org/W2080643270","https://openalex.org/W4250829799","https://openalex.org/W67310569","https://openalex.org/W2315296051","https://openalex.org/W2042605416","https://openalex.org/W2039193999","https://openalex.org/W4295037180","https://openalex.org/W2028566690","https://openalex.org/W2044368634","https://openalex.org/W2607229948"],"abstract_inverted_index":null,"counts_by_year":[{"year":2026,"cited_by_count":1},{"year":2017,"cited_by_count":1},{"year":2014,"cited_by_count":1}],"updated_date":"2026-03-31T07:56:22.981413","created_date":"2025-10-10T00:00:00"}